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    144 QFP BODY SIZE Search Results

    144 QFP BODY SIZE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    SMD-B Coilcraft Inc Test fixture for 1008 - 1812 body sizes Visit Coilcraft Inc Buy
    SMD-D Coilcraft Inc Test fixture for 0402 - 1812 body sizes Visit Coilcraft Inc Buy
    SMD-F Coilcraft Inc Test fixture for 0402 body sizes Visit Coilcraft Inc Buy
    SMD-A Coilcraft Inc Test fixture for 0603 - 1812 body sizes Visit Coilcraft Inc Buy
    SMD-G Coilcraft Inc Test fixture for 0603 - 0805 body sizes Visit Coilcraft Inc

    144 QFP BODY SIZE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    SOP48

    Abstract: CF RM sot89 SOP38 14X14X2 epson QFP 216 14X14X1 45x45 mm bga 14X20X2 14x14x2.7 QFP13
    Text: Plastic QFP Pin Count 44 46 48 52 60 64 80 100 120 128 144 160 176 184 208 216 232 240 256 304 Package code QFP 13 QFP4 QFP2 QFP6 QFP5 QFP12 QFP5 QFP6 QFP2 QFP6 QFP5 QFP13 QFP15 QFP6 QFP5 Plastic TQFP Body size mm 10X10X1.4 10X10X1.45 14X14X2 14X14X2.7 14X20X2.7


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    QFP12 QFP13 QFP15 QFP14 12X12X1 14X20X2 14X14X1 SOP48 CF RM sot89 SOP38 14X14X2 epson QFP 216 45x45 mm bga 14x14x2.7 PDF

    SF-QFE144SB-L-01

    Abstract: QFP132-G-01 qfp132
    Text: Surface mountable QFP emulator foot; leadless version, sized to fit on 144 Body + 3.9mm. position 0.65mm. pitch land pattern. 1.220" 0.050" 0.018" 0.250" 0.063" 0.65mm 1.220" A Substrate: FR4/G10, 0.0625"±0.007" thick. Pins: Material - Brass Alloy 360, 1/2H ; finish - 10µ" Gold over 100/150µ" Nickel.


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    FR4/G10, SF-QFE144SB-L-01 PC-PGA132/QFP132-G-01 QFP132-G-01 qfp132 PDF

    QFP 128 lead .5mm

    Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M
    Text: ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size mm 7 7 10 10 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm) 1.0* / 1.4 1.4 1.4 1.0 / 1.4 2.0 UQFP * *:UNDER DEVELOPMENT VQFP 0.5mm Body Size (mm) Lead Counts lead pitch series


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    12P2M 13P5M 14P6M 16P8M 14P4M 16P6M 17P9M 18P10M 13P3M 17P7M QFP 128 lead .5mm csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M PDF

    M60073

    Abstract: M60084l M6008 4000 series CMOS Logic ICs "gate count" m60074 CMOS GATE ARRAYs mitsubishi 132X132
    Text: ASIC Custom Semi-Custom A S S P - AV Sound Processor Audio TV VCR Peripherals Disk Drive SCSI OA Printer PPC FAX Communication Telephone Mobile Communication LAN Car/lndustriai LAN Automobile Multi-Media Image Compression/Decompression Display controller


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    4/14m 64P4B 44P6N-A 64P6N-A 80P6D-A M60073 M60084l M6008 4000 series CMOS Logic ICs "gate count" m60074 CMOS GATE ARRAYs mitsubishi 132X132 PDF

    xc68hc912b32

    Abstract: XC68HC908AZ60 xcm916 XC68HC705b32 xc68hc08az0 XC68HC705 XC68HC912B xcm916x1 xmc2001 XC68HC705JJ7
    Text: SG186/D Rev. 1 Microcontroller Selector Guide Quarter 3, 1999 http://www.mcu.motsps.com Product information for: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX and M•CORE This quarter's new product highlight is the MMC2001, our first


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    SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX MMC2001, xc68hc912b32 XC68HC908AZ60 xcm916 XC68HC705b32 xc68hc08az0 XC68HC705 XC68HC912B xcm916x1 xmc2001 XC68HC705JJ7 PDF

    35 x 35 PBGA, 580 100 balls

    Abstract: of BGA Staggered Pins package BGA Ball Crack without underfill BGA PACKAGE thermal resistance 60um of BGA Staggered pins
    Text: NEW PRODUCTS 7 LATEST TECHNOLOGICAL TRENDS IN VLSI PACKAGES AND DEVELOPMENT OF NEW PACKAGES Hisao Kasuga/Miwa Momma Introduction Consumers expect constant progress in electronic systems and record-breaking size reduction each time a new product is released. To kindle consumers’ interest,


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    XC68HC908AZ60

    Abstract: xc68hc912b32 XC68HC908GP20 xcm916 XCM916X1 motorola 68hc05 lead selector guide Motorola MC68HC05B16, 52 pin 68HRC908JL3 xc68hc08az0 XMC2001
    Text: SG186/D Microcontroller Selector Guide Quarter 2, 1999 http://www.mcu.motsps.com Product information for: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX and M•CORE Welcome to the all-new Selector Guide for Microcontrollers from Motorola. This guide will be updated quarterly to help you choose


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    SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX 68HC908GP20. XC68HC908AZ60 xc68hc912b32 XC68HC908GP20 xcm916 XCM916X1 motorola 68hc05 lead selector guide Motorola MC68HC05B16, 52 pin 68HRC908JL3 xc68hc08az0 XMC2001 PDF

    xc912bc32

    Abstract: XC68HC705B32 motorola ZP fu mmx16 MC68HC908jk3 xcm916 68HC05 908gp32 MC68HC05SR3D MC68HC11E/D
    Text: SG186/D Rev. 6 Microcontroller Selector Guide Quarter 1, 2001 http://www.mcu.motsps.com Product information for: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX and M•CORE Digital DNA is a trademark of Motorola, Inc. NEW 8-Bit FLASH Microcontroller Family


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    SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX 68HC908KX xc912bc32 XC68HC705B32 motorola ZP fu mmx16 MC68HC908jk3 xcm916 68HC05 908gp32 MC68HC05SR3D MC68HC11E/D PDF

    xc68hc912b32

    Abstract: MC68SEC811E2FN Motorola MC68HC05B16, 52 pin xc68hc08az0 XC68HC705B32 xcm916 HC705B Dip 28 4 mhz motorola PV 100 USB motorola 68HC916X1
    Text: SG186/D Rev. 3 Microcontroller Selector Guide Quarter 2, 2000 http://www.mcu.motsps.com Product information for: 8-Bit 68HC05, 68HC08, and 68HC11 16-Bit 68HC12 and 68HC16 32-Bit 683XX and M•CORE Digital DNA is a trademark of Motorola, Inc. As Motorola continues to add devices to its growing family of


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    SG186/D 68HC05, 68HC08, 68HC11 16-Bit 68HC12 68HC16 32-Bit 683XX 68HC908JK1. xc68hc912b32 MC68SEC811E2FN Motorola MC68HC05B16, 52 pin xc68hc08az0 XC68HC705B32 xcm916 HC705B Dip 28 4 mhz motorola PV 100 USB motorola 68HC916X1 PDF

    IC51-0484-806

    Abstract: IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 IC51-2564-1668-10 ic51-0804-795 ic51-0444-825 IC51-1604-1350
    Text: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute


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    10mA/20mV IC51-0324-805 IC51-0324-354 IC51-0324-1498 QFP11T044-001* IC51-0444-1195-3 IC51-0444-825 IC51-467-KS11247 IC51-0444-798 IC51-0444-615 IC51-0484-806 IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 IC51-2564-1668-10 ic51-0804-795 ic51-0444-825 IC51-1604-1350 PDF

    IC51-1844-1148

    Abstract: IC51-128 IC51-1964-1952 IC51-1284-1433 IC201 ic51-0804-795 IC51-1014 IC51-1284-1788 IC51-0804-711 IC51-1764-1505-5
    Text: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute


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    10mA/20mV IC51-0324-805 IC51-0324-354 IC51-0324-1498 QFP11T044-001* IC51-0444-1195-3 IC51-0444-825 IC51-467-KS11247 IC51-0444-798 IC51-0444-615 IC51-1844-1148 IC51-128 IC51-1964-1952 IC51-1284-1433 IC201 ic51-0804-795 IC51-1014 IC51-1284-1788 IC51-0804-711 IC51-1764-1505-5 PDF

    xc912dg128

    Abstract: MC9S12D64 xc912bc32 MC3PHAC XC68HC705B32 MC908AB32CFU MC9S12DP MC68 MC68376 MC908AZ60
    Text: MICROCONTROLLERS QUARTER 3, 2002 SG1006/D REV 1 WWW.MOTOROLA.COM/SEMICONDUCTORS What’s New! Product MC68HC908QT1 MC68HC908QT2 Description Introducing the Nitron Family of HC08s. This family of 8- and 16-pin microcontrollers includes six different devices featuring 1.5K to 4K bytes of FLASH, a 2-ch


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    SG1006/D MC68HC908QT1 MC68HC908QT2 HC08s. 16-pin 16-bit MC68HC908QT4 MC68HC908QY1 MC68HC908QY2 xc912dg128 MC9S12D64 xc912bc32 MC3PHAC XC68HC705B32 MC908AB32CFU MC9S12DP MC68 MC68376 MC908AZ60 PDF

    9S12XEQ384

    Abstract: 9s12xeq384 144 QFP 9S12XEP100 9S12XET256 9S12XEG128 9S12XEQ512 9S12XEP768 mc9s12 9S12XEG RAM memory 64 KB
    Text: 16-bit Microcontrollers S12XE Family of automotive microcontrollers Overview The S12XE family of microcontrollers MCUs S12XE Family featuring the XGATE coprocessor combines DBG/BDM FMPLL GPIO 8 x LIN/SCI 2 x I 2C 3 x SPI 5 x MSCAN 12-bit, 32-ch. ATD 8-bit, 8-ch.,


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    16-bit S12XE S12XE 12-bit, 32-ch. 16-bit, 32-bit 9S12XEQ384 9s12xeq384 144 QFP 9S12XEP100 9S12XET256 9S12XEG128 9S12XEQ512 9S12XEP768 mc9s12 9S12XEG RAM memory 64 KB PDF

    exposed QFP 144

    Abstract: exposed QFP 128 TQFP-EP AN 7823 EP 603 QFP-EP 100L 144L JESD51-2 JESD51-7
    Text: QFP-ep Exposed Pad Quad Flat Pack • 7 x 7mm to 24 x 24mm body sizes • 32 to 216 lead count • Lead pitch range from 0.80mm to 0.40mm FEATURES DESCRIPTION • Body Sizes: 7 x 7mm to 24 x 24mm STATS ChipPAC’s Exposed Pad Quad Flat Pack QFP-ep is a thermally enhanced version of the QFP package. Thermal


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    S1L50552

    Abstract: tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon
    Text: ASICs Gate Arrays / Embedded Arrays / Standard Cells 2010 Our goal in the Epson Semiconductor Operations Division is to be a true partner for you, by looking to give you an edge in product development through our concept of "+less design". Gate Arrays / Embedded Arrays / Standard Cells


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    S1L60173F00A000 S1L50552 tcon mini-lvds EPSON tcon S1X65263 tcon 17 epson s1k500 SMART ASIC 197 S1K60000 S1L50062 UXGA tcon PDF

    xcm916

    Abstract: motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB
    Text: Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: DSP56F807VF80


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    DSP56F807VF80 SPSSG1006/D MC68HC08Aotorola xcm916 motorola mc68 908 97 mfu DIODE xc912dg128 908az60 MC68S711E MCM916 MC912 MC908AS60A PV 100 USB PDF

    XC68HC908AZ60

    Abstract: L 3055 motorola M68HC705KJ1 xc68hc908gp20 xc68hc805p18 XC68HC908AS60 68LK332 68HC12A XC68HC705B32 2516 2k eprom
    Text: Back Microcontroller Products In Brief . . . Page 68HC05 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . 2.5–3 68HC05 One–Time Programmable OTP / Emulator MCUs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5–6 68HC08 Microcontrollers . . . . . . . . . . . . . . . . . . . . . . . . 2.5–8


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    68HC05 68HC08 M68HC11/M68L11 M68HC12 M68HC16 M68300 MPC500 XC68HC908AZ60 L 3055 motorola M68HC705KJ1 xc68hc908gp20 xc68hc805p18 XC68HC908AS60 68LK332 68HC12A XC68HC705B32 2516 2k eprom PDF

    fcBGA PACKAGE thermal resistance

    Abstract: 409-ball CERAMIC PIN GRID ARRAY wire lead frame lead frame pin grid array 30-PIN TSOP 48 stacked flash bonding TSOP 48 thermal resistance Sharp Packages SSOP MM1248 ebga 304
    Text: IC PACKAGE FUJITSU MICROELECTRONICS LIMITED Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3347 Fax: +81-3-5322-3387 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America


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    LQFP-48 thermal pad

    Abstract: exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144
    Text: Thermal Characteristics of IC Assembly method for using this board is specified by the SEMI standard G38-87. These standards are available in the SEMI International Standards book, Volume 4, for packaging. INTRODUCTION The purpose of this document is to provide a centralized


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    G38-87. LQFP-48 thermal pad exposed QFP 144 CQFP 240 QFP-128 20 x 14 pad exposed QFP 128 BGA-64 pad LQFP-64 thermal pad 2-CQFP SOT23-6 1152 BGA 144 PDF

    IC51-1444-1354-7

    Abstract: IC51-1444-1354 IC51-1204-1646 IC51-1444-1014-3 ic51-1204-1812 IC51-1204-1497 IC51-1284-1433 IC51-1124-1036-YED IC51-1124-1036-2 ks 213 F
    Text: IC51 Series Clamshell QFP, PQFP and TQFP Part Number (Details) Specifications As specifications for this product differ by pitch and material-mix, please contact our Sales Department for detailed information. IC51 Series No. 1,000M Ω min. at100V DC, 500V DC


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    at100V 10mA/20mV IC51-1284-844-1 IC51-1284-976-1 IC51-1284-976-2 IC51-1014 KS-11137 IC51-1444-1014-3 IC51-1444-1014 65x35 IC51-1444-1354-7 IC51-1444-1354 IC51-1204-1646 IC51-1444-1014-3 ic51-1204-1812 IC51-1204-1497 IC51-1284-1433 IC51-1124-1036-YED IC51-1124-1036-2 ks 213 F PDF

    s1l50552

    Abstract: encounter conformal equivalence check user guide circuit diagram of mini ips system S1L50062 RTC SL 5500 S1K-7 S1X65263 512M x 8 Bit NAND Flash Memory BGA and QFP Package epson lq 300
    Text: ASIC Gate Array / Embedded Array / Standard Cell 2007/4- SEIKO EPSON CORPORATION Our goal is to be a true partner that strategically contributes to your product development through our concept of "saving technologies" that save power, time, and space. Gate Array / Embedded Array / Standard Cell


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    S1L60843F00A000 ARM720T: s1l50552 encounter conformal equivalence check user guide circuit diagram of mini ips system S1L50062 RTC SL 5500 S1K-7 S1X65263 512M x 8 Bit NAND Flash Memory BGA and QFP Package epson lq 300 PDF

    AN 7823

    Abstract: 100L JESD51-2 JESD51-7 Techpoint
    Text: MQFP-d Heat Spreader Metric Quad Flat Pack • 14 x 14mm to 32 x 32mm • 64 to 240 lead count • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 14 x 14mm to 32 x 32mm STATS ChipPAC’s Heat Spreader Metric Quad Flat Pack MQFP-d is a thermally enhanced version of the QFP


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    XCS3201FN

    Abstract: ATT92020 80386SL MC68HC11A1FU
    Text: Pomona Innovative Solutions For IC Test Anc Development Expressly designed to facilitate testing of your surface-mounted devices, Pomona IC Test Clips and Pomona Solder-On Adapters are engineered in form and function to provide a convenient interface to logic analyzers for fast and reliable


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    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


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    C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow PDF