"0.4MM" BGA "BALL COLLAPSE" HEIGHT Search Results

"0.4MM" BGA "BALL COLLAPSE" HEIGHT Result Highlights (5)

Part	ECAD Model	Manufacturer	Description	Download	Buy
84501-001LF		Amphenol Communications Solutions	300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
55715-101LF		Amphenol Communications Solutions	81 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
84501-191LF		Amphenol Communications Solutions	300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free
74217-001		Amphenol Communications Solutions	240 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array
74217-101LF		Amphenol Communications Solutions	240 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free

"0.4MM" BGA "BALL COLLAPSE" HEIGHT Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
"0.4mm" bga "ball collapse" height Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320 Text: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller	Original	TMS320 TMS320C6x TMS320C6201 AN1231. "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231	PDF
"0.4mm" bga "ball collapse" height Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch Text: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of	Original	TMS320C6x SPRA429 AN1231. TMS320C6201 "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch	PDF
"0.4mm" bga "ball collapse" height Abstract: Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST Text: Application Report SPRAA99 – March 2008 nFBGA Packaging Robert Furtaw . ABSTRACT This application report gives you technical background on nFBGA packages and	Original	SPRAA99 "0.4mm" bga "ball collapse" height Modified Coffin-Manson Equation Calculations 65X65 nFBGA SN 29733 TEXAS INSTRUMENTS, Mold Compound, CSP 12x12 bga thermal resistance 385Z SPRAA99 72ZST	PDF
"0.4mm" bga "ball collapse" height Abstract: cga 624 ibm semi reflow temperature bga Text: A High Performance, Low Stress, Laminate Ball Grid Array Flip Chip Carrier D. J. Alcoe, T. E. Kindl, J. S. Kresge, J. P. Libous, C. L. Tytran-Palomaki, R. J. Stutzman IBM Corporation Endicott, New York Biography Dr. David J. Alcoe joined IBM in 1982 and is the	Original	w/2116 "0.4mm" bga "ball collapse" height cga 624 ibm semi reflow temperature bga	PDF
"0.4mm" bga "ball collapse" height Abstract: BGA PACKAGE thermal profile BGA reflow guide BGA and QFP Package 304 QFP amkor BGA and QFP Package ibm paste profile pitch 0.4mm BGA pcb warpage* in smt reflow Amkor SBGA Text: Applications Notes on Surface Mount Assembly of Amkor/Anam PBGA and SuperBGA Packages Paul Mescher October, 1995 amkor anam 1347 N. Alma School Road Chandler, AZ 85224 1.0 Introduction Ball Grid Array packages provide a new challenge for the surface mount industry. In all	Original		PDF
ALIVH Abstract: JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement Text: National Semiconductor Application Note 1412 June 9, 2009 Table of Contents Introduction . Package Construction .	Original	AN-1412 ALIVH JESD22-B111 national semiconductor pb-free marking AN-1412 B111 JESD22 gold embrittlement	PDF
PSE25201B-2R2MS Abstract: 1239AS-H-2R2M PSE25201B TFM201610 "0.4mm" bga "ball collapse" height TFM201610A2R2M TFM201610A-2R2M PSE25201 1286AS-H-2R2M JESD22-A114F free Text: Low Input Voltage and High Efficiency Synchronous Boost Converter with 1.3A Switch ISL9113 Features The ISL9113 provides a power supply solution for devices powered by three-cell alkaline, NiCd, NiMH, or one-cell Li-Ion/Li-Polymer batteries. It offers either a fixed 5V or an	Original	ISL9113 ISL9113 500mA ligh240 SPP-010. com/data/tb/tb451 FN8313 PSE25201B-2R2MS 1239AS-H-2R2M PSE25201B TFM201610 "0.4mm" bga "ball collapse" height TFM201610A2R2M TFM201610A-2R2M PSE25201 1286AS-H-2R2M JESD22-A114F free	PDF
msi 7267 MOTHERBOARD SERVICE MANUAL Abstract: ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram "0.4mm" bga "ball collapse" height PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C smd TRANSISTOR code marking A7 terminals diagram of smd transistor bo2 cookbook for ic 555 Text: GTL/GTLP Logic High-Performance Backplane Drivers Data Book Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments and its subsidiaries TI reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information	Original	GDFP1-F48 -146AA GDFP1-F56 -146AB msi 7267 MOTHERBOARD SERVICE MANUAL ttl cookbook msi ms 7267 MOTHERBOARD CIRCUIT diagram "0.4mm" bga "ball collapse" height PCF 799 crystal oscillator 8MHz 4 pins smd diode MARKING F5 44C smd TRANSISTOR code marking A7 terminals diagram of smd transistor bo2 cookbook for ic 555	PDF