Untitled
Abstract: No abstract text available
Text: Recom m ended P .C .B Layout Com ponent Side 1 8 . 3 8 + 0 .0 5 □ S □ S □ S— NOTE: 127044FA01 2JHQ00ZU 1 1.Selective plating 510 5 u ” Min.Gold in c o n ta ct a re a / 100u” Min.Tin in solder area. 52Gold in co n ta c t a re a / 100u” Min.Tin in solder area.
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127044FA01
2JHQ00ZU
52Gold
5415u
UL94V-0
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asea
Abstract: mfk series
Text: HSF RoHS g Compliant 2002/95/EC fa Level-1 Controlled Substances are banned 31.80 +0.30 26.30 ±0.30 Lx u t / s' 22.40 ±0.15 25.40 ±0.15 20.70 ±0.15 10.64 ±0.15 1.20 S? I 7.15 RECOMMEND P.C.B LAYOUT (COMPONT SIDE) P.C.B THICKNESS=1.20mm(TOLERANCE=±0.05)
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OCR Scan
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95/EC
127382FR013SX19ZR
Sl-05u"
52-GOLD
53-10u"
54-15u"
55-30u"
56-50u"
asea
mfk series
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127382FR
Abstract: BB145 52-GOLD
Text: RoHS Compliant WfìiSC fa Level-1 Controlled Substances are banned HSF 31.80 ±0.30 10.85 ±0.15 -1 1.00 2.75 7.15 ,4.45 r 20.80 ±0.15 RECOMMEND P.C.B LAYOUT COMPONENT SIDE P.C.B TfflCKNESS=1.20mm(T0LERANCE=i0.05) NOTE: 127382FR013SX22ZR T 1. PLATING 51-05u" MIN.GOLD IN CONTACT AREAI
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OCR Scan
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127382FR013SX22ZR
51-05u"
52-GOLD
53-10u"
54-15u"
55-30u"
127382FR
BB145
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PDF
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