128-PIN
Abstract: simm simm 72 pin PM20 Package simm 72 sIMM 72 module PM01 PM04 PM05 SIMM module
Text: Package Diagram Plastic SIMM Modules 64-Pin Plastic SIMM Module PM01 0.125 DIA. + .001 2 PLCS 3.845 3.855 3.580 3.588 0.330 MAX 0.525 MAX 0.400 0.250 PIN 1 0.080 0.050 TYP 0.62 R + .001 0.250 PIN 64 3.35 64 PINS 0.250 0.145 REF 64-Pin Plastic SIMM Module PM02
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64-Pin
855MAX.
200MAX.
595MAX.
135REF.
128-Pin
112-Pin
simm
simm 72 pin
PM20 Package
simm 72
sIMM 72 module
PM01
PM04
PM05
SIMM module
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SOP 64
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M08 Lead pitch 0.80mm Package width 10.90mm Lead shape Gullwing Sealing method Plastic mold 64-pin plastic SOP FPT-64P-M08 64-pin plastic SOP (FPT-64P-M08) 64 33 Details of "A" part 0.15(.006) INDEX 0.30(.012)
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FPT-64P-M08
64-pin
FPT-64P-M08)
F64017S-1C-2
SOP 64
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PGA064-R-S10U-1
Abstract: PGA-64P-M01
Text: PIN GRID ARRAY PACKAGE 64 PIN PLASTIC PGA-64P-M01 EIAJ code : ∗PGA064-R-S10U-1 64-pin plastic PGA Lead pitch 100mil Pin matrix 10 Sealing method Resin seal PGA-64P-M01 64-pin plastic PGA (PGA-64P-M01) 0.51 ± 0.13 DIA (.020 ± .005) 1.27 (.050) TYP DIA
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PGA-64P-M01
PGA064-R-S10U-1
100mil
64-pin
PGA-64P-M01)
R64009SC-2-3
PGA064-R-S10U-1
PGA-64P-M01
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Untitled
Abstract: No abstract text available
Text: QUAD FLAT TYPE MODULE 64 PIN CERAMIC MQP-64C-P01 64-pin ceramic MQFP Lead pitch 1.00mm Lead shape Straight Motherboard material Ceramic Mounted package material Plastic MQP-64C-P01 64-pin ceramic MQFP (MQP-64C-P01) 18.70(.736)TYP INDEX AREA 12.00(.472)TYP
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MQP-64C-P01
64-pin
MQP-64C-P01)
4C-P01)
M64004SC-1-3
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MQP-64C-P01
Abstract: No abstract text available
Text: QUAD FLAT TYPE MODULE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN CERAMIC MQP-64C-P01 64-pin ceramic MQFP Lead pitch 1.00 mm Lead shape Straight Motherboard material Ceramic Mounted package material Plastic MQP-64C-P01 64-pin ceramic MQFP (MQP-64C-P01) 18.70(.736)TYP
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MQP-64C-P01
64-pin
MQP-64C-P01)
M64004SC-1-3
MQP-64C-P01
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Untitled
Abstract: No abstract text available
Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M08 64-pin plastic SOP Lead pitch 0.80 mm Package width 10.90 mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M08 64-pin plastic SOP
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FPT-64P-M08
64-pin
FPT-64P-M08)
F64017S-1C-2
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QFP064-P-1010-1
Abstract: No abstract text available
Text: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M03 EIAJ code : ∗QFP064-P-1010-1 Lead pitch 0.50mm Package width x package length 10 × 10mm Lead shape Gullwing Sealing method Plastic mold 64-pin plastic LQFP FPT-64P-M03 64-pin plastic LQFP
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FPT-64P-M03
QFP064-P-1010-1
64-pin
FPT-64P-M03)
0P064-P-1010-1
QFP064-P-1010-1
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DIP-64P-M01
Abstract: SDIP064-P-0750-1 020MIN 750-mil
Text: SHRINK DUAL IN-LINE PACKAGE 64 PIN PLASTIC DIP-64P-M01 EIAJ code : SDIP064-P-0750-1 64-pin plastic SH-DIP Lead pitch 70mil Row spacing 750mil Sealing method Plastic mold DIP-64P-M01 64-pin plastic SH-DIP (DIP-64P-M01) +0.22 58.00 –0.55 +.008 2.283 –.022
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DIP-64P-M01
SDIP064-P-0750-1
70mil
750mil
64-pin
DIP-64P-M01)
D64001S-3C-4
DIP-64P-M01
SDIP064-P-0750-1
020MIN
750-mil
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FPT-64P-M09
Abstract: QFP064-P-1212-1
Text: QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M09 EIAJ code : ∗QFP064-P-1212-1 Lead pitch 0.65mm Package width x package length 12 × 12mm Lead shape Gullwing Sealing method Plastic mold 64-pin plastic QFP FPT-64P-M09 64-pin plastic QFP (FPT-64P-M09)
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FPT-64P-M09
QFP064-P-1212-1
64-pin
FPT-64P-M09)
F64018S-1QFP064-P-1212-1
FPT-64P-M09
QFP064-P-1212-1
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DIP-64P-M01
Abstract: SDIP064-P-0750-1
Text: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC DIP-64P-M01 EIAJ code : SDIP064-P-0750-1 64-pin plastic SH-DIP Lead pitch 70 mil Row spacing 750 mil Sealing method Plastic mold DIP-64P-M01 64-pin plastic SH-DIP (DIP-64P-M01) +0.22
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DIP-64P-M01
SDIP064-P-0750-1
64-pin
DIP-64P-M01)
D64001S-3C-4
with00
DIP-64P-M01
SDIP064-P-0750-1
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Untitled
Abstract: No abstract text available
Text: THIN QUAD FLAT L-LEADED PACKAGE 64 PIN PLASTIC FPT-64P-M04 EIAJ code : ∗TQFP064-P-1010-1 64-pin plastic TQFP Lead pitch 0.50mm Package width x package length 10 × 10mm Lead shape Gullwing Sealing method Plastic mold FPT-64P-M04 64-pin plastic TQFP (FPT-64P-M04)
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FPT-64P-M04
TQFP064-P-1010-1
64-pin
FPT-64P-M04)
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68-PIN
Abstract: No abstract text available
Text: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-43 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-44 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-45 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-46
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64-Pin
68-Pin
64-Lead
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Untitled
Abstract: No abstract text available
Text: USE ULTRA37000TM FOR ALL NEW DESIGNS CY7C373i UltraLogic 64-Macrocell Flash CPLD Features • Available in 84-pin PLCC and 100-pin TQFP packages • Pin compatible with the CY7C374i • 64 macrocells in four logic blocks • 64 I/O pins Functional Description
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ULTRA37000TM
CY7C373i
64-Macrocell
84-pin
100-pin
CY7C374i
CY7C373i
FLASH370iTM
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68-PIN
Abstract: No abstract text available
Text: 4.10 Package Diagrams 64-Pin Thin Quad Flat Pack A64 4-40 Package Diagrams 68-Pin Grid Array Cavity Up G68 4-41 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 4-42 Package Diagrams 64-Lead Ceramic Quad Flatpack (Cavity Up) U65 4-43
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64-Pin
68-Pin
64-Lead
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tc 97101
Abstract: No abstract text available
Text: 1, 2, 4 MEG x 64 NONBUFFERED DRAM DIMMs TECHNOLOGY, INC. DRAM MODULE MT4LD T 164A(X) MT8LD264A(X) MT16LD464A(X) FEATURES PIN ASSIGNMENT (Front View) 168-Pin DIMM • JEDEC pin-out in a 168-pin, dual in-line memory module (DIMM) • 8MB (1 Meg x 64), 16MB (2 Meg x 64),
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MT8LD264A
MT16LD464A
168-Pin
168-pin,
024-cycle
048-cycle
MT8LD26
tc 97101
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A64 Package
Abstract: No abstract text available
Text: 3.14 Package Diagrams 64-Pin Thin Quad Flat Pack A64 3-148 Package Diagrams 100-Pin Plastic Thin Quad Flat Pack TQFP A100 3-149 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 3-150
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64-Pin
100-Pin
64-Lead
A64 Package
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Untitled
Abstract: No abstract text available
Text: 3.14 Package Diagrams 64-Pin Thin Quad Flat Pack A64 3-142 Package Diagrams 100-Pin Plastic Thin Quad Flat Pack TQFP A100 3-143 Package Diagrams 64-Lead Plastic Thin Quad Flatpack N65 3-144
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64-Pin
100-Pin
64-Lead
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Untitled
Abstract: No abstract text available
Text: 1, 2 MEG x 64 DRAM SODIMMs TECHNOLOGY, INC. MT4LDT164H X (S) MT8LDT264H(X)(S) SMALL-OUTLINE DRAM MODULE FEATURES PIN ASSIGNMENT (Front View) 144-Pin Small-Outline DIMM (DF-7) 1 Meg x 64 (shown), (DF-8) 2 Meg x 64 • JEDEC- and industry-standard pinout in a 144-pin,
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144-pin,
024-cycle
048-cycle
128ms
MT4LDT164H
144-PIN
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XCR3064XL
Abstract: CP56 CS48 DS012 PC44 VQ100 VQ44
Text: R DS017 v1.5 April 19, 2001 XCR3064XL 64 Macrocell CPLD 14 Product Specification Features Description • Lowest power 64 macrocell CPLD • 6.0 ns pin-to-pin logic delays • System frequencies up to 145 MHz • 64 macrocells with 1,600 usable gates The XCR3064XL is a 3.3V, 64-macrocell CPLD targeted at
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DS017
XCR3064XL
64-macrocell
48-ball
56-ball
44-pin
XCR3064XL
CP56
CS48
DS012
PC44
VQ100
VQ44
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CP56
Abstract: CS48 DS012 PC44 VQ100 VQ44 XCR3064XL xcr3064xl vq44
Text: R XCR3064XL 64 Macrocell CPLD DS017 v1.6 January 8, 2002 14 Product Specification Features Description • Lowest power 64 macrocell CPLD • 6.0 ns pin-to-pin logic delays • System frequencies up to 145 MHz • 64 macrocells with 1,500 usable gates The XCR3064XL is a 3.3V, 64-macrocell CPLD targeted at
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XCR3064XL
DS017
64-macrocell
48-ball
56-ball
100-pin
CP56
CS48
DS012
PC44
VQ100
VQ44
xcr3064xl vq44
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XCR3064XL
Abstract: No abstract text available
Text: R DS017 v1.4 April 11, 2001 XCR3064XL 64 Macrocell CPLD 14 Product Specification Features Description • Lowest power 64 macrocell CPLD • 6.0 ns pin-to-pin logic delays • System frequencies up to 145 MHz • 64 macrocells with 1,600 usable gates The XCR3064XL is a 3.3V, 64-macrocell CPLD targeted at
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XCR3064XL
DS017
44-pin
48-ball
56-ball
100-pin
VQ100
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Untitled
Abstract: No abstract text available
Text: ¿¿PD780031Y, 780032Y, 780033Y, 780034Y NEC ORDERING INFORMATION Part Number /¿PD780031YCW -xxx 64-pin plastic shrink DIP 750 mils /¿PD780031 Y G C -xxx-A B 8 64-pin plastic QFP (14 x 14 mm) /¿PD780031 Y G K -xxx-8A 8 64-pin plastic LQFP ( 1 2 x 1 2 mm)
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uPD780031YCW-xxx
uPD780031YGC-xxx-AB8
uPD780031YGK-xxx-8A8
uPD780032YCW-xxx
uPD780032YGC-XXX-AB8
uPD780032YGK-XXX-8A8
780033Y
780033YG
PD780034YCW
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14X14
Abstract: 64pin
Text: ¿¿PD780021Y, 780022Y, 780023Y, 780024Y NEC ORDERING INFORMATION Part Number /¿PD780021YCW -xxx 64-pin plastic shrink DIP 750 mils /¿PD780021 Y G C -xxx-A B 8 64-pin plastic QFP (14 x 14 mm) /¿PD780021 Y G K -xxx-8A 8 64-pin plastic LQFP ( 1 2 x 1 2 mm)
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uPD780021YCW
uPD780021YGC-xxx-AB8
uPD780021YGK
uPD780022YCW-xxx
uPD780022YGC-XXX-AB8
uPD780022YGK-XXX-8A8
780023Y
780023YG
PD780024YCW
14X14
64pin
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Untitled
Abstract: No abstract text available
Text: 1, 2, 4 MEG X 64 NONBUFFERED DRAM DIMMs M IC R O N DRAM MODULE MT4LD(T 164A(X) MT8LD264A(X) MT16LD464A(X) FEATURES PIN ASSIGNMENT (Front View) 168-Pin DIMM • JEDEC pin-out in a 168-pin, dual in-line memory module (DIMM) • 8MB (1 Meg x 64), 16MB (2 Meg x 64),
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OCR Scan
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PDF
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MT8LD264A
MT16LD464A
168-Pin
168-pin,
024-cycle
048-cycle
lti732
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