Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINK – FHE Series High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6
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21x21
45x45
FHE35-35-27
/T710
/T410
/T411
/T412
FHE35-35-27/T710/T
RevA0614
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net eN8
Abstract: TDN01 crpa 8B10B P802 TLK3118 XGXS quad video processor
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
21x21mm,
400-Ball,
10-Gbps
3ae-2002
net eN8
TDN01
crpa
8B10B
P802
TLK3118
XGXS
quad video processor
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Untitled
Abstract: No abstract text available
Text: Product: XRT83VSH316IB-F Package: 316L L‐fpBGA 21x21 Material Declaration Statement of Materials, Construction Material Component Material Weight % Name Weight (g) Element/Compound CAS No. 1 Die 0.0360 Silicon 7440‐21‐3 0.0360
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XRT83VSH316IBâ
21x21)
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K297
Abstract: net eN8 TDN01
Text: TLK3118 Redundant XAUI Transceiver www.ti.com SLLS628C – DECEMBER 2004 – REVISED APRIL 2007 • • • • • • • • • • • Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0)
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TLK3118
SLLS628C
10-Gbps
3ae-2002
K297
net eN8
TDN01
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8B10B
Abstract: P802 TLK3118 RXD17
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
8B10B
P802
TLK3118
RXD17
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5060A
Abstract: Shenzhen ditelong industrial Co., Ltd 1800X1
Text: NO.：QB/SPS 73 PS 5060A SPECIFICATIONS NAME: 21X21 FULL COLOR LED CLUSTER TYPE: LCS21121Q4A-121 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China
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21X21
LCS21121Q4A-121
LCS--21121Q4A-121
500X2
1800X1
5060A
Shenzhen ditelong industrial Co., Ltd
1800X1
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prbs parity checker and generator
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628
10-Gbps
3ae-2002
prbs parity checker and generator
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PRBG0268FB-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA268-21x21-1.00 RENESAS Code PRBG0268FB-A D MASS[Typ.] 1.3g A b A D1 ZD A1 S AB e y S Index mark S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 268F7X-C 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA268-21x21-1
PRBG0268FB-A
268F7X-C
PRBG0268FB-A
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PRBG0272FA-A
Abstract: BGA272 PBGA272 P-BGA272-21x21-1 P-BGA-272
Text: JEITA Package Code P-BGA272-21x21-1.00 RENESAS Code PRBG0272FA-A Previous Code BP-272/BP-272V MASS[Typ.] 1.3g D w S B E w S A 4x v y1 S y A1 A S S e ZD A e Y W V U T R Reference Symbol P B N Dimension in Millimeters Min Nom Max D 21.0 K E 21.0 J v 0.20 w
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P-BGA272-21x21-1
PRBG0272FA-A
BP-272/BP-272V
PRBG0272FA-A
BGA272
PBGA272
P-BGA-272
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1
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21x21
45x45
confid3-17
FHL31-31-17
/T410
/T411
/T412
FHL43-43-17/T710/T
RevB1014
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5032A
Abstract: LCS-21036Q3A-033
Text: NO.：QB/SPS 73 PS 5032A SPECIFICATIONS NAME: 21X21 DUAL COLOR LED CLUSTER TYPE: LCS21036Q3A-033 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China
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21X21
LCS21036Q3A-033
LCS--21036Q3A-033
600X3
250X6
5032A
LCS-21036Q3A-033
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5023a
Abstract: LCS-21008
Text: NO.：QB/SPS 73 PS 5023A SPECIFICATIONS NAME: 21X21 SINGLE COLOR LED CLUSTER TYPE: LCS21008 Y Q2A-004 SHENZHEN DITELONG INDUSTRIAL CO.,LTD. SHENZHEN CANDELA ELECTRONIC CO.,LTD. SHENZHEN SUCCESS PHOTOELECTRONICS CO.,LTD SHENZHEN OFFICE Add: Room 1911,Zhongwin Science & Techn.Bldg,Bagua 3th Rd.Bagualing Industry Zone Shenzhen,China
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21X21
LCS21008
Q2A-004
LCS--21008
1000X8
5023a
LCS-21008
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TDN01
Abstract: TDP01/TDN01 net eN8 acq2 RDN01 130nm CMOS
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
SLLS628B
10-Gbps
3ae-2002
TDN01
TDP01/TDN01
net eN8
acq2
RDN01
130nm CMOS
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Untitled
Abstract: No abstract text available
Text: HI-TEMP FAN HEAT SINKS – FHL SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 28.1
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21x21
45x45
confid43-43-16
FHL31-31-18
/T710
/T410
/T411
/T412
FHL43-43-16/T710/T
RevA0614
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j 6810
Abstract: J 6810 D PGA zif socket 289 ASTM B545 amp pga socket
Text: ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid FEATURES • A strong, metal cam activates the normally closed contacts, preventing dependency on plastic for contact force • The handle can be provided on right or left hand side
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13x13
21x21
MIL-G-45204
B545-97
QQ-N-290
j 6810
J 6810 D
PGA zif socket 289
ASTM B545
amp pga socket
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PRBG0449GA-A
Abstract: BP-449V
Text: JEITA Package Code P-FBGA449-21x21-0.80 RENESAS Code PRBG0449GA-A Previous Code BP-449V MASS[Typ.] 1.4g D w S B E w S A 4x v y1 S y A1 A S S e ZD A e AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A Reference Symbol B Dimension in Millimeters Min Nom
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P-FBGA449-21x21-0
PRBG0449GA-A
BP-449V
PRBG0449GA-A
BP-449V
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BGA 15X15
Abstract: No abstract text available
Text: Daisy Chain Package Design 15mm, 321 MAP BGA, 0.65mm Pitch 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 A B C D E F G H * 0.65 mm Pitch * 21x21 Array * 9 Thermal Balls * 15x15 mm Body Size * 0.3 mm Solder Ball Diameter J K L M N P R T U V W Y AA Slide 1
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21x21
15x15
BGA 15X15
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PGA zif socket 289
Abstract: No abstract text available
Text: ZIF PGA Test & Burn-in Socket for Any Footprint on Std 13x13 to 21x21 Grid FEATURES • A strong, metal cam activates the normally closed contacts, preventing dependency on plastic for contact force • The handle can be provided on right or left hand side
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13x13
21x21
MIL-G-45204
B545-97
QQ-N-290
PGA zif socket 289
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Untitled
Abstract: No abstract text available
Text: FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6
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FHS-090
21x21
45x45
/T410
/T411
/T412
FHE40-40-40/A01/T
RevB0314
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Untitled
Abstract: No abstract text available
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
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TDP01/TDN01
Abstract: TDN21 XAUI 8B10B P802 TLK3118 c20d10
Text: TLK3118 Redundant XAUI Transceiver www.ti.com • • • • • • • • • • • Fabricated in Advanced 130-nm CMOS Technology Package: Small Footprint 21x21mm, 400-Ball, Fine Pitch 1mm PBGA TLK3118 TDP/N[3:0]0 TCLK TD(31.0) TC(3.0) RCLK RD(31.0)
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TLK3118
130-nm
21x21mm,
400-Ball,
10-Gbps
3ae-2002
TDP01/TDN01
TDN21
XAUI
8B10B
P802
TLK3118
c20d10
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Untitled
Abstract: No abstract text available
Text: HIGH TEMP FAN HEAT SINKS - FHS-090 SERIES High Operating Temperature Integrated Fan Heat Sinks DESIGN FEATURES • Industry-leading maximum operating temperature of 90°C ■ Compatible with chipset footprints ranging from 21x21 mm to 45x45 mm ■ Total heights from 16.1 mm for low profile applications to 44.6 mm
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FHS-090
21x21
45x45
/T410
/T411
/T412
FHE40-40-40/A01/T
FHE40-40-40/T710/T
RevD1014
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PRBG0268FA-A
Abstract: No abstract text available
Text: JEITA Package Code P-BGA268-21x21-1.00 RENESAS Code PRBG0268FA-A D A D1 MASS[Typ.] 1.6g b A ZD A1 S AB e y S Index mark S ZE Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 268F7X-B 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Reference
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P-BGA268-21x21-1
PRBG0268FA-A
268F7X-B
PRBG0268FA-A
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