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    63 BALL VFBGA THERMAL RESISTANCE Search Results

    63 BALL VFBGA THERMAL RESISTANCE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TCTH011AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH022AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH021AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012BE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation
    TCTH012AE Toshiba Electronic Devices & Storage Corporation Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function Visit Toshiba Electronic Devices & Storage Corporation

    63 BALL VFBGA THERMAL RESISTANCE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    pxa270c

    Abstract: tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance rtpxa270c0c520 356-ball Universal Subscriber Identity Module pxa25
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 RCPXA270C0C312 RCPXA270C0C416 RCPXA270C0C520 RCPXA270C0C624 RTPXA270C0C312 RTPXA270C0C416 RTPXA270C0C520 RTPXA270C0C624 13x13x1 pxa270c tray bga 23x23 blackberry LCD PXA270C0C416 PXA270 jtag flash programming 63 ball Vfbga thermal resistance 356-ball Universal Subscriber Identity Module pxa25

    PXA270 instruction set

    Abstract: blackberry LCD PXA27x core developers guide pxa270 user guide Intel pxa270 PXA270 G770L intel 28000 BGA 23X23 0.8 23X23
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 Glossary-14 PXA270 instruction set blackberry LCD PXA27x core developers guide pxa270 user guide Intel pxa270 G770L intel 28000 BGA 23X23 0.8 23X23

    G770LE

    Abstract: PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide pxa270 PXA270 usb
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 Glossary-14 G770LE PXA270 instruction set blackberry LCD 63 ball Vfbga thermal resistance Intel pxa270 Intel XScale PXA270 pxa25 PXA270 programmer guide PXA270 usb

    pxa270

    Abstract: G770* sumitomo motorola MCX 90 radio PXA270 jtag flash programming PXA270 instruction set blackberry mobile phone circuit diagram blackberry mobile phone G770 motorola g18 gsm datasheet Intel pxa270
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 Glossary-14 G770* sumitomo motorola MCX 90 radio PXA270 jtag flash programming PXA270 instruction set blackberry mobile phone circuit diagram blackberry mobile phone G770 motorola g18 gsm datasheet Intel pxa270

    PXA270 jtag flash programming

    Abstract: PXA270 BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 PXA270 jtag flash programming BGA 23X23 blackberry LCD h3 0925 pxa270c motorola MCX 90 radio Intel pxa270 63 ball Vfbga thermal resistance MCX 90 motorola

    pxa270

    Abstract: PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet n n n n n n n n n n High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 PXA270 instruction set BGA 23X23 fnd display h3 0925 motorola MCX 90 radio MCX 90 motorola xscale PXA270 PXA27x core developers guide PXA27x Processor Family

    Untitled

    Abstract: No abstract text available
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270

    jesd 51-7

    Abstract: 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000
    Text: Application Report SZZA040 - December 2003 54BGA Package Frank Mortan SLL Package Development ABSTRACT The TI 54-ball low-profile, fine-pitch, ball grid array TFBGA meets dimensions specified in JEDEC MO-205, Variation DD. This 0.8-mm-pitch BGA allows economical OEM designs


    Original     		PDF SZZA040 54BGA 54-ball MO-205, 16-bit jesd 51-7 63 ball Vfbga thermal resistance 56DL metcal apr 5000 MO-205 56ZQL BGA Ball Crack 054UG08C127 APR-5000

    bpsk modulator

    Abstract: ARCHITECTURE OF ARM 7 TDMA PXA270 usb 4-Pin SOP theta Jc value PXA27x Processor Power Supply Requirements
    Text: Intel PXA270 Processor Electrical, Mechanical, and Thermal Specification Data Sheet • ■ ■ ■ ■ ■ ■ ■ ■ ■ High-performance processor: — Intel XScale® microarchitecture with Intel® Wireless MMX Technology — 7 Stage pipeline — 32 KB instruction cache


    Original     		PDF PXA270 bpsk modulator ARCHITECTURE OF ARM 7 TDMA PXA270 usb 4-Pin SOP theta Jc value PXA27x Processor Power Supply Requirements

    MARVELL PXA 930

    Abstract: 88AP320 PXA320 88ap310 88AP300 PXA312 pxa310 88AP303 marvell pxa310 xscale PXA310
    Text: Cover Marvell PXA3xx 88AP3xx Processor Family Electrical, Mechanical, and Thermal Functional Specification PXA30x Processor (88AP300, 88AP301, 88AP302, 88AP303) PXA31x Processor (88AP310, 88AP311, 88AP312) PXA32x Processor (88AP320, 88AP322) Doc. No. MV-S105156-00, Rev. 2.0 Version April 6, 2009 Released


    Original     		PDF 88AP3xx) PXA30x 88AP300, 88AP301, 88AP302, 88AP303) PXA31x 88AP310, 88AP311, 88AP312) MARVELL PXA 930 88AP320 PXA320 88ap310 88AP300 PXA312 pxa310 88AP303 marvell pxa310 xscale PXA310

    Untitled

    Abstract: No abstract text available
    Text: QuickLogic PolarPro® II Device Data Sheet •••••• Combining Low Power Programmable Fabric and Embedded SRAM • Quadrant-based segmentable clock networks Device Highlights  20 quad clock networks per device Low Power Programmable Logic 


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: QuickLogic PolarPro® II Device Data Sheet •••••• Combining Low Power Programmable Fabric and Embedded SRAM Device Highlights Low Power Programmable Logic • Up to 27 customizable building blocks CBBs (see Programmable Logic Architectural Overview


    Original     		PDF

    PXA255 MARVELL

    Abstract: Marvell pxa270 XScale PXA270 520Mhz AP270M Marvell PXA270M 520MHz Marvell pxa255 marvell pxa270m marvell ibis PXA270M pxa270
    Text: Cover Marvell PXA270 Processor Electrical, Mechanical, Thermal Specification Doc. No. MV-S104690-00 , Rev. D April 2009 Marvell. Moving Forward Faster Released PXA270 Processor Electrical, Mechanical, and Thermal Specification Document Conventions Note: Provides related information or information of special importance.


    Original     		PDF PXA270 MV-S104690-00 PXA270 MV-S104690-00 PXA255 MARVELL Marvell pxa270 XScale PXA270 520Mhz AP270M Marvell PXA270M 520MHz Marvell pxa255 marvell pxa270m marvell ibis PXA270M

    63 ball Vfbga thermal resistance

    Abstract: No abstract text available
    Text: IMPORTANT NOTICE Dear customer, As from February 2nd 2009, ST and Ericsson have merged Ericsson Mobile Platforms and ST-NXP Wireless into a 50/50 joint venture "ST‐Ericsson". As a result, the following changes are applicable to the attached


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: STw4810 Power management for multimedia processors Features • 2 Step-down converters – 1 to 1.5V with 15 steps at 600mA – 1.8V at 600mA for general purpose usage ■ 3 Low-drop output regulators for different uses – PLL analog supplies: 1.05V, 1.2V, 1.3V 1.8V - 10mA


    Original     		PDF STw4810 600mA 600mA STw4810CHD 100mA) 150mA

    63 ball Vfbga thermal resistance

    Abstract: DRFM lirt2
    Text: STw4810 Power management for multimedia processors Features • 2 Step-down converters – 1 to 1.5V with 15 steps at 600mA – 1.8V at 600mA for general purpose usage ■ 3 Low-drop output regulators for different uses – PLL analog supplies: 1.05V, 1.2V, 1.3V 1.8V - 10mA


    Original     		PDF STw4810 600mA 600mA 100mA) 150mA STw4810CHD STw4810CRA STW4810CHDE/LF STw4810 63 ball Vfbga thermal resistance DRFM lirt2

    Untitled

    Abstract: No abstract text available
    Text: STw4810 Power management for multimedia processors Features • 2 Step-down converters – 1 to 1.5V with 15 steps at 600mA – 1.8V at 600mA for general purpose usage ■ 3 Low-drop output regulators for different uses – PLL analog supplies: 1.05V, 1.2V, 1.3V 1.8V - 10mA


    Original     		PDF STw4810 600mA 600mA STw4810CHD 100mA) 150mA STw4810CRA STw4810

    5mm ldr datasheet

    Abstract: ldr sensor car body control module EMIF06 63 ball Vfbga thermal resistance
    Text: STw4810 Power management for multimedia processors Features • 2 Step-down converters – 1 to 1.5V with 15 steps at 600mA – 1.8V at 600mA for general purpose usage ■ 3 Low-drop output regulators for different uses – PLL analog supplies: 1.05V, 1.2V, 1.3V 1.8V - 10mA


    Original     		PDF STw4810 600mA 600mA STw4810CHD 100mA) 150mA STw4810CRA STw4810 5mm ldr datasheet ldr sensor car body control module EMIF06 63 ball Vfbga thermal resistance

    Untitled

    Abstract: No abstract text available
    Text: STw4810 Power management for multimedia processors Features • 2 Step-down converters – 1 to 1.5V with 15 steps at 600mA – 1.8V at 600mA for general purpose usage ■ 3 Low-drop output regulators for different uses – PLL analog supplies: 1.05V, 1.2V, 1.3V 1.8V - 10mA


    Original     		PDF STw4810 600mA 600mA 100mA) 150mA STw4810CHD STw4810CRA

    90 ball VFBGA

    Abstract: EMIF06 MCDAT31DIR VFBGA package tray DRFM
    Text: 34 .807IRELESS IMPORTANT NOTICE Dear customer, As from August 2nd 2008, the wireless operations of STMicroelectronics have moved to a new company, ST-NXP Wireless. As a result, the following changes are applicable to the attached document. ● Company name - STMicroelectronics NV is replaced with ST-NXP Wireless.


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: STw4810 Power management for multimedia processors Preliminary Data Feature summary • 2 Step-down converters – 1 to 1.5V with 15 steps at 600mA – 1.8V at 600mA for general purpose usage ■ 3 Low-drop output regulators for different uses – PLL analog supplies:


    Original     		PDF STw4810 600mA 600mA 100mA) 150mA STw4810BHD

    Untitled

    Abstract: No abstract text available
    Text: STw4811M STw4811N Power management for multimedia processors Features • 2 step-down converters – 1 to 1.45 V with 15 steps at 700 mA – 1.8 V at 600 mA for general purpose usage ■ 3 low-drop output regulators for different uses – PLL analog supplies:


    Original     		PDF STw4811M STw4811N CD00131784

    TN-48-05

    Abstract: MT48LC16M16A2 MT48LC32M8A2 MT48LC64M4A2 MT48LC64M4A2TG PC133 registered reference design 63 ball Vfbga thermal resistance
    Text: 256Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC64M4A2 – 16 Meg x 4 x 4 banks MT48LC32M8A2 – 8 Meg x 8 x 4 banks MT48LC16M16A2 – 4 Meg x 16 x 4 banks Features Options • Configurations – 64 Meg x 4 16 Meg x 4 x 4 banks – 32 Meg x 8 (8 Meg x 8 x 4 banks)


    Original     		PDF 256Mb: MT48LC64M4A2 MT48LC32M8A2 MT48LC16M16A2 54-pin 60-ball 54-ball TN-48-05 MT48LC16M16A2 MT48LC32M8A2 MT48LC64M4A2 MT48LC64M4A2TG PC133 registered reference design 63 ball Vfbga thermal resistance

    09005aef8091e6d1

    Abstract: 63 ball Vfbga thermal resistance PC133 registered reference design 54 ball vfbga
    Text: 256Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC64M4A2 – 16 Meg x 4 x 4 banks MT48LC32M8A2 – 8 Meg x 8 x 4 banks MT48LC16M16A2 – 4 Meg x 16 x 4 banks Features Options • PC100- and PC133-compliant • Fully synchronous; all signals registered on positive


    Original     		PDF 256Mb: MT48LC64M4A2 MT48LC32M8A2 MT48LC16M16A2 PC100- PC133-compliant 8192-cycle 09005aef8091e6d1 63 ball Vfbga thermal resistance PC133 registered reference design 54 ball vfbga