Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    63SN 37PB SOLDER Search Results

    63SN 37PB SOLDER Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet

    63SN 37PB SOLDER Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    BGA 64 PACKAGE thermal resistance

    Abstract: FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45
    Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package — a flip chip solution in a CSP package format. This package construction utilizes eutectic tin/lead (63Sn/37Pb) flip chip interconnect


    Original     		PDF 63Sn/37Pb) BGA 64 PACKAGE thermal resistance FCCSP CABGA 6x6 amkor flip fcBGA PACKAGE thermal resistance bga 9x9 Shipping Trays CABGA 8X8 BGA 256 PACKAGE power dissipation BGA 256 PACKAGE thermal resistance BGA45

    EP4CE15

    Abstract: MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22
    Text: Altera Device Package Information Datasheet DS-PKG-16.2 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE15 MS 034 BGA and QFP Altera Package mounting Altera pdip top mark jedec package MO-247 SOIC 20 pin package datasheet QFN "100 pin" PACKAGE thermal resistance Theta JC of FBGA QFN148 EP4CE22

    EP4CE6 package

    Abstract: EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80
    Text: Package Information Datasheet for Altera Devices DS-PKG-16.3 This datasheet provides package and thermal resistance information for Altera devices. Package information includes the ordering code reference, package acronym, leadframe material, lead finish plating , JEDEC outline reference, lead


    Original     		PDF DS-PKG-16 EP4CE6 package EP4CE40 Altera EP4CE6 EP4CE55 5M240Z 5M1270Z QFN148 5m570z 5M40 5M80

    Untitled

    Abstract: No abstract text available
    Text: SILICON EPITAXIAL PLANAR DIODE 1N6642D2A / 1N6642D2B 1N6642D2C / 1N6642D2D • • • • • • • Low Leakage Fast Switching Low Forward Voltage Hermetic Ceramic Package Designed as a Drop-In Replacement for “D-5A”/”B-MELF” Package. Suitable for general purpose, switching applications.


    Original     		PDF 1N6642D2A 1N6642D2B 1N6642D2C 1N6642D2D 63Sn/37Pb) 300mA 1N6642D2D-JQRS

    BGA 64 PACKAGE thermal resistance

    Abstract: MS-034 BGA PACKAGE OUTLINE 484-pin BGA 780 AC BGA L led flip-chip EP1S60 63SN 37PB bga thermal resistance
    Text: 13. Package Information for Stratix Devices S53008-3.0 Introduction This data sheet provides package information for Altera devices. It includes these sections: Section Page Device & Package Cross Reference . . . . . . . . . . . . . . . . . . . . . 13–1


    Original     		PDF S53008-3 508-pin BGA 64 PACKAGE thermal resistance MS-034 BGA PACKAGE OUTLINE 484-pin BGA 780 AC BGA L led flip-chip EP1S60 63SN 37PB bga thermal resistance

    bd248

    Abstract: UBGA169 EP1800 324 bga thermal HC1S6 EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information May 2005, vers.13.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 14)


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: SILICON EPITAXIAL PLANAR DIODE 1N6642D2A / 1N6642D2B 1N6642D2C / 1N6642D2D • • • • • • • Low Leakage Fast Switching Low Forward Voltage Hermetic Ceramic Package Designed as a Drop-In Replacement for “D-5A”/”B-MELF” Package. Suitable for general purpose, switching applications.


    Original     		PDF 1N6642D2A 1N6642D2B 1N6642D2C 1N6642D2D 63Sn/37Pb) 300mA 1N6642D2D-JQRS

    FBGA 152

    Abstract: 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484
    Text: 10. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 FBGA 152 68 ball fbga thermal resistance FBGA1020 78 ball fbga thermal resistance EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 FBGA-484

    PQFP 176

    Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
    Text: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●


    Original     		PDF 144-Pin 100-Pin 256-Pin 780-Pin 256-Pin 68-Pin PQFP 176 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760

    ep600i

    Abstract: processor cross reference MS-034 1152 BGA Cross Reference epm7064 cross reference EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: Altera Device Package Information October 2005, vers.14.2 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 16)


    Original     		PDF

    0.3mm pitch csp package

    Abstract: AN-1187 DAP 08 PCB design for 0.2mm pitch csp package DAP 07 dap sot 23-5 SAC405 LDA08B MO-220 MO-229
    Text: Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 0.3mm pitch csp package AN-1187 DAP 08 PCB design for 0.2mm pitch csp package DAP 07 dap sot 23-5 SAC405 LDA08B MO-220 MO-229

    BT 1610

    Abstract: 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90
    Text: 16. Package Information for Stratix II & Stratix II GX Devices SII52010-4.3 Introduction This chapter provides package information for Altera Stratix® II and Stratix II GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values


    Original     		PDF SII52010-4 EP2S15 EP2S30 EP2S60 BT 1610 672-FBGA FBGA 12x12 heat sink FBGA-484 datasheet JEDEC FBGA EP2S15 EP2S180 EP2S30 EP2S60 EP2S90

    BT 1610

    Abstract: FBGA 152 FBGA-484 datasheet EP2S15 EP2S180 EP2S30 EP2S60 EP2S90 68 ball fbga thermal resistance
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards for Stratix II GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF

    murata mlcc

    Abstract: Au Sn eutectic murata, whisker SEM 2004 AN-450 surface mounting methods
    Text: Whiskering Evaluation of Capacitors Mounted with Lead Free Solders Abhijit Gurav and Bruce Stacy KEMET Electronics Corporation Greenville, SC Abstract Capacitors with matte tin termination finishes were tested for tin whisker growth. The study incorporated two types of


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: ULTRA FAST RECOVERY POWER RECTIFIER 1N6626D3A / 1N6626D3B 1N6626D3C / 1N6626D3D • High Reliability Screening Options Available. • High forward current surge current capability. • Switching power supplies or other applications requiring fast switching and low forward loss.


    Original     		PDF 1N6626D3A 1N6626D3B 1N6626D3C 1N6626D3D 63Sn/37Pb) 1N6626D3D

    MS-034 1152 BGA

    Abstract: FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034 AGX52014-1
    Text: 14. Package Information for Arria GX Devices AGX52014-1.1 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are


    Original     		PDF AGX52014-1 EP1AGX35 EP1AGX50 EP1AGX20 EP1AGX90 FBGA35 152-pin MS-034 1152 BGA FBGA-484 datasheet 84 FBGA thermal FBGA 152 FBGA-484 1152 84 FBGA outline led flip-chip MS-034

    FBGA-484 datasheet

    Abstract: 84 FBGA outline FBGA-484 asme y14.5m MS 034 AGX52014-1 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152
    Text: 14. Package Information for Arria GX Devices AGX52014-1.0 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are


    Original     		PDF AGX52014-1 EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX90 EP1AGX60 152-pin FBGA-484 datasheet 84 FBGA outline FBGA-484 asme y14.5m MS 034 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152

    Untitled

    Abstract: No abstract text available
    Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB


    Original     		PDF

    FBGA-484 datasheet

    Abstract: arria MS-034 AGX52014-1
    Text: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


    Original     		PDF 152-pin FBGA-484 datasheet arria MS-034 AGX52014-1

    coin test box

    Abstract: bga socket C17200
    Text: True BGA Socket Ball Grid Array Sockets 5 Energy Way, West Warwick, RI 02893 USA Tel: 800-424-9850 / 401-823-5200 Fax: 401-823-8723 E-mail: [email protected] Internet: www.advintcorp.com PATENTED How It Works Step 1 • Solder True BGA Socket™ to PCB


    Original     		PDF 63Sn/37Pb, coin test box bga socket C17200

    Untitled

    Abstract: No abstract text available
    Text: BGA Socketing Systems Technical Specifications 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email [email protected] • Internet http://www.advintcorp.com Socket Adapter Systems Test Results for 1.27mm Pitch Low Force Contacts P/N 1427 - 1G


    Original     		PDF 2351A

    DAP 07

    Abstract: JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220
    Text: National Semiconductor Application Note 1187 August 27, 2010 Table of Contents Introduction . 2 Package Overview . 2


    Original     		PDF AN-1187 DAP 07 JESD22-B111 DAP 08 transistor smd sensor 80L dap 07 smd dap sot 23-5 SPA52A AN-1187 LQB08A MO-220

    solder paste 63sn alpha metal

    Abstract: failure of heating element in hot air gun making hot air gun 63SN 37PB SOLDER reworking guidelines
    Text: Document 362-1 Soldering Surface Mount Components Types of Solder Concerns regarding the use of water-soluble flux Water soluble fluxes can leave weak organic acid WOA residues that must be thoroughly removed from all pc board components. All fine wire components, like many


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: ADVANCED B G A S o c k e ts /A d a p te r s INTERCONNECTIONS6 5 Energy Way, P.O. Box 1019, W est W arwick, Rl 02893 'T e l. 80 0-4 2 4 -9 8 5 0 /4 0 1 -8 2 3 -5 2 0 0 • Fax 401-823-8723 • Email advintcorp@ aol.com • Internet http://w w w .advintcorp.com


    OCR Scan     		PDF QQ-B-626 63Sn/37Pb 63Sn/37Pb