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    32-PIN QFN PACKAGE POWER DISSIPATION FREESCALE Search Results

    32-PIN QFN PACKAGE POWER DISSIPATION FREESCALE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    MGN1S1208MC-R7 Murata Manufacturing Co Ltd DC-DC 1W SM 12-8V GAN Visit Murata Manufacturing Co Ltd
    MGN1D120603MC-R7 Murata Manufacturing Co Ltd DC-DC 1W SM 12-6/-3V GAN Visit Murata Manufacturing Co Ltd
    MGN1S1212MC-R7 Murata Manufacturing Co Ltd DC-DC 1W SM 12-12V GAN Visit Murata Manufacturing Co Ltd
    MGN1S0508MC-R7 Murata Manufacturing Co Ltd DC-DC 1W SM 5-8V GAN Visit Murata Manufacturing Co Ltd
    MGN1S0512MC-R7 Murata Manufacturing Co Ltd DC-DC 1W SM 5-12V GAN Visit Murata Manufacturing Co Ltd

    32-PIN QFN PACKAGE POWER DISSIPATION FREESCALE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: MC9S08QE32 PDF

    MC9S08SH8/4

    Abstract: MC9S08QB8
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: MC9S08AC128, MC9S08SH8/4 MC9S08QB8 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: MC9S08LL16 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: PDF

    mc9s08sh

    Abstract: MC9S08SH8
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: mc9s08sh MC9S08SH8 PDF

    98ASA00474D

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: MC9S08QE8 98ASA00474D PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    QFN 76 9x9 footprint

    Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 3.0, 12/2005 Quad Flat Pack No-Lead QFN 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance


    Original     		AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 PDF

    BD 4914

    Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
    Text: Freescale Semiconductor, Inc. Application Note AN1902/D REV. 2, 03/2002 QUAD FLAT PACK NO-LEAD QFN Freescale Semiconductor, Inc. 1.0 PURPOSE This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level reliability, electrical parasitic and thermal resistance data are included as reference.


    Original     		AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 PDF

    MC9S08QB8

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: MC9S08QB8 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: PDF

    JESD51-8

    Abstract: JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint
    Text: Freescale Semiconductor, Inc. ANALOG ICs INTEGRATED SOLUTIONS Freescale Semiconductor, Inc. PACKAGING Robust packaging is a key technology component of Analog Products. Motorola puts solutions together in single packages to accomodate power and high voltages.


    Original     		BR1568/D JESD51-8 JESD51-2 JEDEC JESD51-8 qfn 44 PACKAGE footprint 9mm surface mount package dimensions FREESCALE PACKING jesd51 8 JEDEC-STD-020 JEDEC-STD020 tqfp 44 PACKAGE footprint PDF

    MC9S08SH8/4

    Abstract: No abstract text available
    Text: Freescale Semiconductor Addendum Document Number: QFN_Addendum Rev. 0, 07/2014 Addendum for New QFN Package Migration This addendum provides the changes to the 98A case outline numbers for products covered in this book. Case outlines were changed because of the migration from gold wire to copper wire in some packages. See


    Original     		EB806: MC9S08SH8/4 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MC33882 Rev.9.0, 6/2012 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart 6 output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both serial


    Original     		MC33882 PDF

    IPC-D-330

    Abstract: JESD51-2
    Text: Freescale Semiconductor Application Note AN3962 Rev. 1.0, 10/2009 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat


    Original     		AN3962 IPC-D-330 JESD51-2 PDF

    IPC-D-330

    Abstract: AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2
    Text: Freescale Semiconductor Application Note AN3962 Rev. 2.0, 8/2010 PCB Layout Design Guide for Analog Applications By: Edward Lee, Rafael Garcia Mora 1 Purpose PCB Layout design is essential to better performance, reliability and manufacturability. Malfunctions from poor heat


    Original     		AN3962 IPC-D-330 AN3962 QFN PCB Layout guide JESD51-2 32-Pin QFN package power dissipation freescale pcb thermal Design guide pcb trace IEC-664 insulation distances JESD 51-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08QE32 Rev. 7, 9/2011 An Energy Efficient Solution by Freescale MC9S08QE32 Series Covers: MC9S08QE32 and MC9S08QE16 Features • 8-Bit HCS08 Central Processor Unit CPU – Up to 50.33 MHz HCS08 CPU at 3.6 V to 2.4 V, 40 MHz CPU at 2.4


    Original     		MC9S08QE32 MC9S08QE32 MC9S08QE16 HCS08 PDF

    32-Pin QFN package power dissipation freescale

    Abstract: PC3388
    Text: Freescale Semiconductor Technical Data Document Number: MC33882 Rev. 8.0, 5/2012 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart 6 output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both serial


    Original     		MC33882 32-Pin QFN package power dissipation freescale PC3388 PDF

    M27M6V

    Abstract: ARMv6-M Architecture Reference Manual M27M5V
    Text: Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: KL27P64M48SF2 Rev. 5, 04/2015 Kinetis KL27 Microcontroller MKL27Z32Vxx4 R MKL27Z64Vxx4(R) 48 MHz ARM Cortex®-M0+ and 32/64 KB Flash The KL27 series is optimized for cost-sensitive and batterypowered applications requiring low-power USB connectivity. The


    Original     		KL27P64M48SF2 MKL27Z32Vxx4 MKL27Z64Vxx4 M27M6V ARMv6-M Architecture Reference Manual M27M5V PDF

    MC9S08QE16

    Abstract: HC08 HCS08 MC9S08QE32 PWM generation using TPM module in HCS08 QE 98ARE10566D
    Text: Freescale Semiconductor Data Sheet: Technical Data Document Number: MC9S08QE32 Rev. 7, 9/2011 An Energy Efficient Solution by Freescale MC9S08QE32 Series Covers: MC9S08QE32 and MC9S08QE16 Features • 8-Bit HCS08 Central Processor Unit CPU – Up to 50.33 MHz HCS08 CPU at 3.6 V to 2.4 V, 40 MHz CPU at 2.4


    Original     		MC9S08QE32 MC9S08QE32 MC9S08QE16 HCS08 MC9S08QE16 HC08 PWM generation using TPM module in HCS08 QE 98ARE10566D PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: KL03P24M48SF0 Rev 4 08/2014 Kinetis KL03 32 KB Flash MKL03ZxxVFG4 MKL03ZxxVFK4 MKL03Z32CAF4R 48 MHz Cortex-M0+ Based Microcontroller Supports ultra low power 48 MHz devices with up to 32 KB


    Original     		KL03P24M48SF0 MKL03ZxxVFG4 MKL03ZxxVFK4 MKL03Z32CAF4R PDF

    98ASA00602D1

    Abstract: No abstract text available
    Text: Freescale Semiconductor, Inc. Data Sheet: Technical Data Document Number: KL03P24M48SF0 Rev 3.1 07/2014 Kinetis KL03 32 KB Flash MKL03ZxxVFG4 MKL03ZxxVFK4 MKL03Z32CAF4R 48 MHz Cortex-M0+ Based Microcontroller Supports ultra low power 48 MHz devices with up to 32 KB


    Original     		KL03P24M48SF0 MKL03ZxxVFG4 MKL03ZxxVFK4 MKL03Z32CAF4R 98ASA00602D1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor Technical Data Document Number: MC33882 Rev. 10.0, 6/2013 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart 6 output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both serial


    Original     		MC33882 PDF

    32-Pin QFN package power dissipation freescale

    Abstract: 30-PIN 32-PIN MC33882 00XXX000
    Text: Freescale Semiconductor Technical Data Document Number: MC33882 Rev. 7.0, 3/2011 Six Output Low Side Switch with SPI and Parallel Input Control 33882 The 33882 is a smart six output low side switch able to control system loads up to 1.0 A. The six outputs can be controlled via both


    Original     		MC33882 32-Pin QFN package power dissipation freescale 30-PIN 32-PIN MC33882 00XXX000 PDF