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    0.65MM PITCH BGA Search Results

    0.65MM PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10118309-015LF Amphenol Communications Solutions Assembly, Top Mount, Short Body 65mm, S/D(68Pins), R/A, 3.3V, 1.5mm s/o, non-Eject, Low Cost Version, HF version Visit Amphenol Communications Solutions
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    0.65MM PITCH BGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    0.65mm pitch BGA

    Abstract: ASTM-B-488 C17200
    Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance


    Original     		ASTM-B-488 QQ-N-290 MICROBGA-TECH09 0.65mm pitch BGA ASTM-B-488 C17200 PDF

    Socket T for LGA

    Abstract: No abstract text available
    Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the


    Original     		63Sn/37Pb ASTM-B-488 QQ-N-290 BGA050-TECH07 Socket T for LGA PDF

    0.65mm pitch BGA

    Abstract: No abstract text available
    Text: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This new BGA Socket Adapter System from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in an interstitial pattern – offering the


    Original     		63Sn/37Pb ASTM-B-488 QQ-N-290 BGA050-TECH07 0.65mm pitch BGA PDF

    Socket T for LGA

    Abstract: 0.65mm pitch BGA socket
    Text: BGA Socket Adapter System Fine Pitch BGA Socket Adapter System 0.50mm and 0.65mm Pitch Table of Models Features: • Advanced’s field-proven screwmachined terminals with multifinger contacts, arranged in an interstitial male/female pin pattern are gold plated for gold/gold


    Original     		PDF

    0.65mm pitch BGA

    Abstract: OMAP35x
    Text: Application Report SPRAAV6B – June 2008 OMAP35x 0.65mm Pitch Layout Methods Keven Coates . ABSTRACT It is easy to see from the unique look that the OMAP35x parts have a very unusual


    Original     		OMAP35x 0.65mm pitch BGA PDF

    BGA 15X15

    Abstract: No abstract text available
    Text: Daisy Chain Package Design 15mm, 321 MAP BGA, 0.65mm Pitch 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 A B C D E F G H * 0.65 mm Pitch * 21x21 Array * 9 Thermal Balls * 15x15 mm Body Size * 0.3 mm Solder Ball Diameter J K L M N P R T U V W Y AA Slide 1


    Original     		21x21 15x15 BGA 15X15 PDF

    48 ball VFBGA

    Abstract: 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET 48-PIN 56-PIN ALVCH16373 LVCH16244A
    Text: Application Report SZZA029B - May 2002 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch, Very Thin Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT TI’s 56-ball MicroStar Jr. package, registered under JEDEC MO-225, has demonstrated


    Original     		SZZA029B 16-Bit 56-Ball, 65-mm 56-ball MO-225, 48-pin 56-pin 48 ball VFBGA 90 ball VFBGA LVTH162 micro pitch BGA tSSOP 56 socket TSSOP YAMAICHI SOCKET ALVCH16373 LVCH16244A PDF

    LV 1084 73

    Abstract: LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245
    Text: Application Report SZZA028A - November 2001 8-Bit Linear and Logic Families in 20-Ball, 0.65-mm Pitch, Very-Thin, Fine-Pitch BGA VFBGA Packages Frank Mortan and Mark Frimann Standard Linear & Logic ABSTRACT Texas Instruments 20-ball MicroStar Jr. package is a standardized JEDEC VFBGA


    Original     		SZZA028A 20-Ball, 65-mm 20-ball LV 1084 73 LV 373A BGA PACKAGE thermal profile LV 1084 land pattern for tvSOP 90 ball VFBGA micro pitch BGA VA244 VFBGA LVTH2245 PDF

    SF-PLCC84-J-01

    Abstract: PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket
    Text: Ironwood Electronics Surface Mount Package Emulation SF.1 Ironwood has developed the industry's widest range of interconnection adapters for testing and socketing of surface mount technology. We offer SMT bases and thru-hole adapters for BGA, PLCC, QFP, and SOIC packages.


    Original     		SK-UGA12/48A-01 SK-MGA12/48A-01 SK-MGA10/48A-01 SK-MGA13/50B-01 SK-MGA12/56A-01 SK-MGA14/56A-01 SK-MGA12/56B-01 SF-PLCC84-J-01 PL-PLCC68-S-01 SO8A SF-PLCC44-J-01 SF-PLCC28-J-01 SF-QFE128SD-K-01 PL-PLCC68-T-01 sf 128 transistor SF 127 PLCC32 through hole socket PDF

    PA-PGA181-02W

    Abstract: PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01
    Text: Ironwood Electronics PA.1 Prototyping Adapters Ironwood has developed over one thousand prototyping adapter designs, supporting CSP, BGA, QFP, SOIC, PGA, PLCC, QIP, and DIP packages for most popular prototyping panels and PGA DUT interfaces. We also offer adapters for


    Original     		12X12mm. FR4/G10 PA-PGA181-02W PA-SO42-S-01 actel 14100 BGA169C PA-PGA68-01 ax 6001 mp3 PA-QIP90-01 PA-PLCC84-02 intel 82310 PA-PGA301-01 PDF

    LPC2468 reflow solder profile

    Abstract: 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross
    Text: AN10778 PCB layout guidelines for NXP MCUs in BGA packages Rev. 01 — 22 January 2009 Application note Document information Info Content Keywords LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2888, LPC3130, LPC3131, LPC3151, LPC3152, LPC3153, LPC3154, LPC3180/10, LPC3220,


    Original     		AN10778 LPC2220, LPC2292, LPC2364, LPC2368, LPC2458, LPC2468, LPC2470, LPC2478, LPC2880, LPC2468 reflow solder profile 0.65mm pitch BGA 1mm pitch BGA AN10778 MO-275 TFBGA208 LFBGA32 LPC2468 pcb SOT1018-1 nxp cross PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 PDF

    socket Yamaichi IC299

    Abstract: 0.65mm pitch BGA socket yamaichi IC Test Socket IC299-08048 IC299-12859 qfn YAMAICHI SOCKET
    Text: Test Contactors IC299 Series IC299- 100 30 Design No. Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: NOTE: High speed / low inductance QFP and SOP’s. Insulator: Contact: Plating: Socket Series No. of Leads Characteristics


    Original     		IC299 IC299- 000Mminimum 10mA/20mV ele00 8965mm 9035mm socket Yamaichi IC299 0.65mm pitch BGA socket yamaichi IC Test Socket IC299-08048 IC299-12859 qfn YAMAICHI SOCKET PDF

    Untitled

    Abstract: No abstract text available
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    BGA 731

    Abstract: 0.65mm pitch BGA bga thermal cycling reliability ASTM-B-488 C17200
    Text: BGA Adapters Ball Grid Array BGA Adapters For use with BGA Sockets on pages 8-9 Table of Models Features: • Soldering BGA Device to adapter subjects BGA to less thermal stress than soldering BGA directly to a PCB due to the adapter’s lower mass. Description: Standard Adapter (A)


    Original     		PDF

    IC 7142

    Abstract: SG-BGA-7142 0.65mm pitch BGA
    Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 21.225mm Ball guide prevents over compression of elastomer


    Original     		225mm 5M-1994. 16x22 SG-BGA-7142 IC 7142 0.65mm pitch BGA PDF

    Untitled

    Abstract: No abstract text available
    Text: Package Lineup Package Lineup The packages are classified as follows, according to form, material, and the mounting methods for which they are suited. Packages TÍ Vertical type, Single lead Lead inserted type SIP ZIP Horizontal type,” Double lead — Matrix type


    OCR Scan     		PDF

    TSOP to SOIC BGA Adapter Modules

    Abstract: No abstract text available
    Text: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection


    Original     		AKB243237 AKB203237 AKB163220 AKB143227 TSOP to SOIC BGA Adapter Modules PDF

    Untitled

    Abstract: No abstract text available
    Text: Thin Small Outline Packages TSOP to SOIC BGA Adapters ACCUTEK MICROCIRCUIT CORPORATION TSOP to SOIC BGA ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description The Accutek family of SOIC Adapter Modules permit the connection


    Original     		AKB283237 AKB243237 AKB203237 AKB203227 PDF

    0.65mm pitch BGA

    Abstract: 0.35mm pitch BGA BGA Solder Ball 0.35mm .65mm bga land pattern BGA 0.35mm pitch bga socket bpw 50 0.35mm BGA 202 ball bga
    Text: Ball / Land Grid Array Sockets EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Screw Lock Type E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following


    Original     		PDF

    Cortex-M4F

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00003-0v01-E 32-bit Microcontrollers FM4 Family MB9B360R Series MB9B360R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B360R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has


    Original     		NP709-00003-0v01-E 32-bit MB9B360R 32bit 367M/N/R 368M/N/R 1024K Cortex-M4F PDF

    au38

    Abstract: ae38 diode ae38 Aj36 G37 IC AJ-38 satellite a75 AH36 n38 transistor MB2198-10
    Text: FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01-71060-1E DSU-FR EMULATOR LQFP-64P HEADER TYPE 2 MB2198-304 OPERATION MANUAL PREFACE Thank you for purchasing the LQFP-64P*1 header type 2 MB2198-304 for the DSU-FR emulator. This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198300)*2 to connect the DSU-FR emulator (MB2198-01)*3 and DSU-FR cable (MB2198-10)*4 to a


    Original     		SS01-71060-1E LQFP-64P MB2198-304 MB2198-304) BGA-660P MB2198300) MB2198-01) MB2198-10) MB91460 au38 ae38 diode ae38 Aj36 G37 IC AJ-38 satellite a75 AH36 n38 transistor MB2198-10 PDF

    Untitled

    Abstract: No abstract text available
    Text: FUJITSU SEMICONDUCTOR FACT SHEET NP709-00002-0v01-E 32-bit Microcontrollers FM4 Family MB9B460R Series MB9B460R series are highly integrated 32-bit microcontrollers dedicated for embedded controllers with high-performance and competitive cost. MB9B460R series are based on the ARM Cortex-M4F Processor with Flash memory and SRAM, and has


    Original     		NP709-00002-0v01-E 32-bit MB9B460R 32bit 467M/N/R 468M/N/R 1024K PDF

    Untitled

    Abstract: No abstract text available
    Text: IC274 Series IC274-1S1 202 • l i I I . .r .-. — C haracteristics ^ — Socket Series No. of Leads [— Insulation Resistance: Withstanding Voltage: 1,000MQminimum at 500 VDC 500 VAC for 1 Minute Contact Resistance: Operating Temperature: 30mQ max. at 10mA/20mV (Initial)


    OCR Scan     		IC274 IC274-1S1 000MQminimum 10mA/20mV IC274-048126 IC274-048170 IC274-052203 IC274-060146 IC274-06447 IC274-068190 PDF