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    Untitled

    Abstract: No abstract text available
    Text: TEMD5120 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5120 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area and an infrared bandpass filter matched to IR


    Original
    TEMD5120 TEMD5120 J-STD-20) 2000/53/EC, 2002/95/EC 2002/96/EC 08-Apr-05 PDF

    Si4310DY

    Abstract: No abstract text available
    Text: SPICE Device Model Si4310DY Vishay Siliconix Dual N-Channel 30-V D-S MOSFET with Schottky Diode CHARACTERISTICS • N-Channel Vertical DMOS • Macro Model (Subcircuit Model) • Level 3 MOS • Apply for both Linear and Switching Application • Accurate over the −55 to 125°C Temperature Range


    Original
    Si4310DY 18-Jul-08 PDF

    sn 8406

    Abstract: No abstract text available
    Text: TEMD5020 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5020 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area, detecting visible and near infrared radiation.


    Original
    TEMD5020 TEMD5020 J-STD-20) 2000/53/EC, 2002/95/EC 2002/96/EC D-74025 12-Aug-05 sn 8406 PDF

    Untitled

    Abstract: No abstract text available
    Text: TEMD5020 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5020 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area, detecting visible and near infrared radiation.


    Original
    TEMD5020 TEMD5020 J-STD-20) 2000/53/EC, 2002/95/EC 2002/96/EC 08-Apr-05 PDF

    CH1155

    Abstract: Si4310DY
    Text: SPICE Device Model Si4310DY Vishay Siliconix Dual N-Channel 30-V D-S MOSFET with Schottky Diode CHARACTERISTICS • N-Channel Vertical DMOS • Macro Model (Subcircuit Model) • Level 3 MOS • Apply for both Linear and Switching Application • Accurate over the −55 to 125°C Temperature Range


    Original
    Si4310DY S-51868Rev. 12-Aug-05 CH1155 PDF

    Untitled

    Abstract: No abstract text available
    Text: TEMD5120 Vishay Semiconductors Silicon PIN Photodiode Description TEMD5120 is a high speed and high sensitive PIN photodiode. It is a miniature Surface Mount Device SMD including the chip with a 4.4 mm2 sensitive area and an infrared bandpass filter matched to IR


    Original
    TEMD5120 TEMD5120 J-STD-20) 2000/53/EC, 2002/95/EC 2002/96/EC D-74025 12-Aug-05 PDF

    DO214BA

    Abstract: DO-214BA DO-214B do214ba general semiconductor
    Text: EGF1T New Product Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier Major Ratings and Characteristics IF AV 1.0 A VRRM 1300 V IFSM 20 A trr 75 ns EAS 15 mJ Tj max. 150 °C d* e t n Pate * Glass-plastic encapsulation technique is covered by patent


    Original
    DO-214BA MIL-S-19500 J-STD-020C DO-214B0 12-Aug-05 DO214BA DO-214BA DO-214B do214ba general semiconductor PDF

    293D

    Abstract: No abstract text available
    Text: 293D Vishay Sprague Solid Tantalum Chip Capacitors TANTAMOUNT , Commercial, Surface Mount FEATURES • • • • • • PERFORMANCE/ELECTRICAL CHARACTERISTICS Operating Temperature: - 55 °C to + 85 °C. To + 125 °C with voltage derating. Capacitance Range: 0.10 µF to 680 µF.


    Original
    QC300801/US0001 535BAAC. EIA-481-1. 12-Aug-05 293D PDF

    BZM55B

    Abstract: BZM55C
    Text: BZM55C Series Surface Mount Zener Diodes P b Lead Pb -Free SMALL SIGNAL ZENER DIODES Features: *500mw Power Dissipation *General Purpose *Ideal for Surface Mountted Application 0.5 WATTS Mechanical Data: *Case : MICRO-MELF Glass Case *Weight : Approx 0.01g


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    BZM55C 500mw 12-Aug-05 RJA300 500mW 15-Aug-05 BZM55B PDF

    DO-214BA

    Abstract: EGF1t DO214BA 214BA JESD22-B102D J-STD-002B
    Text: EGF1T New Product Vishay General Semiconductor Surface Mount Glass Passivated Ultrafast Rectifier Major Ratings and Characteristics IF AV 1.0 A VRRM 1300 V IFSM 20 A trr 75 ns EAS 15 mJ Tj max. 150 °C d* e t n Pate * Glass-plastic encapsulation technique is covered by patent


    Original
    DO-214BA DO-214BA, UL-94V-0 J-STD-002B JESD22-B102D 08-Apr-05 DO-214BA EGF1t DO214BA 214BA JESD22-B102D PDF

    Untitled

    Abstract: No abstract text available
    Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. ALL RIGHTS RESERVED. LOC DIST CM 53 REVISIONS LTR B DESCRIPTION DATE DWN BSV RCJ 12AUG05 EC 0G3B 0213 05 APVD PINS TO COMPLY WITH AMP SOLDERABILITY


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    12AUG05 UL94V-0 0ZAPR96 31MAR2000 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. BY TYCO ELECTRONICS CORPORATION. 2 3 - - LOC DIST GP 00 REVISIONS DESCRIPTION D 1. RELEASED PER EC OS13 - 0 2 2 6 - 0 5 BM JG 12AUG05 D PARTS PACKAGED UNASSEMBLED, AS A UNIT KIT.


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    12AUG05 12AUG05 31MAR2000 PDF

    ASTM-B-488

    Abstract: MIL-M-24519 QQ-C-530
    Text: 8 THIS DRAWING 15 UNPUBLISHED. COPYRIGHT 7 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. DIST R E V IS IO N S 16 AJ LTR A DESCRIPTION REVISED PER EC 0S1 4 - 0 1 5 0 - 0 5 DATE DWN APVD 12AUG05 BM JL POLYESTER PBT PER M IL - M - 2 4 5 1 9 , TYPE


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    ASTM-B-488 21APR2005 31MAR2000 MIL-M-24519 QQ-C-530 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 T H IS D R A W IN G IS U N P U B L IS H E D . 3 R ELEASED FOR A LL C O P Y R IG H T A 1471-9 3 /1 1 P U B L IC A T IO N R IG H TS RESERVED. 2 GP R E V IS IO N S 00 D E S C R IP T IO N R EVISED 1. RER ECO-11-004835 RK HMR I M AR 11 D PARTS PACKAGED UNASSEMBLED, AS A UNIT KIT.


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    ECO-11-004835 12AUG05 12AUG05 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT 2 3 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - ALL RIGHTS RESERVED. LOC DIST AD 38 REVISIONS LTR H D OBSOLETE OBSOLETE .125 /K /K .318 .125 .318 E D C SUPERCEDED BY 3 - 1 0 3 3 2 1 - 5 OBSOLETE OBSOLETE


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    PDF

    4-40-UNC-2B

    Abstract: No abstract text available
    Text: THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - . - LOC DIST R E V IS IO N S GP 00 ALL RIGHTS RESERVED. LTR B DESCRIPTION DATE DWN BM WM 22JU L08 REVISED PER E C 0 - 0 8 - 0 0 7 3 2 7 APVD STUD R E C E IV E R


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    EC0-08-007327 22JUL08 05/im 4-40UNC-2B 12AUG05 31MAR2000 4-40-UNC-2B PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 TH IS DRAWING IS U N P U B LIS H E D . RELEASED FOR ALL COPYRIGHT 2 3 PUBLICATION RIGHTS - — LOC D IS T REVISIONS GP 00 RESERVED. BY TYCO ELECTRONICS CORPORATION. LTR 1. ALL PARTS 2^ ZINC PACKAGED D E SC RIPTIO N RELEASED PER EC UNASSEMBLED O S13 - 0 2 2 6 - 0 5


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    12AUG05 12AUG PDF

    Untitled

    Abstract: No abstract text available
    Text: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 4 5 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC REVISIONS DIST AD 00 ALL RIGHTS RESERVED. LTR DESCRIPTION B REV PER DATE DWN BC GS 07APR06 EC 0 S 1 2 - 0 3 0 3 - 0 5 APVD CONTAC SCALE 5:1 CONNECTOR A


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    07APR06 31MAR2000 PDF

    Untitled

    Abstract: No abstract text available
    Text: 6 7 TH IS DRAWING IS U N P U B L IS H E D . COPYRIGHT RELEASED BY TYCO ELECTRONICS CORPORATION. ALL FOR PUBLIC ATIO N RIG HTS - , 5 4 3 2 - LOC RE S ER VED . GP DIST R E V IS IO N S 00 LTR B REVISED PER D E S C R IP T IO N DATE DWN APVD EC0-08-007327 22JUL08


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    EC0-08-007327 22JUL08 5SS5fifi5aSS55Sfi55S555fififiS 12AUG05 31MAR2000 PDF