Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    1.0MM PITCH BGA Search Results

    1.0MM PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MPC860PZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860PVR80D4 Rochester Electronics LLC 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC855TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860TCZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy
    MPC860ENZQ50D4 Rochester Electronics LLC 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 Visit Rochester Electronics LLC Buy

    1.0MM PITCH BGA Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    1mm pitch BGA socket

    Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
    Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)


    Original     		PDF MIL-STD202, 1mm pitch BGA socket thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO

    TEXTOOL

    Abstract: land pattern BGA 0,50 3M 2380
    Text: 3M Textool, 1.0mm pitch, Lidded, BGA Test & Burn-In Sockets Type I, II, III • Highly reliable contact that allows for normal variation in BGA ball-diameter and position. • Low spring-rate design achieves minimal solder ball deformation while allowing up to a 0.2mm


    Original     		PDF TS-9100-06 TEXTOOL land pattern BGA 0,50 3M 2380

    Untitled

    Abstract: No abstract text available
    Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply


    Original     		PDF AS4DDR32M72PBG1 32Mx72 333Mbps 23mm-1 208-PBGA

    AS4DDR32M72PBG

    Abstract: No abstract text available
    Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply


    Original     		PDF AS4DDR32M72PBG1 32Mx72 333Mbps 23mm-1 AS4DDR32M72PBG

    Untitled

    Abstract: No abstract text available
    Text: iPEM 2.4Gb SDRAM-DDR AS4DDR32M72PBG1 32Mx72 DDR SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR SDRAM Data Rate = 200, 250, 266, 333Mbps Package: • 208 Plastic Ball Grid Array PBGA , 16 x 23mm-1.0mm pitch 2.5V ±0.2V core power supply


    Original     		PDF AS4DDR32M72PBG1 32Mx72 333Mbps 23mm-1 208-PBGA

    Untitled

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „


    Original     		PDF W3H64M64E-XSBX 667Mbs

    W3H64M64E

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Data rate = 667, 533, 400 „ Write latency = Read latency - 1* tCK „ Package: „ Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch „


    Original     		PDF W3H64M64E-XSBX 667Mbs W3H64M64E

    18CO

    Abstract: No abstract text available
    Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 64 • 1.0mm pitch


    Original     		PDF W3H64M64E-XSBX 18CO

    84 FBGA

    Abstract: IPC17 FBGA-84
    Text: W3H64M72E-XSBX W3H64M72E-XSBXF White Electronic Designs 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm  Organized as 64M x 72 • 1.0mm pitch


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBXF W3H64M72E-XSBXF SN63Pb37 SAC305 84 FBGA IPC17 FBGA-84

    CEE 32

    Abstract: W3H32M64E-XSBX
    Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES  Data rate = 667, 533, 400 Mb/s  Package: • 208 Plastic Ball Grid Array PBGA , 16 x 20mm • 1.0mm pitch  Commercial, Industrial and Military Temperature


    Original     		PDF W3H32M64E-XSBX W3H32M64E-XSBX 32M64. CEE 32

    Wells-CTI

    Abstract: 8109-064-1E-0X 8113B064A1E-0X wells-cti 672 811725 wells 28919X 8722a 8127-676-1E-0X 811514
    Text: Burn-In Test Sockets Series 8100 VABGA Sockets • • • • • • • Open top, Vertically Actuated Ball Grid Array Accommodates 1.0mm pitch package Proven, low force, high pressure “spoon” contacts Contacts are independent of one another Two points of contact per solder ball


    Original     		PDF 22x14) Wells-CTI 8109-064-1E-0X 8113B064A1E-0X wells-cti 672 811725 wells 28919X 8722a 8127-676-1E-0X 811514

    84 FBGA

    Abstract: W3H64M72E-XSBX fbga84 ccd400
    Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES „ Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm „ Organized as 64M x 72 • 1.0mm pitch „ Weight: W3H64M72E-XSBX - 2.5 grams typical


    Original     		PDF W3H64M72E-XSBX W3H64M72E-XSBX 84 FBGA fbga84 ccd400

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    Untitled

    Abstract: No abstract text available
    Text: Ball Grid Array BGA Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com Now Available In 0.75mm Pitch Standard Socket (S) • Mates with Standard Adapter (A)


    Original     		PDF

    pitch 0.75mm BGA

    Abstract: No abstract text available
    Text: Ball Grid Array BGA Adapters 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com Standard Adapter (A) Now Available In 0.75mm Pitch • Mates with Standard Socket (S)


    Original     		PDF wit75 pitch 0.75mm BGA

    BGA reflow guide

    Abstract: pitch 0.75mm BGA 1024 ball bga
    Text: Ball Grid Array BGA Adapters 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com BGA Adapters Standard Adapter (A): Extraction Slot Adapter (AX):


    Original     		PDF

    eutectic 157

    Abstract: No abstract text available
    Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LGA/BGA SMT Adapter 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter BEFORE BEFORE


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: LGA/BGA SMT Adapter 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com LGA/BGA SMT Adapter Typical Applications LGA Adapter De-balled BGA Adapter


    Original     		PDF C36000) ASTM-B-16 63Sn/37Pb

    Untitled

    Abstract: No abstract text available
    Text: Press Releases CYPRESS INTRODUCES DUAL-PORTS IN BGA PACKAGES 7.2 Gbps FLEx36 Housed in Manufacturing-Friendly 1.0-mm Lead Pitch BGA SAN JOSE, Calif., November 5, 1999 - Cypress Semiconductor Corp. NYSE:CY today announced that the four members of the FLEx36 family of x36 dual-port SRAMs will be offered in 172-ball, 15 mm x


    Original     		PDF FLEx36 172-ball,

    Untitled

    Abstract: No abstract text available
    Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Website: www.bgasockets.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB


    Original     		PDF 63Sn/37Pb BGA-TECH04

    diode b6 k 450

    Abstract: CTS RESISTOR NETWORK F-120 RT1400B6 RT1401B6 RT1402B6 RT1403B6 RT1404B6 RT1405B6 SSTL-2
    Text: DDR SDRAM Terminator Technical Data Features • 18 Bit SSTL_2 Termination Sets • Compliant to JEDEC Std. 8-9A • Excellent high frequency performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel Capacitance Description This SSTL_2 terminator network provides high


    Original     		PDF RT1404B6 RT1402B6 RT1404B7 RT1402B7 200ppm/ diode b6 k 450 CTS RESISTOR NETWORK F-120 RT1400B6 RT1401B6 RT1402B6 RT1403B6 RT1404B6 RT1405B6 SSTL-2

    Untitled

    Abstract: No abstract text available
    Text: DDR SDRAM Terminator Technical Data Features • 18 Bit SSTL_2 Termination Sets • Compliant to JEDEC Std. 8-9A • Excellent high frequency performance • Slim BGA Package • 1% Resistor Tolerance • Low Channel Capacitance Description This SSTL_2 terminator network provides high


    Original     		PDF RT1404 RT1402 RT1404B6 RT1402B6 RT1404B7 RT1402B7 200ppm/

    bail

    Abstract: No abstract text available
    Text: I ADVANCED Ball Grid Array BGA Sockets » INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, Rl 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@ advintcorp.com • Internet http://www.advintcorp.com Standard S ocket (S):


    OCR Scan     		PDF 63Sn/37Pb, bail