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    152-BALL POP Search Results

    152-BALL POP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    84512-202 Amphenol Communications Solutions 100 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array Visit Amphenol Communications Solutions
    10022671-102LF Amphenol Communications Solutions 528 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84501-001LF Amphenol Communications Solutions 300 Position BGA Receptacle, 4mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    55714-102LF Amphenol Communications Solutions 81 Position BGA Plug, 0mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions
    84520-002LF Amphenol Communications Solutions 400 Position BGA Plug, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free Visit Amphenol Communications Solutions

    152-BALL POP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    MT29F1G08ABCHC

    Abstract: mt29c MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr
    Text: Preliminary‡ 152-Ball NAND Flash and Mobile LPDRAM PoP TI OMAP MCP Features NAND Flash and Mobile LPDRAM 152-Ball Package-on-Package (PoP) Combination Memory (TI OMAP ) MT29C Family Current production part numbers: See Table 1 on page 3 Features Figure 1:


    Original     		152-Ball MT29C 152-Ball 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29F1G08ABCHC MT29F4G16A mt29f1g08 MT29F1G08ABCHC-ET MT29C1G12 MT29F2G16ABDHC MT29F4G16AB MT29F1G16ABCHC-ET micron lpddr PDF

    D9KG

    Abstract: marking code micron label marking aa5 152-Ball M2P20 MT46H64M32L2CG-6 152-Ball PoP SMD marking code B10 AA5 mark diagram smd marking code M21
    Text: Preliminary‡ 152-Ball x32 LPDDR-SDRAM PoP TI-OMAP Features LPDDR-SDRAM 152-Ball Package-on-a-Package (PoP) TI-OMAP MT46HxxxMxxLxCG Features Options • Vdd/Vddq = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR)


    Original     		152-Ball MT46HxxxMxxLxCG 09005aef833913f1/Source: 09005aef833913d6 D9KG marking code micron label marking aa5 M2P20 MT46H64M32L2CG-6 152-Ball PoP SMD marking code B10 AA5 mark diagram smd marking code M21 PDF

    MT46H64M32

    Abstract: MT46H128 MT46H64M32L2CG-6 MT46H128M 152-Ball lpddr MT46H128M32 micron lpddr 128M32 MT46H128M32L4KZ
    Text: 152-Ball x32 Mobile LPDDR only PoP (TI-OMAP) Features Mobile LPDDR (only) 152-Ball Package-on-Package (PoP) TI-OMAP MT46HxxxMxxLxCG MT46HxxxMxxLxKZ Features Options • VDD/VDDQ = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR)


    Original     		152-Ball MT46HxxxMxxLxCG MT46HxxxMxxLxKZ 09005aef833913f1/Source: 09005aef833913d6 MT46H64M32 MT46H128 MT46H64M32L2CG-6 MT46H128M lpddr MT46H128M32 micron lpddr 128M32 MT46H128M32L4KZ PDF

    MT29C1G12

    Abstract: mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1
    Text: Preliminary‡ 152-Ball NAND Flash and LP-DRAM PoP TI OMAP MCP Features NAND Flash and LP-DRAM 152-Ball Package-on-a-Package (PoP) Combination Memory (TI OMAP ) Features • • • • • • Figure 1: Micron NAND Flash and LP-DRAM components RoHS-compliant, “green” package


    Original     		152-Ball 409ng 09005aef8326e5ac 09005aef8326e59a 152ball_ MT29C1G12 mt29c1g12ma MT29C1G12M MT29C1G smd code AA5 SMD MARKING CODE b21 MT29C2G24MAKLACG-6 smd code U21 marking aa5 mt29c1g1 PDF

    Untitled

    Abstract: No abstract text available
    Text: MS46H64M32L2SB-XX *PRELIMINARY 2Gb LPDDR 2 x 32Mx32 FEATURES  Package: GENERAL DESCRIPTION • 152 Plastic Ball Grid Array (PBGA), 14 x 14 mm Microsemi MS46H64M32L2SB package-on-package (PoP) MCP product combines two Mobile LPDRAM devices in a single MCP.


    Original     		MS46H64M32L2SB-XX 32Mx32) MS46H64M32L2SB 268M-bit PDF

    JEDEC Jc-11 free

    Abstract: PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap
    Text: LAMINATE data sheet Package on Package PoP Family Bottom PoP Technologies: Features: After three years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA platform in the 4th quarter of 2004. The next four years saw many new


    Original     		wirebon00 JEDEC Jc-11 free PSVFBGA FCCSP 0.3mm pitch csp package Amkor Technology amkor flip Amkor CSP mold compound Amkor Wafer level mold compound 0.65mm pitch BGA mold cap PDF

    TRAY FBGA 11X13

    Abstract: S72MS512PE0HF94V MCP NAND sDR S72MS-P BGA 15X15 137-Ball MCP NAND DDR S30MS-P Spansion NAND Flash Spansion NAND Flash DIE
    Text: S72MS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 Data Sheet Advance Information S72MS-P based MCP/PoP Products Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S72MS-P TRAY FBGA 11X13 S72MS512PE0HF94V MCP NAND sDR BGA 15X15 137-Ball MCP NAND DDR S30MS-P Spansion NAND Flash Spansion NAND Flash DIE PDF

    28F160

    Abstract: 28F160B3 BGA thermal resistance 6x8 intel 28f160 s5 SOP JEDEC tray A576 ubga package BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS TRANSPORT MEDIA AND PACKING
    Text: The Micro Ball Grid Array µBGA* Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


    Original     		PDF

    S30MS-P

    Abstract: AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF S75WS-P UtRAM Density Spansion NAND Flash DIE MS512P
    Text: S75WS-P based MCP/POP Products 1.8 Volt-only x16 Simultaneous Read/Write, Burst Mode Flash NOR Interface S30MS-P (NAND Interface) ORNAND Flash pSRAM Type 2 S75WS-P based MCP/POP Products Cover Sheet Data Sheet (Advance Information) Notice to Readers: This document states the current technical specifications regarding the Spansion


    Original     		S75WS-P S30MS-P S30MS-P AMB128 S29WS-P S75WS256PEFJF5 S75WS256PEFKFF UtRAM Density Spansion NAND Flash DIE MS512P PDF

    JEDEC Jc-11 free

    Abstract: PSVFBGA Amkor Wafer level mold compound 1415B jedec package standards Amkor CSP mold compound PoP PACKAGE TESTING Die B3
    Text: LAMINATE data sheet Package on Package PoP Family PSvfBGA Package Stackable Very Thin Fine Pitch BGA (PSvfBGA): After 3 years of development in package stacking technology and infrastructure, Amkor launched the multiple award winning PSvfBGA (base PoP) platform during the 4th quarter of 2004. The next two years saw


    Original     		PDF

    S72WS512PFFJF9GH

    Abstract: BGA 15X15 BGA 130 MCP NAND DDR 12X12 POP PACKAGE TRAY 15x15 bta 137 S72WS512PFFKFKGH N-ADQ14 NAND01
    Text: S72WS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus Simultaneous Read/Write, Burst Mode NOR Flash NAND Flash or NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 S72WS-P based MCP/PoP Products Cover Sheet Data Sheet Advance Information


    Original     		S72WS-P S72WS512PFFJF9GH BGA 15X15 BGA 130 MCP NAND DDR 12X12 POP PACKAGE TRAY 15x15 bta 137 S72WS512PFFKFKGH N-ADQ14 NAND01 PDF

    transistor b 1238

    Abstract: PCB design for very fine pitch csp package tray datasheet bga 8x9 5 ball csp drawing BGA PACKAGE TOP MARK intel land pattern BGA 0.75 SCR Manual, General electric databook N4646 15 ball CSP bga 6x8 tray dimension
    Text: The Micro Ball Grid Array µBGA Package The Micro Ball Grid Array (µBGA*) Package 15.1 15 Introduction The Micro Ball Grid Array package (µBGA*) is considered a “chip size” package (CSP). A chip size package is generally defined as a package which does not exceed the die size by greater than


    Original     		PDF

    BGA 130 MCP NAND DDR

    Abstract: JEP95 137-Ball DSA00272754 Flash MCp nand DRAM 137-ball S72WS512PEF N-ADQ12 130 MCP NAND DDR NAND FLASH BGA Flash MCp nand DRAM 107-ball
    Text: S72WS-P based MCP/PoP Products 1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus Simultaneous Read/Write, Burst Mode NOR Flash NAND Flash or NAND Interface ORNAND Flash on Bus 1 Mobile SDRAM on Bus 2 S72WS-P based MCP/PoP Products Cover Sheet Data Sheet Advance Information


    Original     		S72WS-P BGA 130 MCP NAND DDR JEP95 137-Ball DSA00272754 Flash MCp nand DRAM 137-ball S72WS512PEF N-ADQ12 130 MCP NAND DDR NAND FLASH BGA Flash MCp nand DRAM 107-ball PDF

    Untitled

    Abstract: No abstract text available
    Text: ispLSI 5384VA In-System Programmable 3.3V SuperWIDE High Density PLD — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER — PC and UNIX Platforms Features • SuperWIDE HIGH-DENSITY IN-SYSTEM PROGRAMMABLE LOGIC


    Original     		5384VA 0212/5384va 5384VA-125LQ208 5384VA-125LB208 5384VA-125LB272 5384VA-125LB388 5384VA-100LQ208 5384VA-100LB208 5384VA-100LB272 5384VA-100LB388 PDF

    5000VA

    Abstract: 5256VA 5384VA 5512VA
    Text: ispLSI 5512VA In-System Programmable 3.3V SuperWIDE High Density PLD Generic Logic Block Generic Logic Block Input Bus Input Bus Input Bus Input Bus Input Bus Generic Logic Block Generic Logic Block Generic Logic Block Input Bus Generic Logic Block Generic


    Original     		5512VA 0212/5512va ispLSI5512VA-110LB272 272-Ball 5512VA-110LB388 388-Ball 5512VA-110LQ208 208-Pin 5512VA-100LB272 5000VA 5256VA 5384VA 5512VA PDF

    Untitled

    Abstract: No abstract text available
    Text: ispLSI 5512VA In-System Programmable 3.3V SuperWIDE High Density PLD — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER — PC and UNIX Platforms Features • SuperWIDE HIGH-DENSITY IN-SYSTEM PROGRAMMABLE LOGIC


    Original     		5512VA 388-Ball 272-Ball 208-Pin 0212/5512va ispLSI5512VA-110LB272 5512VA-110LB388 5512VA-110LQ208 5512VA-100LB272 5512VA-100LB388 PDF

    Untitled

    Abstract: No abstract text available
    Text: ispLSI 5512VA In-System Programmable 3.3V SuperWIDE High Density PLD — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER — PC and UNIX Platforms Features • SuperWIDE HIGH-DENSITY IN-SYSTEM PROGRAMMABLE LOGIC


    Original     		5512VA 388-Ball 272-Ball 208-Pin 0212/5512va ispLSI5512VA-110LB272 5512VA-110LB388 5512VA-110LQ208 5512VA-100LB272 5512VA-100LB388 PDF

    A12B11

    Abstract: d-t pt 5000VA 5256VA 5384VA 5512VA 5512VA-110LB388 208pin PQFP
    Text: ispLSI 5512VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		5512VA 0212/5512va ispLSI5512VA-110LB272 272-Ball 5512VA-110LB388 388-Ball 5512VA-110LQ208 208-Pin 5512VA-100LB272 A12B11 d-t pt 5000VA 5256VA 5384VA 5512VA 5512VA-110LB388 208pin PQFP PDF

    b20 p03

    Abstract: B20 n03
    Text: ispLSI 5512VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		5512VA 388-BGA 0212/5512va ispLSI5512VA-110LB272 5512VA-110LB388 5512VA-110LQ208 5512VA-100LB272 5512VA-100LB388 5512VA-100LQ208 5512VA-70LB272 b20 p03 B20 n03 PDF

    5000VA

    Abstract: 5256VA 5384VA 5512VA
    Text: ispLSI 5512VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		5512VA 0212/5512va ispLSI5512VA-110LB272 272-Ball 5512VA-110LB388 388-Ball 5512VA-110LQ208 208-Pin 5512VA-100LB272 5000VA 5256VA 5384VA 5512VA PDF

    A09 N03

    Abstract: 5000VA 5256VA 5384VA 5512VA
    Text: ispLSI 5384VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 A09 N03 5000VA 5256VA 5384VA 5512VA PDF

    234 N02

    Abstract: No abstract text available
    Text: ispLSI 5384VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		5384VA 388-BGA 0212/5384va 5384VA-125LQ208 5384VA-125LB208 5384VA-125LB272 5384VA-125LB388 5384VA-100LQ208 5384VA-100LB208 5384VA-100LB272 234 N02 PDF

    A09 N03

    Abstract: LF 251 K01 B20 N03
    Text: Lattice ; ; ; ; Semiconductor •• ■■ Corporation ispLSr 5384VA VANTI S In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore


    OCR Scan     		5384VA 5384VA-125LQ208 5384VA-125LB208 5384VA-125LB272 5384VA-125LB388 5384VA-100LQ208 5384VA-100LB208 5384VA-100LB272 5384VA-100LB388 5384VA-70LQ208 A09 N03 LF 251 K01 B20 N03 PDF

    5000VA

    Abstract: A09 N03 b20 p03 5256VA 5384VA 5512VA 234 N02 5384VA-70L T14 N03 283 g23
    Text: ispLSI 5384VA In-System Programmable 3.3V SuperWIDE High Density PLD — Superior Quality of Results — Tightly Integrated with Leading CAE Vendor Tools — Productivity Enhancing Timing Analyzer, Explore Tools, Timing Simulator and ispANALYZER™ — PC and UNIX Platforms


    Original     		5384VA 5384VA-125LB208 208-Ball 5384VA-125LB272 272-Ball 5384VA-125LB388 388-Ball 5384VA-100LQ208 208-Pin 5384VA-100LB208 5000VA A09 N03 b20 p03 5256VA 5384VA 5512VA 234 N02 5384VA-70L T14 N03 283 g23 PDF