LG Air Conditioning Repair
Abstract: AB01939 Hearing Aid repair 3750A 3797TC grain of wheat H6P3 1838 b hearing aid integrated circuits kraft plus
Text: 3M Products for Construction Markets 3M Products for Construction Markets Make The Connection With 3M Contractor Solutions Construction Markets Division 3M Canada Company P.O. Box 5757 London, Ontario N6A 4T1 Canada 1 800-364-3577 www.3m.ca/construction Please recycle. Printed in Canada.
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0812-4210E
517-3748TC-1PC
3748TC
LG Air Conditioning Repair
AB01939
Hearing Aid repair
3750A
3797TC
grain of wheat
H6P3
1838 b
hearing aid integrated circuits
kraft plus
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galvanized steel thermal conductivity
Abstract: 3M DP110 D1876 DP110 6080F FPL LIGHTS acrylic fiber 800-362 DP-110 neoprene primer
Text: 3 Scotch-Weld TM Epoxy Adhesive DP110 Translucent and Gray Technical Data December, 2009 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP110 Translucent and Gray are two-part epoxy adhesives which combine a fast cure with flexibility. Features • Controlled flow
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DP110
000the
225-3S-06
517-DP-110TR400ML
DP110-TRANSLUCENT-400ML
galvanized steel thermal conductivity
3M DP110
D1876
6080F
FPL LIGHTS
acrylic fiber
800-362
DP-110
neoprene primer
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galvanized steel thermal conductivity
Abstract: No abstract text available
Text: 3 Scotch-Weld TM Epoxy Adhesive DP110 Translucent and Gray Technical Data December, 2009 Product Description 3M Scotch-Weld™ Epoxy Adhesive DP110 Translucent and Gray are two-part epoxy adhesives which combine a fast cure with flexibility. Features • Controlled flow
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DP110
225-3S-06
galvanized steel thermal conductivity
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IC 651
Abstract: DP-110 dp110
Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com QFP Probing Clip User Guide The Ironwood QFP probing clip is comprised of three component pieces. Assembly of these three pieces and then the ability
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DP-110,
IC 651
DP-110
dp110
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SG-MLF-7028
Abstract: No abstract text available
Text: GHz MLF Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 14.125mm Easily removable socket lid A A 1 Socket Lid: Black anodized Aluminum.
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125mm
SG-MLF-7028
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x318
Abstract: SG-BGA-6240
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required 20.125mm Compression plate distributes forces evenly Easily removable socket lid
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125mm
76mmket
DP110
SG-BGA-6240
x318
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SG-SOIC-3000
Abstract: ultem epoxy
Text: GHz MLF Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 14.925mm A A Side View (Section AA)
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925mm
SG-SOIC-3000
ultem epoxy
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Socket IC 4 pin
Abstract: SG-BGA-6222
Text: Top View GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.12mm Easily removable socket lid
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DP110
SG-BGA-6222
Socket IC 4 pin
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SG-BGA-7103
Abstract: No abstract text available
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 11.13mm
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DP110
SG-BGA-7103
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SG-BGA-7090
Abstract: No abstract text available
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required 19.125mm Compression plate distributes forces evenly Easily removable socket lid
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125mm
363mm.
DP110
SG-BGA-7090
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X318
Abstract: SG-BGA-6209
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required 20.125mm Compression plate distributes forces evenly Easily removable socket lid
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125mm
DP110
SG-BGA-6209
X318
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7047
Abstract: SG-BGA-7047
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 16.125mm Easily removable socket lid
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125mm
DP110
7047
SG-BGA-7047
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ic 6206
Abstract: SG-BGA-6206 6206 A
Text: Top View GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.125 mm Easily removable socket lid
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DP110
SG-BGA-6206
ic 6206
6206 A
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SG-BGA-6216
Abstract: 6216 ic
Text: Top View GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 17.125mm Easily removable socket lid
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125mm
SG-BGA-6216
6216 ic
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SG-BGA-7093
Abstract: BGA PACKAGE TOP MARK socket dwg
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 13.125mm
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125mm
DP110
SG-BGA-7093
BGA PACKAGE TOP MARK
socket dwg
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SG-BGA-7089
Abstract: 16x16 bga
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 12.125mm
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125mm
SG-BGA-7089
16x16 bga
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SG-MLF-7015
Abstract: No abstract text available
Text: GHz MLF Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.125mm Easily removable socket lid
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125mm
SG-MLF-7015
SG-MLF-70
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SG-BGA-6157
Abstract: No abstract text available
Text: 19.13mm GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required 16.13mm Compression plate distributes forces evenly A A 1 Socket Li d: Bla ck a nodized 60 61 Aluminum.
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DP110
SG-BGA-6157
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SG-BGA-7030
Abstract: No abstract text available
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 15.125mm
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125mm
DP110
SG-BGA-7030
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C 7064
Abstract: socket head cap screw SG-BGA-7064
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 12.56mm
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125mm
DP110
C 7064
socket head cap screw
SG-BGA-7064
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SG-BGA-6184
Abstract: materials for BGA
Text: 19.13mm GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required 15.13mm Compression plate distributes forces evenly A A 1 Socket Li d: Bla ck a nodized 60 61 Aluminum.
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DP110
SG-BGA-6184
materials for BGA
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SG-BGA-7026
Abstract: DP-110
Text: GHz BGA Socket - Epoxy mount, solderless Top View Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly Easily removable socket lid 16.125mm
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125mm
SG-BGA-7026
DP-110
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SG-BGA-7028
Abstract: No abstract text available
Text: Top View GHz BGA Socket - Epoxy mount, solderless Features Directly mounts to target PCB needs epoxy . High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 18.125mm Easily removable socket lid
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125mm
DP110
SG-BGA-7028
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DP-100 Plus
Abstract: 3M DP100 ca-4, 4 gray 3M DP110 DP-605 DP-190
Text: 3M Adhesives, Cleaners & Compounds Aerosol spray, gel and glue adhesives, epoxies and applicators for a wide variety o f applications Chemical and citrus based cleaners Products to lubricate and encapsulate 3M Electronic Specialty Markets http://www.m m m .com /esm
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OCR Scan
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DP-110,
DP-100,
DP-10y
12/CASE,
12/CS
DP-100 Plus
3M DP100
ca-4, 4 gray
3M DP110
DP-605
DP-190
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