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    28 LEADLESS CHIP CARRIER DWG Search Results

    28 LEADLESS CHIP CARRIER DWG Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    GCM188D70E226ME36D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C71A472KE19L Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM033C81A224KE01W Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155D70G475ME15D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd
    GRM155R61J334KE01D Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    28 LEADLESS CHIP CARRIER DWG Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    kyocera CERAMIC LEADLESS CHIP CARRIER LCC

    Abstract: Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER
    Text: Statement of Material Content Ceramic LCC Packages STK11C68-L STK12C68-L STK14C88-L This package type is not available in a lead-free version. Detail 28 350 LEADLESS CHIP CARRIER Unit 32 450 LEADLESS CHIP CARRIER PACKAGE MATERIALS Simtek Package ID Pin/Lead Count


    Original     		PDF STK11C68-L STK12C68-L STK14C88-L STK-91-01-2303 PB-CA1771 STK-91-01-2803 STK-40-05-007 MO-041 CQCC3-N28 5x10-8 kyocera CERAMIC LEADLESS CHIP CARRIER LCC Matthey 100 PIN LEADLESS CHIP CARRIER kyocera kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC 20 PIN LEADLESS CHIP CARRIER kyocera kyocera 32 lead ceramic LCC package kyocera LCC ntk 32 lcc package stk 014 kyocera PACKAGE CERAMIC LEADLESS CHIP CARRIER

    kds9

    Abstract: kyocera 48 lead ceramic LCC package stk 0035 n PL0181 stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97
    Text: Simtek Corporation Product Packaging Data This document is intended to provide Simtek customers with key information as outlined below for package types used for Simtek nvSRAM products. For additional information contact Simtek at [email protected]. For RoHS Materials


    Original     		PDF Outlin420 5x10-8 75psig PL0181 kds9 kyocera 48 lead ceramic LCC package stk 0035 n stk 014 IDK28F1 ntk 32 lcc package 14CA8 sk9173 JESD97

    arinc 700

    Abstract: No abstract text available
    Text: HI-8483 ARINC 429 Dual Line Receiver February 2012 GENERAL DESCRIPTION The HI-8483 bus interface unit is a dual differential line receiver in accordance with the requirements of the ARINC 429 bus specification. The device translates incoming ARINC 429 signals to normal CMOS/TTL levels on each


    Original     		PDF HI-8483 HI-8483 RM3283 DEI3283. 20-PIN arinc 700

    HI-8483

    Abstract: DEI3283 ic 7493 truth table RM3283 HI-8585 arinc 700
    Text: HI-8483 ARINC 429 Dual Line Receiver March 2010 GENERAL DESCRIPTION The HI-8483 bus interface unit is a dual differential line receiver in accordance with the requirements of the ARINC 429 bus specification. The device translates incoming ARINC 429 signals to normal CMOS/TTL levels on each


    Original     		PDF HI-8483 HI-8483 RM3283 DEI3283. 20-PIN DEI3283 ic 7493 truth table HI-8585 arinc 700

    cc5r

    Abstract: HRF-ROC093XC
    Text: HRF-ROC093XC Advance Information Radio On A Chip 860-928 MHz Frequency Agile With SPI Bus Interface Description Features • · · · · · · · · · · High Integration Minimizes System Cost Data Rates from 4 to 128.8 Kbits/Sec Direct Connection To Microprocessor


    Original     		PDF HRF-ROC093XC HRF-ROC093XC 09325XC cc5r

    MIL-STD-1835 CQCC1-N28

    Abstract: MARK F4 5K
    Text: HM-6642/883 Data Sheet March 2004 FN3013.2 512 x 8 CMOS PROM Features The HM-6642/883 is a 512 x 8 CMOS NiCr fusible link Programmable Read Only Memory in the popular 24 pin, byte wide pinout. Synchronous circuit design techniques combine with CMOS processing to give this device high


    Original     		PDF HM-6642/883 FN3013 HM-6642/883 MIL-STD-883 MIL-STD-1835 CQCC1-N28 MARK F4 5K

    Untitled

    Abstract: No abstract text available
    Text: HS-3182 Data Sheet May 30, 2008 ARINC 429 Bus Interface Line Driver Circuit FN2963.3 Features The HS-3182 is a monolithic dielectric ally isolated bipolar differential line driver designed to meet the specifications of ARINC 429. This device is intended to be used with a


    Original     		PDF HS-3182 FN2963 HS-3182 HS-3282 HS-3182.

    VCO in pic microcontroller

    Abstract: HRF-ROC093XC HRF-ROC093XC-K pic kit
    Text: HRF-ROC093XC Advance Information Radio On A Chip 860-928 MHz Frequency Agile With SPI Bus Interface Description Features x x x x x x x x x x x High Integration Minimizes System Cost Data Rates from 4 to 128.8 Kbits/Sec Direct Connection To Microprocessor


    Original     		PDF HRF-ROC093XC HRF-ROC093XC 09325XC VCO in pic microcontroller HRF-ROC093XC-K pic kit

    HS-3282

    Abstract: HS-3182 HS3282 5962-86879013A 5962-8687901EA HS1-3182-8 HS1-3182-9 HS4-3182-8 CB12C-A hs131
    Text: HS-3182 Data Sheet May 30, 2008 ARINC 429 Bus Interface Line Driver Circuit FN2963.3 Features The HS-3182 is a monolithic dielectric ally isolated bipolar differential line driver designed to meet the specifications of ARINC 429. This device is intended to be used with a


    Original     		PDF HS-3182 FN2963 HS-3182 HS-3282 HS-3182. HS3282 5962-86879013A 5962-8687901EA HS1-3182-8 HS1-3182-9 HS4-3182-8 CB12C-A hs131

    HS-3182

    Abstract: 5962-86879013A 5962-8687901EA HS1-3182-8 HS1-3182-9 HS-3282 HS4-3182-8 MIL-STD-1835 CQCC1-N28
    Text: HS-3182 Data Sheet June 5, 2007 ARINC 429 Bus Interface Line Driver Circuit FN2963.2 Features The HS-3182 is a monolithic dielectrically isolated bipolar differential line driver designed to meet the specifications of ARINC 429. This Device is intended to be used with a


    Original     		PDF HS-3182 FN2963 HS-3182 HS-3282 HS-3182. 5962-86879013A 5962-8687901EA HS1-3182-8 HS1-3182-9 HS4-3182-8 MIL-STD-1835 CQCC1-N28

    sol18 package

    Abstract: MS-012AA Package PLCC-44 SMD SOL18 64 CERAMIC LEADLESS CHIP CARRIER LCC MS 013AA sol 20 Package PLCC-20 SOL-18
    Text: APPLICATIONS INFORMATION SURFACE-MOUNT IC PACKAGES Significant benefits can be achieved through the use of surfacemounted devices SMDs and general surface-mount technology as it applies to all components, both active and passive. The major benefits are reduced size and weight, and improved system reliability through


    Original     		PDF OA-005-14 SOL-16 PLCC-44 OA-005-17 OA-007-44 SOL-20B OA-005-21 sol18 package MS-012AA Package PLCC-44 SMD SOL18 64 CERAMIC LEADLESS CHIP CARRIER LCC MS 013AA sol 20 Package PLCC-20 SOL-18

    sol18 package

    Abstract: PLCC-44 SMD SOL 18 package SOL18 ELECTRICAL WIRING SOL-28 64 CERAMIC LEADLESS CHIP CARRIER LCC SOL-24B MS 013AA sol 20 Package
    Text: SURFACE-MOUNT IC PACKAGES APPLICATIONS INFORMATION SURFACE-MOUNT IC PACKAGES Significant benefits can be achieved through the use of surfacemounted devices SMDs and general surface-mount technology as it applies to all components, both active and passive. The major benefits


    Original     		PDF OA-005-14 SOL-16 PLCC-44 OA-005-17 OA-007-44 SOL-20B OA-005-21 sol18 package PLCC-44 SMD SOL 18 package SOL18 ELECTRICAL WIRING SOL-28 64 CERAMIC LEADLESS CHIP CARRIER LCC SOL-24B MS 013AA sol 20 Package

    transistor BC 458

    Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		PDF MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE

    transistor BC 458

    Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		PDF

    AN-1187

    Abstract: MO-220 MO-229 package tray design dwg
    Text: Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 AN-1187 MO-220 MO-229 package tray design dwg

    LT1236S

    Abstract: LT6654LS8 LT1236N LTC2442
    Text: LT1236LS8 Precision, Low Noise, Low Profile Hermetic Voltage Reference Features Description Hermetic 5mm x 5mm LCC Leadless Chip Carrier Package: Insensitive to Humidity Thermal Hysteresis: 8ppm 0°C to 70°C Thermal Hysteresis: 60ppm (–40°C to 85°C)


    Original     		PDF LT1236LS8 60ppm 10ppm/ 1236LS8 1236ls8f LT1236S LT6654LS8 LT1236N LTC2442

    28 LEADLESS CHIP CARRIER DWG

    Abstract: MS-009-AE
    Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER DCN REV DESCRIPTION 17 295 05 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A E NOTES: 2. E UNLES OTHERWISE SPECIFIED; BSC - BASIC LEAD SPACING BETWEEN CENTERS. DWG # SYMBOL MIN A .060 .075 A1 .050 .065 B1 R9 L 20-1


    OCR Scan     		PDF L20-1 28 LEADLESS CHIP CARRIER DWG MS-009-AE

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductor» RF Communications Products Product specification High frequency operational amplifier NE/SE5539 DESCRIPTION FEATURES The NE/SE5539 is a very wide bandwidth, high slew rate, monolithic operational amplifier for use in video amplifiers, RF


    OCR Scan     		PDF NE/SE5539 NE/SE5539 350MHz 48MHz 600/VfXs 22-Lead T-90-20 14-Pin 16-Pin

    NE5539

    Abstract: Side Brazed Ceramic Dual-In-Line Packages 28 NE5539D NE5539F NE5539N SE5539 SE5539F NE-SE5539 BUSS BBS3 avx7
    Text: Philips Semiconductor» RF Communications Products Product specification High frequency operational amplifier DESCRIPTION FEATURES The NE/SE5539 is a very wide bandwidth, high slew rate, monolithic operational amplifier for use in video amplifiers, RF amplifiers, and extremely high slew rate


    OCR Scan     		PDF NE/SE5539 NE5539 SE5539 350MHz 48MHz 600/VfXs 14-Pin 16-Pln Side Brazed Ceramic Dual-In-Line Packages 28 NE5539D NE5539F NE5539N SE5539F NE-SE5539 BUSS BBS3 avx7

    7293

    Abstract: No abstract text available
    Text: PACKAGE DIAGRAM O U T L I N E S LEADLESS CHIP CARRIER DCN REV DESCRIPTION DATE 17 295 05 UPDATE TO STANDARDIZE DRAWING APPROVAL A E NOTES: 2. E UNLES OTHERWISE SPECIFIED; BSC - BASIC LEAD SPACING BETWEEN CENTERS. DWG # SYMBOL MIN MAX A .060 .075 A1 .050 .065


    OCR Scan     		PDF L20-1 7293

    ULS2821H

    Abstract: No abstract text available
    Text: 2801 2825 . , HIGH-VOLTAGE HIGH-CURRENT DARLINGTON ARRAYS Designed to serve as interface between low-level circuitry and high-power loads, Series ULS2800EK, ULS2800H, and ULS2800R arrays consist of eight silicon NPN Darlington power drivers on a common monolithic substrate. They are ideally suited to driving relays,


    OCR Scan     		PDF ULS28XXH/R ULS2800EK, ULS2800H, ULS2800R MIL-STD-883, 18-pin ULS2821H

    l282

    Abstract: L-282
    Text: PACKAGE DIAGRAM OUTLINES LEADLESS CHIP CARRIER C o n t i n u e d DCN REV DESCRIPTION 17288 03 UPDATE TO STANDARDIZE DRAWING DATE APPROVAL A A1 NOTES: (UNLES OTHERWISE SPECIFIED; 1. ALL DIMENSIONS ARE IN INCHES. 2. BSC - BASIC LEAD SPACING BETWEEN CENTERS.


    OCR Scan     		PDF L28-2 l282 L-282

    9998A

    Abstract: 871A CERAMIC LEADLESS CHIP CARRIER ULS-28X3 9734A AKHA1S ULS280XEK ULS2821H
    Text: m i? . HIGH-VOLTAGE, H IG H -CU RRENT D ARLIN G TO N ARRAYS Designed to serve as interface between low-level circuitry and high-power loads, Series ULS2800EK, ULS2800H, and ULS2800R arrays consist of eight silicon NPN Darlington power drivers on a common monolithic substrate. They are ideally suited to driving relays,


    OCR Scan     		PDF ULS28XXH/R ULS280X* ULS281X* ULS282X* ULS28X2* ULS28X5* ULS28X2' 9998A 871A CERAMIC LEADLESS CHIP CARRIER ULS-28X3 9734A AKHA1S ULS280XEK ULS2821H

    t724

    Abstract: 72221L12 811B
    Text: CMOS SyncFlFO 6 4 X 9 , 256x9, 512x9, 1,024 X 9, 2,048 X 9, 4,096 x 9 and 8,192 x 9 I n t e g r a t e d D e v iz e T e c h n o lo g y , l i e . FEATURES: • • • • • • • • • • • • • • • • • • • • 64 x 9-bit organization IDT72421


    OCR Scan     		PDF 256x9, 512x9, IDT72421 IDT72201 IDT72211 IDT72221 IDT72231 IDT72241 IDT72251 IDT72421) t724 72221L12 811B