Untitled
Abstract: No abstract text available
Text: Part No. 97-AQ132C - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: Convert surface mount PQFP packages to an Amp interstitial PGA footprint. Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
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97-AQ132C
-or97-AQ132C-P
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n03n
Abstract: DSP56002 ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors
Text: Order this document by DSP56002/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56002 Pin Grid Array PGA Available in a 132 pin ceramic throughhoie package. Plastic Quad Flat Pack (PQFP) Available in a 132 pin, small footprint,
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DSP56002/D
DSP56002
24-Bit
DSP56002
DSP56001
n03n
ti31
58af
S-8675
S-7641
TXC 40MHz xtal
S7504
TXC 40MHz oscillator
Nippon capacitors
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18022
Abstract: 132 pin PGA socket
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
-or97-AQ132D-P
18022
132 pin PGA socket
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mounting pad PQFP
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
-or97-AQ132D-P
mounting pad PQFP
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132 pin PGA socket
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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97-AQ132D
-or97-AQ132D-P
132 pin PGA socket
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PDF
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Untitled
Abstract: No abstract text available
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
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97-AQ132D
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amp pga socket
Abstract: DIMENSIONS PQFP 132 ASTM-B16-85 mounting pad PQFP 132 pin PGA socket
Text: Part No. 97-AQ132D - 132 Pin PQFP to Amp Socket PGA Footprint FEATURES: • Convert surface mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
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97-AQ132D
97-AQ132D
-or97-AQ132D-P
amp pga socket
DIMENSIONS PQFP 132
ASTM-B16-85
mounting pad PQFP
132 pin PGA socket
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Untitled
Abstract: No abstract text available
Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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97-AQ132D
132-Pin
C36ending
97-AQ132D-P
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amp pga socket
Abstract: AMS-QQ-N-290
Text: P/N 97-AQ132D 132-Pin Amp Footprint PQFP-to-PGA Socket FEATURES • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint. • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries patented process,
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97-AQ132D
132-Pin
97-AQ132D-P
amp pga socket
AMS-QQ-N-290
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pga 132 packaging
Abstract: 55274-1 augat PGM 5527 Intel 386 DX TEXTOOL PGA TEXTOOL zif AUGAT wire wrap 132 pin PGA socket
Text: Int*l386 DX MICROPROCESSOR 8. MECHANICAL DATA 8.2 PACKAGE DIMENSIONS AND MOUNTING 8.1 INTRODUCTION The initial Intel386 OX package is a 132-pin ceramic pin grid array PGA . Pins of this package are ar ranged 0.100 inch (2.54mm) center-to-center, In a
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l386TM
Intel386
132-pin
pga 132 packaging
55274-1
augat PGM
5527
Intel 386 DX
TEXTOOL PGA
TEXTOOL zif
AUGAT wire wrap
132 pin PGA socket
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A80960JD-33
Abstract: A80960JD-40 A80960JD-50 A80960JD-66 A80960JT-100 A80960JT-75 NG80960JT-100 NG80960JT-75
Text: 80960Jx 3.3 V Microprocessor 1.0 Packaging Information: 80960Jx 3.3 V Processors The 80960Jx is offered with four speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC = 3.3 V ± 0.15 V over a case temperature range of
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80960Jx
132-pin
A80960JT-100
A80960JT-75
A80960JD-66
A80960JD-50
A80960JD-40
A80960JD-33
A80960JD-33
A80960JD-40
A80960JD-50
A80960JD-66
A80960JT-100
A80960JT-75
NG80960JT-100
NG80960JT-75
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intel packaging handbook 240800
Abstract: AD9132 AD27 AD30 AD1981
Text: 80L960JA/JF Microprocessor 1.0 Packaging Information: 80L960JA/JF Processor The 80L960JA/JF will be offered in several speed and package types. The 132-pin Pin Grid Array PGA device will be specified for operation at VCC = 3.3 V ± 5% over a case temperature range of
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80L960JA/JF
132-pin
A80L960JA/JF-25
A80L960JA/JF-16
NG80L960JA/JF-25
NG80L960JA/JF-16
intel packaging handbook 240800
AD9132
AD27
AD30
AD1981
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68020 motorola
Abstract: motorola 68020
Text: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 15.19mm[0.598"] Assembled 2 1 0.65mm typ. [0.026"] 26.54mm [1.045"]
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FR4/G10
PC-PGA/QFP-68020-L-01
68020 motorola
motorola 68020
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A80960JC-33
Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66 NG80960JC-40
Text: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of
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80960JS/JC
132-pin
A80960JC-66
A80960JC-50
A80960JC-40
A80960JC-33
A80960JS-33
A80960JS-25
A80960JC-33
A80960JC-40
A80960JC-50
A80960JC-66
A80960JS-16
A80960JS-33
NG80960JC-50
NG80960JC-66
NG80960JC-40
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A80960JC-33
Abstract: A80960JC-40 A80960JC-50 A80960JC-66 A80960JS-16 A80960JS-33 NG80960JC-50 NG80960JC-66
Text: 80960JS/JC 3.3 V Microprocessor 2.0 Package Information: 80960JS/JC 3.3 V Processors The 80960JS/JC is offered with six speeds and three package types. The 132-pin Pin Grid Array PGA device is specified for operation at VCC= 3.3 V ± 0.15 V over a case temperature range of
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80960JS/JC
132-pin
A80960JC-66
A80960JC-50
A80960JC-40
A80960JC-33
A80960JS-33
A80960JS-25
A80960JC-33
A80960JC-40
A80960JC-50
A80960JC-66
A80960JS-16
A80960JS-33
NG80960JC-50
NG80960JC-66
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motorola 68020
Abstract: No abstract text available
Text: 45.72mm [1.800"] Adapter to target PCB orientation A1 A1 ADAPTER PGA TOP 45.72mm [1.800"] Pin 1 2.54mm typ. [0.100"] Target PCB 132 position QFP land pattern 6.88mm [0.271"] 1 5.89mm [0.232"] 3 17.25mm[0.679"] Assembled 2 1 0.64mm typ. [0.025"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"]
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FR4/G10
PC-PGA/QFP-68020-G-01
motorola 68020
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68302
Abstract: QFE132SA SF-QFJ132SA-L-01
Text: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.600" (assembled) Surface mount base: (included) see SF-QFJ132SA-L-01 drawing for greater detail 0.250" 0.025" pitch 1.040" Side View Target PCB 132 position QFP Land Pattern
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SF-QFJ132SA-L-01
QFE132SA
FR4/G10
finish10µ
PC-PGA/QFP-68302-L-01
68302
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68302
Abstract: motorola ST 1076 QFE132SA SF-QFJ132SA-G-02 land pattern QFP 132
Text: Relative orrientations top views 1 13 A A1 PGA 1.800" Pin 1 QFP N Top View 1.800" 2 1 0.501" 0.630" (assembled) Surface mount base: (included) see SF-QFJ132SA-G-02 drawing for greater detail 0.276" 0.025" pitch 1.076" Side View Target PCB 132 position QFP Land Pattern
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SF-QFJ132SA-G-02
QFE132SA
FR4/G10
finish10µ
PC-PGA/QFP-68302-G-01
68302
motorola ST 1076
land pattern QFP 132
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footprint 8M1-A
Abstract: No abstract text available
Text: Zero Insertion Force PGA Test and Burn-in Sockets cont. Grid Size No. of Pins Dim. “C” 12 x 12* 144 1.100 [27.94] 13 x 13 169 1.200 [30.48] 14 x 14* 196 1.300 [33.02] 15 x 15 225 1.400 [35.56] 16 x 16* 256 1.500 [38.10] 17 x 17 289 1.600 [40.64] 18 x 18*
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Preci-Dip Durtal SA
Abstract: CH-2800 C17200 510-91-168-17 pga 132 packaging CuSn4Pb4Zn4 94vo fr4 Durtal SMD 2.54 90 Header 514-PP-NNNMXX-XXX148
Text: Quick Selector Chart PGA / BGA / PLCC PGA Grid 2.54 mm BGA Interstitial 1.27 mm Sockets Solder tail 1.27 mm PLCC 1 mm See page 126 131 135 143 Surface mount 126 131 135 136 139 142 Solderless compliant press-fit Carrier Interconnect pin solder tail Interconnect pin
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CH-2800
540-PP-020-24-000-1
540-PP-028-24-000-1
540-PP-032-24-000-1
540-PP-044-24-000-1
540-PP-052-24-000-1
540-PP-068-24-000-1
540-PP-084-24-000-1
Preci-Dip Durtal SA
C17200
510-91-168-17
pga 132 packaging
CuSn4Pb4Zn4
94vo fr4
Durtal
SMD 2.54 90 Header
514-PP-NNNMXX-XXX148
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footprint pga 84
Abstract: footprint pga 208 e-tec pcp
Text: PGA/PGI Series - Pin Grid Array Sockets E-tec offers any configuration from 5 x 5 upwards. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in PBT plastic or FR4 Epoxy depending on material
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19x19
footprint pga 84
footprint pga 208
e-tec pcp
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footprint pga 84
Abstract: PGA 145 socket 8x8 64 footprint footprint pga 208 X18180 X1388 8x8 68 footprint 84 pin PGA socket
Text: PGA/PGI Series - Pin Grid Array Sockets E-tec the Swiss connection E-tec offers any configuration from 5 x 5 upwards. You may choose between open frame and closed frame socket bodies. The E-tec PGA sockets with Insulator code “S” will be supplied either in PBT plastic or FR4 Epoxy depending on material
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19x19
insulat00
footprint pga 84
PGA 145 socket
8x8 64 footprint
footprint pga 208
X18180
X1388
8x8 68 footprint
84 pin PGA socket
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ZIF pga 84
Abstract: PGA 145 socket QFP 128 pin Socket PA-QFJ172SB-P-Z-01 ZIF qfp 172
Text: Page 1 of 2 Use if QFP Pin 1 is lower left when device is placed on ZIF socket Top ViewQFP Socket 129 87 86 130 44 172 QFP PIN 1in lower left corner QFP PIN 1 43 A1 Top ViewPGA Base A17 126 125 129 128 127 121 113 110 109 103 97 91 88 87 90 89 85 130 123
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PA-QFJ172SB-P-Z-01
ZIF pga 84
PGA 145 socket
QFP 128 pin Socket
ZIF qfp 172
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footprint 8M1-A
Abstract: No abstract text available
Text: ADVANCED INTERCONNECTIONS PGA Footprints 5 Energy Way, P.O. Box 1019, W e st Warw ick, Rl 02893 • Tel. 4 0 1 -8 2 3 -5 20 0 • FAX 401-823-8723 PGA Socket and Adapter Footprints 8 Pins Footprint Number 8" _J ^ 9 Pins Footprint Num ber 9* L .300 Sq. f 7.62
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