160 e7
Abstract: 484-pin BGA diodes t25 4 l9 AC22 AE23 AF14 EPF10K30A t25 4 k8 t25 4 H9 E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
Text: EPF10K30A Device Pin-Outs ver. 1.0 Pin Name 144-Pin TQFP MSEL0 2 77 MSEL1 (2) 76 nSTATUS (2) 35 nCONFIG (2) 74 DCLK (2) 107 CONF_DONE (2) 2 208-Pin PQFP/RQFP 108 107 52 105 155 2 240-Pin PQFP/RQFP 124 123 60 121 179 2 256-Pin FineLine BGA P1 R1 T16 N4 B2
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Original
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EPF10K30A
144-Pin
208-Pin
240-Pin
256-Pin
356-Pin
484-Pin
EPF10K100A
600-pin
240-pin
160 e7
484-pin BGA
diodes t25 4 l9
AC22
AE23
AF14
t25 4 k8
t25 4 H9
E22/6/BC237/238/239/EPC16/TL7660IDGKRG4-datasheet
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PDF
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L9145
Abstract: EPF10K10 EPF10K100 EPF10K100A EPF10K10A EPF10K30 EPF10K50V EPF10K70
Text: EPF10K10A Device Pin-Outs ver. 1.0 Pin Name 100-Pin TQFP 144-Pin TQFP MSEL0 2 MSEL1 (2) nSTATUS (2) nCONFIG (2) DCLK (2) CONF_DONE (2) INIT_DONE (3) nCE (2) nCEO (2) nWS (4) nRS (4) nCS (4) CS (4) RDYnBSY (4) CLKUSR (4) DATA7 (4) DATA6 (4) DATA5 (4) DATA4 (4)
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Original
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EPF10K10A
100-Pin
144-Pin
EPF10K100A
600-pin
240-pin
L9145
EPF10K10
EPF10K100
EPF10K30
EPF10K50V
EPF10K70
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PDF
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WA14465DQAET
Abstract: wa14465d
Text: TITLE : DIM. RS 158 9093 144 PIN QFP - PGA ADAPTER WA14465DQAET AS SHOWN TOL. +/- 1 0.0 +/- 0.1 0.00 +/- 0.01 0.000 +/- 0.001 2.00 mm 1.60 mm 2.95 mm DWN. S D pin=0.457 dia DATE.8/7/97 28 mm 2.54 mm SCALE. NTS ISSUE. RS01 28 mm 48.26 mm PITCH 0.65 mm MODIFICATIONS.
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Original
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WA14465DQAET
WA14465DQAET
wa14465d
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PDF
|
Untitled
Abstract: No abstract text available
Text: VRAM SM55161A Production 262144 x 16 BIT VRAM PIN ASSIGNMENT MULTIPORT VIDEO RAM Top View AVAILABLE AS MILITARY SPECIFICATIONS 64-Pin Ceramic Flatpack (HKC) • Military Processing Flow(SM Level) • -55C to 125C temperature FEATURES • Organization: – DRAM: 262 144 by 16 Bits
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Original
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SM55161A
64-Pin
MIL-STD-883C
SMJ55161A
|
PDF
|
Untitled
Abstract: No abstract text available
Text: VRAM SM55161A Production 262144 x 16 BIT VRAM PIN ASSIGNMENT MULTIPORT VIDEO RAM Top View AVAILABLE AS MILITARY SPECIFICATIONS 64-Pin Ceramic Flatpack (HKC) • Military Processing Flow(SM Level) • -55C to 125C temperature FEATURES • Organization: – DRAM: 262 144 by 16 Bits
|
Original
|
SM55161A
64-Pin
MIL-STD-883C
SMJ55161A
|
PDF
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LD2088
Abstract: VIC068A ID10 ID12 VAC068A ID13 LA18 code LA15 LA18 LD26
Text: 5.7 VAC068A Signal List and Pinout Table 5-2. VMEbus Signals PGA Pin QFP Pin A08 A8 139 Three-State I/O VMEbus Address Signals A09 B8 138 Three-State I/O VMEbus Address Signals A10 A7 142 Three-State I/O VMEbus Address Signals A11 B7 144 Three-State I/O VMEbus Address Signals
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Original
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VAC068A
PIO10
PIO12-SHRCS*
LD2088
VIC068A
ID10
ID12
ID13
LA18 code
LA15
LA18
LD26
|
PDF
|
Untitled
Abstract: No abstract text available
Text: H XC73144 144-Macrocell CMOS EPLD M U N ÎT Product Specifications Features • High-Performance EPLD - 7.5 ns pin-to-pin speed on all fast inputs - 100 MHz maximum clock frequency • Advanced Dual-Block architecture - Four Fast Function Blocks - Twelve High-Density Function Blocks
|
OCR Scan
|
XC73144
144-Macrocell
16-bit
BG225
225-Pin
PQ100
BG225
PG144
PQ160
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 1110087 144 Pin VQFP to PGA Adapter FEATURES: Convert surface mount VQFP packages to a 13 x 13 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
|
Original
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QQ-B-626.
-or1110087-P
|
PDF
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Untitled
Abstract: No abstract text available
Text: : Available, : Under development Ceramic PGA Classificaton Glass sealed Lead Pitch mm Pin Counts 68 72 84 132 144 175 176 179 208 280 364 447 528 2.54 2.54 Metal sealed 1.27 2.54 Seam weld 1.27 2.54 Heat sink 1.27 2.54 Metal slug 1.27 Plastic PGA Classificaton
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Original
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X68RW-100A-2
X72RH-100A1-1
X72RH-100A2-1
X84RH-100A-1
X84RH-100A1
X132RH-100A-1
X132RH-100A1-1
X1761
X208RF-100A5-1
X208RF-100A6-1
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 1110087 144 Pin VQFP to PGA Adapter FEATURES: • Convert surface mount VQFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
C36000
ASTM-B16-e
-or1110087-P
144-PGM13095-30
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Adapter to target PCB orientation A1 Motorola is a registered Trademark of Motorola, Inc. A1 0.100" Typ. ADAPTER PGA TOP 1.600" Pin 1 Target PCB 144 position QFP land pattern Top View 1.600" 0.176" 3 0.427" Plugged 1 Note: Surface mount emulator foot is symmetrical and can solder to
|
Original
|
SF-QFE144SD-L-02
FR4/G10
finish10Â
PC-PGA/QFP-68338-L-01
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 1110087 144 Pin VQFP to PGA Adapter FEATURES: • Convert surface mount VQFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
C36000
ASTM-B16-87
-or1110087-P
144-PGM13095-30
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 1110087 144 Pin VQFP to PGA Adapter FEATURES: • Convert surface mount VQFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
C36000
ASTM-B16-to
-or1110087-P
144-PGM13095-30
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 1110087 144 Pin VQFP to PGA Adapter FEATURES: • Convert surface mount VQFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
C36000
ASTM-B16-00.
-or1110087-P
144-PGM13095-30
|
PDF
|
|
|
ASTM-B16-85
Abstract: MIL-T-10727
Text: Part No. 1110087 144 Pin VQFP to PGA Adapter FEATURES: • Convert surface mount VQFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
-or1110087-P
144-PGM13095-30
ASTM-B16-85
MIL-T-10727
|
PDF
|
ASTM-B16-85
Abstract: 144 QFP body size
Text: Part No. 1110087 144 Pin VQFP to PGA Adapter FEATURES: • Convert surface mount VQFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
-or1110087-P
144-PGM13095-30
ASTM-B16-85
144 QFP body size
|
PDF
|
ccii
Abstract: rta2 PLH11L 72F14 ML/82x33/587/OS/TL/F/1553 bus controller
Text: UT1553 BCRTMP □ Tune tagging and message logging in RT mode F eatures □ Packaged in 144-pin pingrid array, 132-lead flatpack □ Comprehensive MIL-STD-1553 dual-redundant Bus Controller BC and Remote Terminal (RT) functions □ Low-power CMOS technology
|
OCR Scan
|
UT1553
MIL-STD-1553
144-pin
132-lead
MIL-STD-883,
LGL10
BCRTMP-61
ccii
rta2
PLH11L
72F14
ML/82x33/587/OS/TL/F/1553 bus controller
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: Convert surface mount QFP packages to a 15 x 15 PGA footprint. Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. Pins are mechanically fastened and soldered to board
|
Original
|
QQ-B-626.
-or97-68340-P
|
PDF
|
144 QFP body size
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
145-PGM15024-30
144 QFP body size
|
PDF
|
ASTM-B16-85
Abstract: MIL-T-10727
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
|
Original
|
-or97-68340-P
145-PGM15024-30
ASTM-B16-85
MIL-T-10727
|
PDF
|
Untitled
Abstract: No abstract text available
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using
|
Original
|
-or97-68340-P
145-PGM15024-30
|
PDF
|
nec 575
Abstract: 05 k 575 k 575
Text: Packing Name NEC Tray LA-099 144 pin Ceramic PGA Seam Weld A (Bottom View) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 B Q P N M L K J H G F E D C B A Index mark Orientation pin J I K F E L H G ITEM MILLIMETERS INCHES A 40.0±0.4 1.575±0.016 D 40.0±0.4 1.575±0.016
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Original
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LA-099
X144R-100A-1
nec 575
05 k 575
k 575
|
PDF
|
A3818
Abstract: A5232 A5690 UT1553 McDonnell standards 1553L
Text: UT1553 BCRTMP ❐ ❐ ❐ ❐ FEATURES Time tagging and message logging in RT mode Packaged in 144-pin pingrid array, 132-lead flatpack Low-power CMOS technology Full military operating temperature range, -55°C to +125°C, screened to the specific test methods listed
|
Original
|
UT1553
144-pin
132-lead
MIL-STD-883,
MIL-STD-1553A,
MIL-STD-1553B,
A3818,
A5232,
A5690,
SP-G-151A
A3818
A5232
A5690
McDonnell standards
1553L
|
PDF
|
144 QFP body size
Abstract: ASTM-B16-85
Text: Part No. 97-68340 - 144 Pin QFP to PGA Adapter for Motorola 68340 FEATURES: • Convert surface mount QFP packages to a 15 x 15 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board
|
Original
|
-or97-68340-P
145-PGM15024-30
144 QFP body size
ASTM-B16-85
|
PDF
|
