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    1466 BALL FCBGA Search Results

    1466 BALL FCBGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    146-6182-12D Amphenol Communications Solutions Paladin HD, RAF, 6-Pair, 8 Column, NiS Visit Amphenol Communications Solutions
    146-6142-12D Amphenol Communications Solutions Paladin HD, RAF, 6-Pair, 4 Column, NiS Visit Amphenol Communications Solutions
    146-6142-12V Amphenol Communications Solutions Paladin HD, RAF, 6-Pair, 4 Column, GXT+ Visit Amphenol Communications Solutions
    146-6162-12V Amphenol Communications Solutions Paladin HD, RAF, 6-Pair, 6 Column, GXT+ Visit Amphenol Communications Solutions
    146-6162-12D Amphenol Communications Solutions Paladin HD, RAF, 6-Pair, 6 Column, NiS Visit Amphenol Communications Solutions

    1466 BALL FCBGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    intel 945 ich7 family motherboard

    Abstract: ICH7M intel 945 945 MOTHERBOARD intel 945 gmch intel LPC interface spec 1.0 intel 945 reference intel chipset 945 mobile Thermal Design Guide INTEL fcBGA PACKAGE thermal resistance
    Text: Mobile Intel 945GME Express Chipset Graphics and Memory Controller Hub GMCH for Embedded Applications Thermal Design Guide June 2007 308623-002 Mobile Intel® 945GME Express Chipset GMCH Thermal Design Guide ® INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTEL’S TERMS


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    945GME intel 945 ich7 family motherboard ICH7M intel 945 945 MOTHERBOARD intel 945 gmch intel LPC interface spec 1.0 intel 945 reference intel chipset 945 mobile Thermal Design Guide INTEL fcBGA PACKAGE thermal resistance PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    MT 5388 BGA

    Abstract: Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511
    Text: IDT Product Selector Guide Accelerated Thinking SM Table of Contents Integrated Processors Flow-Control Management Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13


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    12-03/DS/DL/BAY/10K CORP-PSG-00123 MT 5388 BGA Broadcom 7019 BTS 6000 ericsson alcatel 1511 mux mobile switching center msc ericsson bts 6000 2x4 TTL demultiplexer cisco 2801 ericsson bts Technical specification alcatel 1511 PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


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    UG112 UG072, UG075, XAPP427, BFG95 PDF

    MIP 2F4

    Abstract: 940GML intel 943gml 1466 ball FCBGA 945GMS LE1A pci express x16 graphics bga ballout 943G CEF H32 str w 6251
    Text: Mobile Intel 945 Express Chipset Family Datasheet July 2007 Document Number: 309219-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    945GMS 945GU 593-mm 893-mm. 82945GU MIP 2F4 940GML intel 943gml 1466 ball FCBGA LE1A pci express x16 graphics bga ballout 943G CEF H32 str w 6251 PDF

    MIP 2F4

    Abstract: intel 943gml ic MIP 2F4 generation of PWM for inverter pic 18f 940GML 945PM 1466 ball FCBGA 945GM 945GT 82801GBM ICH7M
    Text: Mobile Intel 945 Express Chipset Family Datasheet June 2008 Document Number: 309219-006 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    945GMS/GSE 945GU 593-mm 893-mm. 82945GU MIP 2F4 intel 943gml ic MIP 2F4 generation of PWM for inverter pic 18f 940GML 945PM 1466 ball FCBGA 945GM 945GT 82801GBM ICH7M PDF

    Untitled

    Abstract: No abstract text available
    Text: Mobile Intel 945 Express Chipset Family Datasheet April 2006 Document Number: 309219-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    945GMS PDF

    MIP 2F4

    Abstract: 940GML 943GML ic MIP 2F4 generation of PWM for inverter pic 18f intel 943gml 82801gb 943gml cpu 945GM C30-A38
    Text: Mobile Intel 945 Express Chipset Family Datasheet November 2006 Document Number: 309219-003 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN


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    945GMS MIP 2F4 940GML 943GML ic MIP 2F4 generation of PWM for inverter pic 18f intel 943gml 82801gb 943gml cpu 945GM C30-A38 PDF

    AC adapter 19V

    Abstract: r305 finger print module CONN60_ITP-XDP MOSFET BA8 SMSC1021 quanta cn137 max8724 ICS CK410M max8736
    Text: 5 4 3 2 1 OT1 BLOCK DIAGRAM CPU CORE P37 CPU Thermal Sensor Intel ULV Peutium-M / ULV Celeron-M D MAX6657 ULV Yonah / ULV Celeron +1.05V/+1.5V_A P36 DC/DC 3V & 5V 479 Pins Micro-FCBGA DISCHARGE/+2.5V P32 D ICS CK410-M XDP P5,6 CONN60_ITP-XDPP5 HyperThansport I/O BUS


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    318MHz MAX6657 CK410-M CONN60 MAX8724/1908 400MHZ 768KHz 576MHz 48MHz 25MHz AC adapter 19V r305 finger print module CONN60_ITP-XDP MOSFET BA8 SMSC1021 quanta cn137 max8724 ICS CK410M max8736 PDF

    MAX8770

    Abstract: ICS954310 motherboard samsung ba41 MDB41 PC87541 QUANTA C3229 C3198 PC87541 sil3512 quanta
    Text: 1 2 3 4 5 CPU Yonah/Merom 478 PIN micro FC-PGA 1 RJ9 Block Diagram P3,4 14.318MHz FSB 667 MHz(166X4) A LVDS LCD A LVDS P7 CLOCK GEN DDRII 400/533/667 Calistoga DVI M56 UNBUFFERED DDRII SODIMM CRT P11 P2 P12 945GM/PM R/G/B ICS954310 R/G/B 1466 PIN (micro FCBGA)


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    318MHz 166X4) ICS954310 945GM/PM P5-10 16Lanes P36-40 88E8053 ALC260 TI-TPA6011A4 MAX8770 ICS954310 motherboard samsung ba41 MDB41 PC87541 QUANTA C3229 C3198 PC87541 sil3512 quanta PDF

    sil3512

    Abstract: C3088 CMOS Camera G966-25 C3198 PC87541 ICS9lpr310 7336A 915GM c3197 VT6212
    Text: 1 2 3 4 5 478 PIN micro FC-PGA 1 RJ6 Block Diagram CPU Yonah/Merom P3,4 14.318MHz FSB 667 MHz(166X4) A LVDS LCD A LVDS P7 CLOCK GEN DDRII 400/533/667 Calistoga DVI M56 UNBUFFERED DDRII SODIMM 945GM/PM R/G/B CRT P11 R/G/B 1466 PIN (micro FCBGA) 37.5mm x 37.5mm


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    318MHz 166X4) ICS954310 945GM/PM P5-10 16Lanes P36-40 88E8055 ALC260 P13-16 sil3512 C3088 CMOS Camera G966-25 C3198 PC87541 ICS9lpr310 7336A 915GM c3197 VT6212 PDF

    SPIF3811-HV096

    Abstract: 8C639 G995P1U CALISTOGA-945PM gst5009 lf GST5009LF L448 foxconn quanta 14K22
    Text: 5 4 3 2 1 EV@: Stuff when external VGA used SH@: Stuff when SATA HDD used PH@: Stuff when PATA HDD used ZC1 SYSTEM BLOCK DIAGRAM X'TAL 14.318MHZ Yonah/Merom 479 uFCPGA Clock Generator DVI ICS954310BGLF CPU Thermal Sensor P2 P25 P5 P3,P4 VRAM X 4 GDDR3 256MB/500MHZ


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    318MHZ ICS954310BGLF 256MB/500MHZ 10/100/1G CALISTOGA-945PM PSPR28 74HCT237 100K/F 2N7002 120K/F SPIF3811-HV096 8C639 G995P1U gst5009 lf GST5009LF L448 foxconn quanta 14K22 PDF

    PC87541

    Abstract: RTL8110SC pc1288 quanta quanta computer tps51124 kbc max8736 BT 342 project MX215 benq m23
    Text: 1 2 3 4 5 6 7 8 KW3 BLOCK DIAGRAM Calistoga / Yonah /ICH7-M CPU THERMAL SENSOR MAX6648 CPU Yonah/Merom A CPU CORE MAX8736 POWER VCORE 1.2V /44A 14.318MHz PG 23 479 Pins uPGA 1 CPUCLK, CPUCLK# PG31 CLOCK GEN PG 4,5 SYSTEM MAX8734 POWER(3/5V) ICS954206 56pins


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    MAX6648 318MHz MAX8736 ICS954206 56pins MAX8734 TPS51124 533M/667M OSC14M TPS51116 PC87541 RTL8110SC pc1288 quanta quanta computer tps51124 kbc BT 342 project MX215 benq m23 PDF

    RCA 16299

    Abstract: PE 33632 RCA 39535 intel chipset 845 motherboard repair ATC 23172 B65550 k 3919 Socket AM2 ero 1831 intel chipset 845 motherboard repair circuit
    Text: Intel EP80579 Integrated Processor Product Line Datasheet Order Number: 320066-003US August 2009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    EP80579 320066-003US 320066-003US RCA 16299 PE 33632 RCA 39535 intel chipset 845 motherboard repair ATC 23172 B65550 k 3919 Socket AM2 ero 1831 intel chipset 845 motherboard repair circuit PDF

    U2829

    Abstract: hp mini 110 laptop MOTHERBOARD pcb CIRCUIT diagram aspire MOTHERBOARD CIRCUIT diagram acer motherboard bios jumper settings panasonic inverter dv 700 install manual book aspire 5570 MOTHERBOARD CIRCUIT diagram Sanyo HM-28 PCI8412 YNV-W02 940GML
    Text: Aspire 3680/5570/5580 Series Service Guide Service guide files and updates are available on the ACER/CSD web; for more information, please refer to http://csd.acer.com.tw PRINTED IN TAIWAN Revision History Please refer to the table below for the updates made on Aspire 3680/5570/5580 service guide.


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    PDF

    Untitled

    Abstract: No abstract text available
    Text: DLPC410 www.ti.com DLPS024A – AUGUST 2012 – REVISED SEPTEMBER 2012 DLP Discovery 4100 Digital Controller Check for Samples: DLPC410 FEATURES 1 • 2 • • • • • • Operates the Following DLP Discovery 4100 Chipset Components – DMD: DLP7000 and DLP9500


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    DLPC410 DLPS024A DLP7000 DLP9500 DLPA200 32-kHz 64-Bit 676-Pin, PDF

    LVDS-25

    Abstract: dmd 0.95 1080p dmd 1080p DMD .45 DAP01 LVDS25 DSP dap 1912 xilinx topside marking 1429 d DLP-7000
    Text: DLPC410 www.ti.com DLPS024A – AUGUST 2012 – REVISED SEPTEMBER 2012 DLP Discovery 4100 Digital Controller Check for Samples: DLPC410 FEATURES 1 • 2 • • • • • • Operates the Following DLP Discovery 4100 Chipset Components – DMD: DLP7000 and DLP9500


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    DLPC410 DLPS024A DLP7000 DLP9500 DLPA200 32-kHz 64-Bit 676-Pin, LVDS-25 dmd 0.95 1080p dmd 1080p DMD .45 DAP01 LVDS25 DSP dap 1912 xilinx topside marking 1429 d DLP-7000 PDF

    842 317 SO8

    Abstract: No abstract text available
    Text: Intel Communications Chipset 89xx Series Datasheet June 2013 Order Number: 327879-002US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    327879-002US LK100 842 317 SO8 PDF

    Ethernet to HDLC

    Abstract: TRACE INVERTER MODEL 2524 BOSCH 30343 intel chipset 845 motherboard repair circuit pmi op 05 e 7702 bosch can 2.0A PE 33632 Socket AM2 AM3 motherboard repair intel chipset 945 motherboard repair
    Text: Intel EP80579 Integrated Processor Product Line Datasheet Order Number: 320066-003US August 2009 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    EP80579 320066-003US i7-2630QM/i7-2635QM, i7-2670QM/i72675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. 80579-Integrated-Processor-with-Intel-Qui 18-Aug-2011 Ethernet to HDLC TRACE INVERTER MODEL 2524 BOSCH 30343 intel chipset 845 motherboard repair circuit pmi op 05 e 7702 bosch can 2.0A PE 33632 Socket AM2 AM3 motherboard repair intel chipset 945 motherboard repair PDF

    PEC 4179 DIODE

    Abstract: 327879-001US
    Text: Intel Communications Chipset 89xx Series Datasheet October 2012 Order Number: 327879-001US INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    327879-001US LK100 PEC 4179 DIODE 327879-001US PDF

    TDA 3619

    Abstract: gcu 101 setting manual
    Text: Intel EP80579 Integrated Processor Product Line Datasheet Order Number: 320066-001US July 2008 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS


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    EP80579 320066-001US TDA 3619 gcu 101 setting manual PDF