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    1186

    Abstract: SNC745 1186-25
    Text: SNC745 BONDING PAD LOCATION PROJECT: SNC745 NO PAD NAME VR1=75K VR2=100K X um Y(um) NO 1 GND 1827.49 263.00 2 BP0 1827.49 3 VDD X(um) Y(um) 24 P0.11 -194.15 1186.25 420.40 25 P0.12 -304.15 1186.25 1827.49 586.20 26 P0.13 -414.15 1186.25 4 BN0 1827.49 752.00


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    SNC745 SNC745 2480um 1186 1186-25 PDF