TSOP 56 Package
Abstract: 56-Pin
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 56 PIN PLASTIC FPT-56P-M02 56-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-56P-M02) 56-pin plastic TSOP (I)
|
Original
|
FPT-56P-M02
56-pin
FPT-56P-M02)
008INDEX
F56002S-3C-3
TSOP 56 Package
|
PDF
|
9806
Abstract: diode 9806 FPT-56P-M01
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 56 PIN PLASTIC FPT-56P-M01 56-pin plastic TSOP I Lead pitch 0.50 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-56P-M01) 56-pin plastic TSOP (I)
|
Original
|
FPT-56P-M01
56-pin
FPT-56P-M01)
F56001S-3C-4
9806
diode 9806
FPT-56P-M01
|
PDF
|
9809
Abstract: TSOP 56 Package FPT-56P-M04
Text: THIN SMALL OUTLINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 56 PIN PLASTIC FPT-56P-M04 56-pin plastic TSOP I Lead pitch 0.40 mm Package width x package length 12.00 × 12.40 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.20 mm MAX
|
Original
|
FPT-56P-M04
56-pin
FPT-56P-M04)
F56004S-1C-1
9809
TSOP 56 Package
FPT-56P-M04
|
PDF
|
48pin flash programmer circuit
Abstract: intel manual PLCC 68 intel INTEL 56BALL
Text: PROM PROGRAMMERS INTEL Intel Flash Memory Programmer • ■ ■ ■ ■ Advanced-capability engineering programmer – Support capability below 5V logic levels – Extremely fast programming performance – 56-lead TSOP socket module supports all lead counts
|
Original
|
56-lead
40-ball
48-ball
56-ball
44-lead
56-lead
48pin flash programmer circuit
intel manual
PLCC 68 intel
INTEL 56BALL
|
PDF
|
PLCC 68 intel
Abstract: intel manual 48pin flash programmer circuit
Text: PROM PROGRAMMERS INTEL FlashPRO-II: Advanced Flash Memory Engineering Programmer • ■ ■ ■ ■ Advanced-capability engineering programmer – Support capability below 5V logic levels – Extremely fast programming performance – 56-lead TSOP socket module
|
Original
|
56-lead
44-lead
60-pin
48-pin
PLCC 68 intel
intel manual
48pin flash programmer circuit
|
PDF
|
28F016XS
Abstract: No abstract text available
Text: INTEL PRODUCTS INTEL 28F016XS Fast Flash Memory • ■ ■ ■ ■ ■ ■ ■ Synchronous burst interface SmartVoltage technology Nonvolatile, updatable and low power 56-lead TSOP and SSOP packages 2 Mbyte of code storage space 16 symmetrical 128-Kbyte blocks
|
Original
|
28F016XS
56-lead
128-Kbyte
Intel486TM
28F016XS
|
PDF
|
29057
Abstract: No abstract text available
Text: irrte! AEMÄM ! OMiFOKlifflATO ^ 28F016XD 16-MBIT 1 MBIT x 16 DRAM-INTERFACE FLASH MEMORY 85 ns Access Time Orac ) — Supports both Standard and FastPage-Mode Accesses 56-Lead TSOP Type I Package Backwards-Compatible with 28F008SA Command Set Multiplexed Address Bus
|
OCR Scan
|
28F016XD
16-MBIT
56-Lead
28F008SA
64-Kbyte
16-Mbit
AB-62,
AP-357,
AP-374,
29057
|
PDF
|
Intel 56 TSOP
Abstract: 28F016XS
Text: MEMORY & STORAGE INTEL CORPORATION Intel 28F016XS Fast Flash Memory • ■ ■ ■ ■ ■ ■ ■ Synchronous Burst Interface Nonvolatile, Updatable and Low Power 2 MB of Code Storage Space X16 or X8 Output Configuration SmartVoltage Technology 56-Lead TSOP and SSOP
|
Original
|
28F016XS
56-Lead
128-Kbyte
16-Mb
33-MHz,
Intel486TM
Intel 56 TSOP
|
PDF
|
Untitled
Abstract: No abstract text available
Text: in te i 28F016XD 16-MBIT 1 MBIT X 16 DRAM-INTERFACE FLASH MEMORY 85 ns Access Time (tRAc) — Supports both Standard and FastPage-Mode Accesses 56-Lead TSOP Type I Package Multiplexed Address Bus — RAS# and CAS# Control Inputs 2 ix A Typical Deep Power-Down
|
OCR Scan
|
28F016XD
16-MBIT
56-Lead
64-Kbyte
28F008SA
|
PDF
|
Untitled
Abstract: No abstract text available
Text: in te l ADVANCE INFORMATION 28F016XD 16-MBIT 1 MBIT x 16 DRAM-INTERFACE FLASH MEMORY 85 ns Access Time (tRAC) — Supports both Standard and FastPage-Mode Accesses 56-Lead TSOP Type I Package Multiplexed Address Bus — RAS# and CAS# Control Inputs 2 pA Typical Deep Power-Down Current
|
OCR Scan
|
28F016XD
16-MBIT
56-Lead
28F008SA
64-Kbyte
|
PDF
|
Untitled
Abstract: No abstract text available
Text: STT3403P -4 A, -30 V, RDS ON 56 m P-Channel Enhancement Mode MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free DESCRIPTION TSOP-6 These miniature surface mount MOSFETs utilize a high cell density trench process to provide Low RDS(on)
|
Original
|
STT3403P
06-Jan-2011
|
PDF
|
STT3405P
Abstract: MosFET
Text: STT3405P -4.9 A, -20 V, RDS ON 56 m P-Channel Enhancement Mode MOSFET Elektronische Bauelemente RoHS Compliant Product A suffix of “-C” specifies halogen and lead-free DESCRIPTION TSOP-6 These miniature surface mount MOSFETs utilize a high cell density process. Low RDS(on) assures minimal
|
Original
|
STT3405P
06-Jan-2011
STT3405P
MosFET
|
PDF
|
648-0482211
Abstract: 648-0482211-A01 648A0322211-A01 648-0562211-A01 dead bug 648-1282211-A01 648-0482211SA01 wells 648-0482211 648A0402211-A01 Wells-CTI 648
Text: Burn-In Test Sockets 648 Series TSOP-I Socket • Available dead bug or live bug with adaptor • Open top, Zero Insertion Force design for automatic loading • Highly reliable, pre-loaded contacts e Lead Count 28 32 32 32 40 40 48 48 56 Pitch e mm 0.55
|
Original
|
648-1282211-A01
648-0322211-A01
648A0322211-A01
648A32-01
648B0322211
648-0402211-A01
648A0402211-A01
648A40-01
648-0482211-A01
648-0482211SA01
648-0482211
648-0482211-A01
648A0322211-A01
648-0562211-A01
dead bug
648-1282211-A01
648-0482211SA01
wells 648-0482211
648A0402211-A01
Wells-CTI 648
|
PDF
|
SO14E
Abstract: so8b so6a SO24C so8e so48 SO34A SO16E Package SO8C SO36B
Text: Ironwood Electronics Appendix D AP-D.1 APPENDIX D SOIC Chip Package Specifications: • SOIC with Gull Wing Leads . . . . . . . . . . . . . .page AP-D.2 thru AP-D.5 • SOIC with J-Leads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .page AP-D.6
|
Original
|
SO10A
SOJ28C
SOJ28D
SOJ30A
SOJ32A
SOJ32B
SOJ32C
SOJ36A
SOJ36B
SOJ40A
SO14E
so8b
so6a
SO24C
so8e
so48
SO34A
SO16E Package
SO8C
SO36B
|
PDF
|
|
|
Untitled
Abstract: No abstract text available
Text: Thin Small Outline Package TSOP DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface
|
Original
|
TSOP04)
AK56D900-TSOP14x20
TSOP05)
|
PDF
|
land pattern for TSOP 2-44
Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
|
Original
|
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
|
Original
|
AK56D900-TSOP14x20
|
PDF
|
Untitled
Abstract: No abstract text available
Text: 52 Pin to 56 Pin DIP Adapters ACCUTEK MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING DESCRIPTION This new family of Accutek DIP Adapter Modules converts surface mount IC’s to pin compatible DIP packages for creating drop-in replacements for end-of-life DIP IC’s. Package types supported are:
|
Original
|
AK56D900-TSOP14x20
|
PDF
|
TSOP 48 thermal resistance
Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate
|
Original
|
MS-024
TSOP 48 thermal resistance
TSOP 48 stacked die package
MS-024
MO-142
TSOP 32 thermal resistance
TSOP 48 package tray
MO-183
marking code 56l
jedec ms-024
|
PDF
|
pioneer PAL 007 A
Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
|
Original
|
|
PDF
|
PAL 007 pioneer
Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Text: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions
|
Original
|
|
PDF
|
TSOP-48 pcb LAYOUT
Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Text: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions
|
Original
|
|
PDF
|
48P4B
Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Text: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P
|
Original
|
240K6X-A
30S1B
42S1B-A
52S1B-B
64S1B-E
124S8
135S8-F
145S8
149S8
177S8
48P4B
P/N146071
hssop
432W6
70P3S-M
10C2-C
136P6S-C
20P5A
|
PDF
|
Meritec 980020-56
Abstract: IC179-44600-500 IC197-4807-2000 980020-48 IC197-5606-2000 980020 IC191-0482-004 Enplas OTS 648-0482211 wells 648-0482211
Text: The Complete Socket Solution 3 PCB land-pad layout similar close to that of device PRODUCTION PROTOTYPING AND TEST SOCKETS TO HELP YOU DESIGN IN INTEL FLASH MEMORY Socket vendors are actively working on solutions for Small Outline Packages This work includes robust
|
Original
|
IC191-0402-002N
IC191-0402-002
OTS-40-0
IC191-0482-004N
IC191-0482-004
648-0482211-A31
IC191-0562-003N
IC191-0562-003
CSP044-052
IC51-0442-1536
Meritec 980020-56
IC179-44600-500
IC197-4807-2000
980020-48
IC197-5606-2000
980020
IC191-0482-004
Enplas OTS
648-0482211
wells 648-0482211
|
PDF
|
