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    360-PIN BGA IBM Search Results

    360-PIN BGA IBM Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-DSDMDB09MF-010 Amphenol Cables on Demand Amphenol CS-DSDMDB09MF-010 9-Pin (DB9) Deluxe D-Sub Cable - Copper Shielded - Male / Female 10ft Datasheet
    CS-DSDMDB15MF-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB15MF-002.5 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Female 2.5ft Datasheet
    CS-DSDMDB15MM-025 Amphenol Cables on Demand Amphenol CS-DSDMDB15MM-025 15-Pin (DB15) Deluxe D-Sub Cable - Copper Shielded - Male / Male 25ft Datasheet
    CS-DSDMDB25MM-010 Amphenol Cables on Demand Amphenol CS-DSDMDB25MM-010 25-Pin (DB25) Deluxe D-Sub Cable - Copper Shielded - Male / Male 10ft Datasheet
    CS-DSDMDB37MM-002.5 Amphenol Cables on Demand Amphenol CS-DSDMDB37MM-002.5 37-Pin (DB37) Deluxe D-Sub Cable - Copper Shielded - Male / Male 2.5ft Datasheet

    360-PIN BGA IBM Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    BGA PACKAGE thermal resistance

    Abstract: PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set
    Text: MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


    Original     		MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 Nippon capacitors 304X MPC604 C4 Package PPC604 instruction set PDF

    BGA PACKAGE thermal resistance

    Abstract: cmos 4008 304X MPC604 604 semiconductor Nippon capacitors
    Text: Freescale Semiconductor, Inc. MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604 RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of


    Original     		MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance cmos 4008 304X MPC604 604 semiconductor Nippon capacitors PDF

    BGA PACKAGE thermal resistance

    Abstract: PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604
    Text: MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 Advance Information PowerPC 604™ RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


    Original     		MPR604HSU-02 MPC604EC/D 604TM BGA PACKAGE thermal resistance PPC604 instruction set Nippon capacitors 304X MPC604 MPR604HSU-02 PPC604 PDF

    DHO 165

    Abstract: Nippon capacitors Edd 44 Power PC 604 MPC604 S1313 MOTOROLA 604 MPC 428 PPC604
    Text: MPR604HSU-02 IBM O rder Number MPC604EC/D (M otorola O rder Number) 11/95 REV 1 Advance Information PowerPC 604 RISC Microprocessor Hardware Specifications The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of reduced instruction set computer (RISC) microprocessors. This document contains


    OCR Scan     		MPR604HSU-02 MPC604EC/D DHO 165 Nippon capacitors Edd 44 Power PC 604 MPC604 S1313 MOTOROLA 604 MPC 428 PPC604 PDF

    ceramic rework

    Abstract: CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Freescale Semiconductor 1 Outline for Discussion • • • • • • Why BGA? CBGA Introduction and Package Description PC Board Design for CBGA CBGA Assembly Rework Board-Level Solder Joint Reliability


    Original     		25x25x1 ceramic rework CCGA BGA Solder Ball collapse 90Pb 10Sn solder paste 304-pin ltcc MPC105 MPC106 MPC107 BGA PROFILING spray nozzles PDF

    90Pb 10Sn solder paste

    Abstract: 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola
    Text: Ceramic Ball Grid Array Packaging, Assembly & Reliability Andrew Mawer, Terry Burnette, Thomas Koschmeider and Diane Hodges Final Manufacturing Technology Center Motorola Semiconductor Products Sector 3501 Ed Bluestein Blvd., MD: F25 Austin, Texas 78721 USA


    Original     		25x25x1 90Pb 10Sn solder paste 97Pb BGA OUTLINE DRAWING ceramic rework BGA PROFILING BGA Solder Ball collapse fine BGA thermal profile pcb warpage in ipc standard bga rework CBGA motorola PDF

    D 304X transistor

    Abstract: BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB
    Text: Freescale Semiconductor, Inc. MPR604HSU-02 IBM Order Number MPC604EC/D (Motorola Order Number) 11/95 REV 1 O IC EM R, O CT U ND C IN . S E L A PowerPC 604 RISC EMicroprocessor SC E Hardware Specifications FR BY D The PowerPC 604 microprocessor is an implementation of the PowerPC™ family of


    Original     		MPR604HSU-02 MPC604EC/D 604TM D 304X transistor BGA PACKAGE thermal resistance Nippon capacitors BGA PACKAGE thermal profile powerpc motorola 304X MPC604 SE42 ppc604 PPC604 instruction set RC 221 ABB PDF

    dh28 560

    Abstract: A09 N03 10C6 Diode cheetah dh28 DH07 11B8 DL03 5d7 switching regulator OVDD14
    Text: 8 7 6 5 4 3 2 1 CHEETAH4.0 CPU D D CARD SCHEMATICS C C 1/15/98 B B THIS DOCUMENT CONTAINS PRELIMINARY INFORMATION AND IS SUBJECT TO CHANGE BY IBM WITHOUT NOTICE. IBM ASSUMES NO RESPONSIBILITY OF LIABIALITY FOR ANY USE OF THE INFORMATION CONTAINED HEREIN. NOTHING IN THIS DOCUMENT SHALL


    Original     		1-800-IBM-0181 CONNTEST14 15JAN98 dh28 560 A09 N03 10C6 Diode cheetah dh28 DH07 11B8 DL03 5d7 switching regulator OVDD14 PDF

    Aavid Thermalloy cold plate

    Abstract: BGA and QFP Package ibm Nippon capacitors PID7v-603e
    Text: G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 Advance Information PowerPC 603e™ RISC Microprocessor Family: PID7v-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of


    Original     		G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. Aavid Thermalloy cold plate BGA and QFP Package ibm Nippon capacitors PDF

    LA-BGA-750CX-S-B-01

    Abstract: TLA700 LS-BGA256A-01 SF-BGA256A-B-02 PB-BGA-750CX-01
    Text: 67.31mm [2.650"] 23mm [0.905"] 34.79mm [1.370"] 80.01mm [3.150"] Top View 2 LS-BGA256A-01 included 12.19mm [0.480"] Side View 23.77mm [0.936"] assembled 1 8.94mm [0.352"] assembled 5.46mm [0.215"] 3 21.73mm [0.855"] PB-BGA-750CX-01 (included) SF-BGA256A-B-02


    Original     		LS-BGA256A-01 PB-BGA-750CX-01 SF-BGA256A-B-02 750CX/750CXe TLA700 LA-BGA-750CX-S-B-01 LS-BGA256A-01 SF-BGA256A-B-02 PB-BGA-750CX-01 PDF

    754-compliant

    Abstract: DH19 MPC603 Aavid Thermalloy cold plate BGA PACKAGE thermal resistance BGA 64 PACKAGE thermal resistance t03 code Nippon capacitors
    Text: G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 Advance Information PowerPC 603e™ RISC Microprocessor Family: PID7v-603e Hardware Specifications The PowerPC 603e microprocessor is an implementation of the PowerPC™ family of


    Original     		G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 754-compliant DH19 MPC603 Aavid Thermalloy cold plate BGA PACKAGE thermal resistance BGA 64 PACKAGE thermal resistance t03 code Nippon capacitors PDF

    camera-link to hd-SDI converter

    Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
    Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    XC3S250E TQ144 STARTER KIT BOARD

    Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
    Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    marking code V6 surface mount diode

    Abstract: hcte
    Text: Freescale Semiconductor MPC7447AEC Rev. 5, 01/2006 Technical Data MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The


    Original     		MPC7447AEC MPC7447A MPC7447A; MPC7447. MPC7447A. MPC7450 32-bit 3A991 marking code V6 surface mount diode hcte PDF

    lga 1336

    Abstract: 7447A MPC7447A solder profile hcte TT 2076 G38-87 JESD51-2 MPC7441 MPC7445 MPC7447
    Text: Freescale Semiconductor MPC7447AEC Rev. 5, 01/2006 Technical Data MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The


    Original     		MPC7447AEC MPC7447A MPC7447A; MPC7447. MPC7447A MPC7447A. MPC7450 lga 1336 7447A MPC7447A solder profile hcte TT 2076 G38-87 JESD51-2 MPC7441 MPC7445 MPC7447 PDF

    FP-X4KPG223-01

    Abstract: reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01
    Text: Ironwood Electronics PB.1 Probing Adapters We offer probing adapters and logic analyzer adapters for all SMT package types, as well as socket probes for DIP and PLCC. We are Agilent and Tektronix partners. In addition, we offer adapters to facilitate the use of in-circuit emulators


    Original     		XC2018, XC2018 XC3020, XC3064, XC3042, XC3090, XC3090 FP-X4KPG223-01 reflow profile FOR LGA COMPONENTS bga96 BGA165 BGA292 SO8A CA-SO18A-Z-J-T-01 SF-QFE352SA-L-01 BGA480B CA-PLCC44-D-P-T-01 PDF

    Untitled

    Abstract: No abstract text available
    Text: Freescale Semiconductor MPC7447AEC Rev. 4, 09/2005 Technical Data MPC7447A RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7447A; however, unless otherwise noted, all information here also applies to the MPC7447. The


    Original     		MPC7447AEC MPC7447A MPC7447A; MPC7447. MPC7447A. MPC7450 PDF

    Kester 182

    Abstract: ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance
    Text: Freescale Semiconductor, Inc. G522-0267-00 IBM Order Number MPC603E7VEC/D (Motorola Order Number) 11/96 REV 1 O IC EM R, O CT U ND C IN . S E L CA PowerPC 603e RISC Microprocessor Family: S E E PID7v-603e Hardware Specifications FR Y B D The PowerPC 603e microprocessor


    Original     		G522-0267-00 MPC603E7VEC/D 603eTM PID7v-603e MPC603e PPC603e. 0007v Kester 182 ALPha r09 VE8910 102 M SE BGA and QFP Package ibm BGA PACKAGE thermal profile by235 Dh29 BGA PACKAGE thermal profile powerpc motorola BGA PACKAGE thermal resistance PDF

    LGA PACKAGE thermal resistance Freescale

    Abstract: marking code V6 74 surface mount diode CI 7448 kmc7448 MC 7448 MARKING CODE QVF
    Text: Freescale Semiconductor Technical Data Document Number: MPC7448EC Rev. 4, 3/2007 MPC7448 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC7448, which is targeted at networking and computing systems applications. This document describes pertinent electrical and


    Original     		MPC7448EC MPC7448 MPC7448, MPC7448. MPC7450 3A991 MC7448 LGA PACKAGE thermal resistance Freescale marking code V6 74 surface mount diode CI 7448 kmc7448 MC 7448 MARKING CODE QVF PDF

    mpc7448

    Abstract: C10G2
    Text: Freescale Semiconductor MPC7448EC Rev. 0, 9/2005 Advance Information MPC7448 RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7448. The MPC7448 is an implementation of the PowerPC microprocessor family of reduced instruction set computer RISC


    Original     		MPC7448EC MPC7448 MPC7448. MPC7450 C10G2 PDF

    land pattern BGA 0.75 freescale

    Abstract: mcp 1050
    Text: Freescale Semiconductor MPC7448EC Rev. 1, 11/2005 Technical Data MPC7448 RISC Microprocessor Hardware Specifications This document is primarily concerned with the PowerPC MPC7448. The MPC7448 is an implementation of the PowerPC microprocessor family of reduced instruction set


    Original     		MPC7448EC MPC7448 MPC7448. MPC7450 documen67NC MC7448HX1400NC MC7448HX1420LC land pattern BGA 0.75 freescale mcp 1050 PDF

    RX350

    Abstract: ABB Group Hall Effect Current Sensors ABB MPC755 Hardware Specification hall sensor u18 MPC755 Aavid Thermalloy cold plate freescale JTAG header 14 marking code V6 33 surface mount diode G38-87
    Text: Freescale Semiconductor MPC755EC Rev. 6.1, 01/2005 Technical Data MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are PowerPC


    Original     		MPC755EC MPC755 MPC755; MPC745. MPC755 MPC745 MPC755. MPC750 RX350 ABB Group Hall Effect Current Sensors ABB MPC755 Hardware Specification hall sensor u18 Aavid Thermalloy cold plate freescale JTAG header 14 marking code V6 33 surface mount diode G38-87 PDF

    MPC755

    Abstract: marking code V6 33 surface mount diode G38-87 JESD51-2 MPC745 MPC750 MPC755EC A 1718 mpc740 transistor 755-X
    Text: Freescale Semiconductor Document Number: MPC755EC Rev. 8, 02/2006 Technical Data MPC755 RISC Microprocessor Hardware Specifications This document is primarily concerned with the MPC755; however, unless otherwise noted, all information here also applies to the MPC745. The MPC755 and MPC745 are


    Original     		MPC755EC MPC755 MPC755; MPC745. MPC755 MPC745 MPC755. MPC750 marking code V6 33 surface mount diode G38-87 JESD51-2 MPC755EC A 1718 mpc740 transistor 755-X PDF

    Tektronix

    Abstract: 750FX LA-BGA-750FX-Z-01 SF-BGA292D-B-11 TLA700
    Text: 67.31mm [2.650"] 27.46mm [1.081"] 30.51mm [1.201"] 28.32mm [1.115"] Top View 80.01mm [3.150"] 28.32mm [1.115"] 24.9mm [0.980"] 25.65mm [1.010"] 1 Side View PB-BGA-750FX-01 included 25.68mm [1.011"] assembled 10.74mm [0.423"] assembled 3 2 26.46mm [1.042"]


    Original     		PB-BGA-750FX-01 SF-BGA292D-B-11 750FX TLA700 LA-BGA-750FX-Z-01 Tektronix SF-BGA292D-B-11 PDF