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    0.5MM PITCH BGA Search Results

    0.5MM PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    0.5MM PITCH BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    0.3mm pitch BGA

    Abstract: 34X34 1mm pitch BGA SF-BGA680B-B-11
    Text: C D Ø 0.0156" 2x (Tooling Hole) See BGA pattern code to the right for actual pattern layout Y 33mm X Top View (reference only) 1mm [0.039"] pitch typ. 0.508 mm [0.020"] dia pads 0.3mm [0.012"] dia. 2 8.69mm [0.342"] 6.85mm [0.270"] 0.5mm 0.5mm 33mm B 1


    Original     		PDF FR4/G10 34X34 SF-BGA680B-B-11 SF-BGA-680B-B-11 0.3mm pitch BGA 34X34 1mm pitch BGA

    04-6288-015-000-846

    Abstract: 973-120 04 6288 040 000 846 HT 1200-4 smd samtec QTH series 04-6288-055-000-846 QTH-060-01-L-D-A 8 pin 2x4, 1mm pitch dil header connectors CLM-105-02-L-D LED Strip SMD 5050
    Text: 1625 Technical portal and online community for Design Engineers - www.element-14.com Connectors - PCB Page 0.2mm - 0.4mm Pitch FFC/FPC Connectors . . 0.4mm - 0.64mm Pitch SMT . . . . . . . . . . . . . . . . 0.5mm Pitch FFC/FPC Connectors . . . . . . . . . .


    Original     		PDF element-14 element14. element14, element14 04-6288-015-000-846 973-120 04 6288 040 000 846 HT 1200-4 smd samtec QTH series 04-6288-055-000-846 QTH-060-01-L-D-A 8 pin 2x4, 1mm pitch dil header connectors CLM-105-02-L-D LED Strip SMD 5050

    XC95XX

    Abstract: BGA95 sb 1240
    Text: 1.400" Top View 0.100" 1.350" 1.350" 1.240" 0.5mm Pitch Relative Orientations BGA Pin A1 Side View 1 QFP Pin 1 0.477" 3 0.6" Assembled 2 0.293" Removable Alignment Pins Description: PACKAGE CONVERTER 208 position PQFP to 352 position BGA. Altera Max 9320 to Xilinx XC95XX.


    Original     		PDF XC95XX. FR4/G10 finish10µ DC-QFP/BGA-95XX-S-B-01 XC95XX BGA95 sb 1240

    0.3mm pitch BGA

    Abstract: micro pitch BGA SF-BGA292D-B-11 1mm pitch BGA BGA 20x20
    Text: C BGA292D D Ø 0.396mm x2 See BGA pattern code to the right for actual pattern layout Y (optional alignment hole) 1mm pitch typ. 19mm X Top View (reference only) Ø 0.508mm pad 3.48mm [0.137"] 2 0.5mm 0.3mm [0.012"] dia. 5.32mm [0.210"] 0.635mm 19mm B 1


    Original     		PDF BGA292D 396mm 508mm 635mm FR4/G10 20X20 488mm SF-BGA292D-B-11 0.3mm pitch BGA micro pitch BGA 1mm pitch BGA BGA 20x20

    DIODE smd marking 22-16

    Abstract: vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621
    Text: Micro SMD Qualification Package LM358, LMC6035, LM431, LM78L05, and LMC555 National’s Micro SMD – The Obvious Answer For Portable Applications Standard Surface Mount Packages vs. Micro SMD Micro SMD Package • 0.5mm Bump Pitch • 0.9mm Max Package Height


    Original     		PDF LM358, LMC6035, LM431, LM78L05, LMC555 OT23-5 DIODE smd marking 22-16 vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621

    BGA and QFP Package ibm

    Abstract: No abstract text available
    Text: W19 0.5mm pitch ±0.17mm from true position 22.86mm A19 1.27mm 42.6mm 39.6mm A1 W1 Top View 1 Detail A Side View 2 Detail A 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Leads: material- BeCu Alloy 194; plating- 80/20 SnPb.


    Original     		PDF FR4/G10 PC-BGA/QFP-ALDC-G-01 BGA and QFP Package ibm

    FR4 substrate

    Abstract: No abstract text available
    Text: fBGA96T.5-DC144 TM BALLS PITCH 96 0.5mm SIZE MATRIX ROWS MAT’L CENTER TEL 1-714-898-3830 [email protected] 8mm SQ 14 x 14 BALL VIEW 2 none Flex Polyimide BOTTOM SIDE TOP X-RAY VIEW 14 13 12 11 10 9 8 7 6 5 4 3 2 1 1 2 3 A B C D E C D E F G F G H J K L M


    Original     		PDF fBGA96T 5-DC144 FR4 substrate

    1mm pitch BGA socket

    Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
    Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)


    Original     		PDF MIL-STD202, 1mm pitch BGA socket thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO

    M1489

    Abstract: M2423 socket 6.3mm BGA Package 14x14 m1489 a1 M1145 180C M1146 14x14 PCB 6.3mm Socket
    Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features • • • • 10 9 Wide temperature range -55C to +180C High current capability (up to 8A) Excellent signal integrity at high frequencies Low and stable contact resistance for reliable


    Original     		PDF M2423 P8369A P8370A P8371A R2613 14x14 SBT-BGA-7003 SBT-BGA-7003 M1489 M2423 socket 6.3mm BGA Package 14x14 m1489 a1 M1145 180C M1146 PCB 6.3mm Socket

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		PDF AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    7075-T6 aluminum

    Abstract: 7075-T6 high current pogo pin aluminium 7075 180C SBT-BGA-7000 high current high temperature pogo pin
    Text: SBT-BGA DIRECT MOUNT, SOLDERLESS SOCKET FOR BURN-IN AND TEST APPLICATIONS Features 10 14 9 7 8 6 • • • • • • 5 13 12 4 15 3 1 2 11 Primary dimension units are millimeters, Secondary dimension units are [inches]. Tolerances: diameters ±0.03mm [±0.001"], PCB perimeters ±0.13mm [±0.005"], PCB thicknesses ±0.18mm [±0.007"], pitches from true position


    Original     		PDF 7075-T6 SBT-BGA-7000 7075-T6 aluminum high current pogo pin aluminium 7075 180C high current high temperature pogo pin

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    BGA and QFP Package ibm

    Abstract: SN63 PB37 w19 transistor SN63
    Text: Top View 0.200" 229 QFP1 Tooling holes W19 A19 0.900" 1.502" 0.050" 1.726" 1.596" 0.200" 0.025" BGA PAD Detail A 0.060" 0.007" W1 A1 0.012" All dimensions ±0.003" 153 77 Side View 0.041" compatible target board land dimensions A< 1.596" B> 1.721" 1 Detail A


    Original     		PDF FR4/G10 PC-BGA/QFP-ALDC-F-01 BGA and QFP Package ibm SN63 PB37 w19 transistor SN63

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    TR6878

    Abstract: fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576
    Text: Packaging 11 fujitsu-fme.com FUJITSU MICROELECTRONICS EUROPE www.fujitsu www.fujitsu fme.com ASIC PACKAGE FAMILY 22 < FC-BGA : Electrical & Thermal-enhanced Solution with >1000-pin < TAB-BGA : Fine-pitch Bonding Solution < EBGA : Electrical & thermal-enhanced Solution


    Original     		PDF 1000-pin FDH-BGA352 15MHz) TR6878 H1/1999 fcBGA PACKAGE thermal resistance EBGA672 FCBGA-160 BGA PACKAGE thermal profile FR4 GLASS EPOXY stiffener fbga 12 x 12 thermal resistance BGA-560P-M01 fine BGA thermal profile BGA-576

    SH7724

    Abstract: emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239
    Text: SuperH platform brochure SH-2/SH-2A microcontrollers SH-3/SH-4A microprocessors www.renesas.eu Introduction About Renesas Electronics Corporation Renesas Electronics Corporation TSE: 6723 , the world’s number one supplier of microcontrollers, is a premier supplier of advanced


    Original     		PDF 32-bit 19-069F SH7724 emmc market trend BGA 441 R5S72620W144FP R5F72146BDFA R8A77240 R5F72167ADFA R5F72145BDFP R5F72165BDFP SH7239

    EIA-364 65A

    Abstract: lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance
    Text: 0.5 mm LGA/BGA Sockets DESCRIPTION Tyco Electronics’ polymer interconnect technology optimizes socketing of 0.5 mm pitch LGA or BGA devices. This highly conductive polymer contact provides electrically transparent signal transfer. APPLICATIONS • • •


    Original     		PDF 8-1773444-1-CC LH-PDF-07/06 EIA-364 65A lga components LGA resistance EIA-364-65A 0.5mm pitch BGA EIA-364-27 EIA-364-28 EIA-364-31 EIA-364-32 LGA PACKAGE thermal resistance

    Untitled

    Abstract: No abstract text available
    Text: HIGH FREQUENCY SPRING PROBE TEST SOCKET FOR 0.5mm thru 0.8mm BGA FEATURES: • Solderless double-ended spring probes pressure mount to the test board and device solderball or pad. • Only .150” 3.81mm signal path. • Very low inductance and capacitance.


    Original     		PDF

    MB9BF524KPMC

    Abstract: MB9BF524K MB9BF522LPMC1 MB9BF522L 5-22K MB9BF524M MB9BF524L MB9B520M MB9BF524MPMC1 MB9BF522K
    Text: FUJITSU SEMICONDUCTOR FACT SHEET NP706-00032-0v01-E 32-bit Microcontrollers FM3 Family MB9B520M Series MB9B520M series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with low power consumption and competitive cost. MB9B520M series are based on the ARM Cortex-M3 Processor with Flash memory and SRAM,


    Original     		PDF NP706-00032-0v01-E 32-bit MB9B520M 32bit frequency72MHz 521K/L/M 522K/L/M MB9BF524KPMC MB9BF524K MB9BF522LPMC1 MB9BF522L 5-22K MB9BF524M MB9BF524L MB9BF524MPMC1 MB9BF522K

    LCMXO2-1200

    Abstract: CEL-9750ZHF CEL-9750ZHF10
    Text: MachXO2 Product Family Qualification Summary Lattice Document # 25 – 106923 July 2013 Lattice Semiconductor Corporation Doc. #25-106923 Rev. G 1 Dear Customer, Enclosed is Lattice Semiconductor‟s MachXO2 Product Family Qualification Report. This report was created to assist you in the decision making process of selecting and using our products. The


    Original     		PDF LCMXO2-1200-25WLCSP LCMXO2-1200 CEL-9750ZHF CEL-9750ZHF10

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00002-0v01-E 32-bit Microcontrollers FM4 Family MB9B460R Series MB9B460R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B460R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has


    Original     		PDF NP709-00002-0v01-E 32-bit MB9B460R 32bit 467M/N/R 468M/N/R 1024K

    MB9B320M

    Abstract: MB9BF321KPMC MB9BF321K 321M MB9BF322M MB9BF324MBGL keil MB9BF322K MB9BF324L MB9BF324M
    Text: FUJITSU SEMICONDUCTOR FACT SHEET NP706-00033-0v01-E 32-bit Microcontrollers FM3 Family MB9B320M Series MB9B320M series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with low power consumption and competitive cost. MB9B320M series are based on the ARM Cortex-M3 Processor with Flash memory and SRAM,


    Original     		PDF NP706-00033-0v01-E 32-bit MB9B320M 32bit frequency72MHz 321K/L/M 322K/L/M MB9BF321KPMC MB9BF321K 321M MB9BF322M MB9BF324MBGL keil MB9BF322K MB9BF324L MB9BF324M

    Cortex-M4F

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00003-0v01-E 32-bit Microcontrollers FM4 Family MB9B360R Series MB9B360R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B360R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has


    Original     		PDF NP709-00003-0v01-E 32-bit MB9B360R 32bit 367M/N/R 368M/N/R 1024K Cortex-M4F