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    5 BALL CSP DRAWING Search Results

    5 BALL CSP DRAWING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10161576-001 Amphenol Communications Solutions The FCI Basics crimping hand tool is professionally designed for applications in the prototyping phase or small production quantities.The hand tool is designed for Amphenols Minitek® 2.00mm Crimp-to-Wire product.Click on the Product Drawing to see all information related to the product. Visit Amphenol Communications Solutions
    10159164-001 Amphenol Communications Solutions The FCI Basics crimping hand tool is professionally designed for applications in the prototyping phase or small production quantities. The hand tool is designed for Amphenols WireLock® 1.80mm Crimp-to-Wire product. Click on the Product Drawing to see all information related to the product. Visit Amphenol Communications Solutions
    10156148-001 Amphenol Communications Solutions The FCI Basics crimping hand tool is professionally designed for applications in the prototyping phase or small production quantities. The hand tool is designed for Amphenols Cross-Mate™ Crimp-to-Wire product. Click on the Product Drawing to see all information related to the product. Visit Amphenol Communications Solutions
    10158871-001 Amphenol Communications Solutions The FCI Basics crimping hand tool is professionally designed for applications in the prototyping phase or small production quantities. The hand tool is designed for Amphenols Minitek® Multipitch Crimp-to-Wire product. Click on the Product Drawing to see all information related to the product. Visit Amphenol Communications Solutions
    10162309-001 Amphenol Communications Solutions The FCI Basics crimping hand tool is professionally designed for applications in the prototyping phase or small production quantities.The hand tool is designed for Amphenols PV® Crimp-to-Wire product.Click on the Product Drawing to see all information related to the product. Visit Amphenol Communications Solutions

    5 BALL CSP DRAWING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    QFN108

    Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
    Text: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3


    Original     		84-Pin A1010B A1020B 100-Pin QFN108 QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch PDF

    MS-034-AAn-1

    Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
    Text: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel


    Original     		Q1-02 BF957 BG225 BG256 BG352 BG432 BG492 BG560 BG575 BG728 MS-034-AAn-1 ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002 PDF

    48LD

    Abstract: No abstract text available
    Text: LP62S16256F-I Series 256K X 16 BIT LOW VOLTAGE CMOS SRAM Document Title 256K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History History Issue Date Remark 0.0 Initial issue November 22, 2002 Preliminary 0.1 Change ICC2 from 15mA to 8mA April 18, 2003 0.2 Modify 48LD CSP bottom view outline drawing


    Original     		LP62S16256F-I MO192 48LD PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    TAIYO PSR 4000

    Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
    Text: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch


    Original     		330mm PDF

    CBG064-052A

    Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
    Text: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability


    Original     		PDF

    LGA 1150

    Abstract: No abstract text available
    Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch


    Original     		330mm LGA 1150 PDF

    639X

    Abstract: LGA 1150
    Text: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.


    Original     		330mm 150mm 639X LGA 1150 PDF

    taiyo PSR4000

    Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    fBGA package tray 12 x 19

    Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
    Text: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2


    Original     		PDF

    116-Pin

    Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
    Text: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size


    Original     		C13185EJ1V0PF00 116-Pin PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow PDF

    Theta JC of FBGA

    Abstract: cpga dimensions cpga weight 84 pin plcc ic base
    Text: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    W-CSP footprint

    Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
    Text: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CM1442 LCD and Camera EMI Filter Array with ESD Protection Features Product Description • The CM1442 is a family of pi-style EMI filter arrays with ESD protection, which integrates six and eight filters C-R-C in Chip Scale Package form factor with


    Original     		CM1442 CM1442 15pF-100â -15pF 120MHz 48Mbps. CM1442-08 178mm PDF

    CM1300

    Abstract: CM1300-03CP CM1300-03CS CSPRC032A 250 micro solder ball
    Text: CM1300 4 Channel EMI Filter Network Features Product Description • • The CM1300 is a 4-channel low pass EMI filter R-C-R configuration manufactured in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California


    Original     		CM1300 CM1300 CSPRC032A 485mm 985mm 178mm CM1300-03CP CM1300-03CS CSPRC032A 250 micro solder ball PDF

    Untitled

    Abstract: No abstract text available
    Text: CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pistyle filter 30pF-100Ω-30pF which provides greater


    Original     		CM1440 CM1440 30pF-100â -30pF) 800MHz 178mm PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes.


    Original     		CM1440 CM1440 30pF-100â -30pF) 800MHz 178mm PDF

    ms-029

    Abstract: FBGA1152
    Text: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)


    Original     		PDF

    N406

    Abstract: CM1440 CM1440-06CP CM1440-06CS
    Text: CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pistyle filter 30pF-100Ω-30pF which provides greater


    Original     		CM1440 CM1440 30pF-100-30pF) 800MHz 178mm N406 CM1440-06CP CM1440-06CS PDF

    Untitled

    Abstract: No abstract text available
    Text: PRELIMINARY CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF


    Original     		CM1441 CM1441 30pF-100â -30pF) 800MHz 178mm PDF

    250 micro solder ball

    Abstract: 5 ball csp drawing EMI/RFI filter schematic diagram CM1441 CM1441-07CP marking B4 diode
    Text: CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF


    Original     		CM1441 CM1441 30pF-100-30pF) 800MHz 178mm 250 micro solder ball 5 ball csp drawing EMI/RFI filter schematic diagram CM1441-07CP marking B4 diode PDF

    CM1441

    Abstract: CM1441-07CP CM1441-07CS n417
    Text: CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF


    Original     		CM1441 CM1441 30pF-100-30pF) 800MHz 178mm CM1441-07CP CM1441-07CS n417 PDF

    00984a2

    Abstract: top side marking b2 PACDN1404C PACDN1404CG PACDN1408C PACDN1408CG PACDN1416C PACDN1416CG 1416C
    Text: PACDN1404C/1408C/1416C ESD Protection Arrays, Chip Scale Package Features Product Description • The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.


    Original     		PACDN1404C/1408C/1416C PACDN1404C, PACDN1408C PACDN1416C MILSTD-883D 178mm 00984a2 top side marking b2 PACDN1404C PACDN1404CG PACDN1408CG PACDN1416C PACDN1416CG 1416C PDF