SUMITOMO EME G600
Abstract: EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
Text: 32 & 64-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0809 (v1.0) September 12, 2008 Overview This notice describes the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.
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64-Lead
32-Lead
PCN0809
7351LS,
JESD46-C,
QR-8036
SUMITOMO EME G600
EME G600
Moisture Sensitivity Level Rating
8050P
sumitomo lcd
1575P
JESD46-C
pc/SUMITOMO g600
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PDF
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TQ32
Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*
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Jul-00
Oct-00
Jan-01
Apr-01
Jul-01
Oct-01
10X10,
TQ32
ablestik
amkor
amkor cabga
Nitto
ASE LQFP 208
CABGA 6x6
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PDF
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A48A
Abstract: A101 120-PIN 7x7x1.4 160-PIN plastic quad flat pack 10X10X1.4 tqfp 44
Text: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.4 mm A32.14 51-85088-*B 1 Package Diagrams 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 44-Lead Thin Plastic Quad Flat Pack 10 x 10 x 1.0 mm A44SB
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32-Lead
51-85063-B
44-Lead
51-85064-B
A44SB
48-Lead
52-Lead
A48A
A101
120-PIN
7x7x1.4
160-PIN
plastic quad flat pack
10X10X1.4 tqfp 44
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32-lead TQFP
Abstract: No abstract text available
Text: PACKAGE INFORMATION Micrel 32 LEAD TQFP DIE UP (T32-1) Rev. 01 Rev.: C 1 Amendment: 0 Issue Date: July, 1999
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T32-1)
32-lead TQFP
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Untitled
Abstract: No abstract text available
Text: MN101C77A, MN101C77C, MN101C77D Type MN101C77A MN101C77C MN101C77D under development ROM (x× 8-bit) 32 K 48 K 64 K RAM (×× 8-bit) 1.5 K Package LQFP064-P-1414 3K *Lead-free 6K *Lead-free LQFP064-P-1414 TQFP064-P-1010C *Lead-free LQFP064-P-1414 *Lead-free
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MN101C77A,
MN101C77C,
MN101C77D
MN101C77A
LQFP064-P-1414
MN101C77C
LQFP064-P-1414
TQFP064-P-1010C
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PDF
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MN101C77A
Abstract: No abstract text available
Text: MN101C77A, MN101C77C, MN101C77D Type MN101C77A MN101C77C MN101C77D under development ROM (x× 8-bit) 32 K 48 K 64 K RAM (×× 8-bit) 1.5 K Package LQFP064-P-1414 2K *Lead-free 6K *Lead-free LQFP064-P-1414 TQFP064-P-1010C *Lead-free LQFP064-P-1414 *Lead-free
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MN101C77A,
MN101C77C,
MN101C77D
MN101C77A
LQFP064-P-1414
MN101C77C
LQFP064-P-1414
TQFP064-P-1010C
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PDF
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Untitled
Abstract: No abstract text available
Text: MN101C77A, MN101C77C, MN101C77D Type MN101C77A MN101C77C MN101C77D under development ROM (x× 8-bit) 32 K 48 K 64 K RAM (×× 8-bit) 1.5 K Package LQFP064-P-1414 2K *Lead-free 6K *Lead-free LQFP064-P-1414 TQFP064-P-1010C *Lead-free LQFP064-P-1414 *Lead-free
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MN101C77A,
MN101C77C,
MN101C77D
MN101C77A
LQFP064-P-1414
MN101C77C
LQFP064-P-1414
TQFP064-P-1010C
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H321
Abstract: H32-1
Text: PACKAGE INFORMATION Micrel 32 LEAD EPAD-TQFP DIE UP (H32-1) Rev. 01 Rev.: A 1 Amendment: 0 Issue Date: February 2000
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H32-1)
H321
H32-1
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : TQFP 32 Lead #: No 1 2 3 4 5 6 7 Rev A B C D Material Molding Compound Copper Alloy Frame Lead frame plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die ECN 080105HC05 121010HC01 030411HC02
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TQFP7x7-32LD-GRN-RS-1
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MS-026ABA
Abstract: 241-Pin
Text: 32-Lead Thin Plastic Quad Flat Package [TQFP] SU-32-2 a Dimensions shown in millimeters 0.75 0.60 0.45 1.20 MAX 9.00 BSC SQ 25 32 24 1 PIN 1 1.05 1.00 0.95 0.15 0.05 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY SEATING PLANE VIEW A 7.00 BSC SQ TOP VIEW (PINS DOWN)
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32-Lead
SU-32-2)
MS-026ABA
MS-026ABA
241-Pin
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Untitled
Abstract: No abstract text available
Text: MN101C97A, MN101C97D Type ROM x× 8-bit RAM (×× 8-bit) Package MN101C97A (under development) MN101C97D (under development) 32 K 64 K 1.0 K 1K TQFP048-P-0707B *Lead-free (under development), QFP044-P-1010F *Lead-free (under planning), QFN044-P-0606A *Lead-free (under planning)
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MN101C97A,
MN101C97D
MN101C97A
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Lu32
Abstract: MS-026
Text: LU Package 32-Lead Plastic TQFP 5mm x 5mm (Reference LTC DWG # 05-08-1735 Rev Ø) 5.15 – 5.25 7.00 BSC 3.50 REF 5.00 BSC 32 0.50 BSC 1 2 3 32 SEE NOTE: 4 1 2 3 3.50 REF 7.00 BSC 5.00 BSC 5.15 – 5.25 A A 0.22 – 0.30 PACKAGE OUTLINE SEE NOTE: 5 1.30 MIN
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32-Lead
MS-026
Lu32
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PDF
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Untitled
Abstract: No abstract text available
Text: MN101C54A , MN101C54C Type MN101C54A MN101C54C ROM x× 8-bit 32 K 48 K RAM (×× 8-bit) 2K 2K Package QFP084-P-1818E *Lead-free, LQFP080-P-1414A *Lead-free, TQFP080-P-1212D *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 4.5 V to 5.5 V, 20 MHz)
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MN101C54A
MN101C54C
MN101C54A
LQFP080-P-1414A
TQFP080-P-1212D:
LQFP080-P-1414A
QFP084-P-1818E
TQFP080-P-1212D
MN101CF54D
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MN101C54C
Abstract: MN101C54A LQFP080-P-1414A QFP084-P-1818E P-51
Text: MN101C54A , MN101C54C Type MN101C54A MN101C54C ROM x× 8-bit 32 K 48 K RAM (×× 8-bit) 2K 2K Package QFP084-P-1818E *Lead-free, LQFP080-P-1414A *Lead-free, TQFP080-P-1212D *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 4.5 V to 5.5 V, 20 MHz)
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MN101C54A
MN101C54C
QFP084-P-1818E
LQFP080-P-1414A
TQFP080-P-1212D
MN101C54C
MN101C54A
LQFP080-P-1414A
QFP084-P-1818E
P-51
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MAX9420
Abstract: MAX9420EHJ MAX9421 MAX9421EHJ MAX9422 MAX9422EHJ MAX9423 MAX9423EHJ
Text: 19-2285; Rev 0; 1/02 Quad Differential LVECL-to-LVPECL Translators The MAX9420–MAX9423 are specified for operation from -40°C to +85°C, and are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead 5mm ✕ 5mm QFN packages. Applications Features
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MAX9420
MAX9423
32-pin
32-lead
500mV
336ps
MAX9421/MAX9423)
MAX9422/MAX9423)
MAX9420EHJ
MAX9421EHJ
MAX9420EHJ
MAX9421
MAX9421EHJ
MAX9422
MAX9422EHJ
MAX9423EHJ
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MAX9420
Abstract: MAX9420EHJ MAX9421 MAX9421EHJ MAX9422 MAX9422EHJ MAX9423 MAX9423EHJ QFN50
Text: 19-2285; Rev 0; 1/02 Quad Differential LVECL-to-LVPECL Translators The MAX9420–MAX9423 are specified for operation from -40°C to +85°C, and are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead 5mm ✕ 5mm QFN packages. Applications Features
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MAX9420
MAX9423
32-pin
32-lead
500mV
336ps
MAX9421/MAX9423)
MAX9422/MAX9423)
MAX9420EHJ
MAX9421EHJ
MAX9420EHJ
MAX9421
MAX9421EHJ
MAX9422
MAX9422EHJ
MAX9423EHJ
QFN50
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PDF
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : Component Weight : TQFP-EPAD 7x7 mm Document No : Lead #: 32 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating
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TQFPEP7x7-32LD-GRN-RS-1
080205HC04
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PDF
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Untitled
Abstract: No abstract text available
Text: Reportable Substances in Components Package Type : Component Weight : TQFP-EPAD 7x7 mm Document No : Lead #: 32 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire Solder Lead Plating
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111703HC14
082611HC12
TQFPEP7x7-32LD-PBY-RS-1
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PDF
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ADV0406
Abstract: TQFP 32 PACKAGE altera TQFP 32 PACKAGE MS-026 MS-026 TQFP
Text: CUSTOMER ADVISORY ADV0406 TQFP 32 PACKAGE TOP MOLD AND EJECTOR SIZE CHANGE Change Description: Due to assembly process improvements undertaken at our assembly supplier, slight dimensional changes are being made to the 32 lead thin quad flat pack TQFP packages. The dimension changes involve an increase of the top mold
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ADV0406
ADV0406
TQFP 32 PACKAGE
altera TQFP 32 PACKAGE
MS-026
MS-026 TQFP
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PDF
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MAX9400
Abstract: MAX9400EGJ MAX9400EHJ MAX9402 MAX9402EHJ MAX9403 MAX9405
Text: 19-2223; Rev 1; 1/02 Quad Differential LVECL/LVPECL Buffer/Receivers These devices operate with a supply voltage of VCC VEE = 2.375V to 5.5V, and are specified for operation from -40°C to +85°C. These devices are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead
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400mV
335ps
MAX9402/MAX9405)
MAX9403/MAX9405)
MAX9402EHJ
MAX9402EGJ*
MAX9403EHJ
MAX9403EGJ*
MAX9405EHJ
MAX9405EAX9403/MAX9405
MAX9400
MAX9400EGJ
MAX9400EHJ
MAX9402
MAX9403
MAX9405
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PDF
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Untitled
Abstract: No abstract text available
Text: 19-2223; Rev 0; 10/01 Quad Differential LVECL/LVPECL Buffer/Receivers These devices operate with a supply voltage of VCC VEE = +2.375V to +5.5V, and are specified for operation from -40°C to +85°C. These devices are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead
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MAX9400/MAX9402/MAX9403/MAX9405
335ps
MAX9400
i400/MAX9402/MAX9403/MAX9405
MAX9400/MAX9402/MAX9403/MAX9405
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PDF
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MAX9402
Abstract: MAX9402EHJ MAX9403 MAX9405 MAX9400 MAX9400EGJ MAX9400EHJ
Text: 19-2223; Rev 1; 1/02 Quad Differential LVECL/LVPECL Buffer/Receivers These devices operate with a supply voltage of VCC VEE = 2.375V to 5.5V, and are specified for operation from -40°C to +85°C. These devices are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead
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Original
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400mV
335ps
MAX9402/MAX9405)
MAX9403/MAX9405)
MAX9400EHJ
MAX9400EGJ*
MAX9402EHJ
MAX9402EGJ*
MAX9403EHJ
MAX9403EGJ*
MAX9402
MAX9403
MAX9405
MAX9400
MAX9400EGJ
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PDF
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Untitled
Abstract: No abstract text available
Text: MN101C78A Type MN101C78A under development ROM (x× 8-bit) 32 K RAM (×× 8-bit) Package 1.5 K TQFP048-P-0707B *Lead-free (under development), QFP044-P-1010F *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 3.0 V to 3.6 V, 10 MHz)
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MN101C78A
TQFP048-P-0707B
QFP044-P-1010F
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PDF
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Untitled
Abstract: No abstract text available
Text: MN101C78A Type MN101C78A under development ROM (x× 8-bit) 32 K RAM (×× 8-bit) Package 1.5 K TQFP048-P-0707B *Lead-free (under development), QFP044-P-1010F *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 3.0 V to 3.6 V, 10 MHz)
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MN101C78A
TQFP048-P-0707B
QFP044-P-1010F
PX-ICE101C
PX-PRB101C78-TQFP048-P-0707B-M
PX-PRB101C78-QFP044-P-1010F-M
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