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10132450-1821GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing. |
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54112-111501850LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch. |
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95615-018LF
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Amphenol Communications Solutions
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Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 18 Positions - 2.00mm (0.079in) Pitch. |
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50000-5018ELF
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Amphenol Communications Solutions
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High Pin Count, Backplane Connectors, Receptacle, Right Angle, Through Hole, 3 Row, 18 Positions, 0 Guide Pin, 2.54mm (0.100in) Pitch |
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10132450-1811GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 18 Positions, GW Compatible PA9T, Tray packing. |
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