Untitled
Abstract: No abstract text available
Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 69% space savings vs. FPBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M72E-XSB2X
W3H32M72E-XSB2XF
256MB
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W3H32M72E-XSBX
Abstract: calibration definition
Text: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm
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W3H32M72E-XSBX
W3H32M72E-XSBX
calibration definition
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H32M72E-XSBX PRELIMINARY* 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm
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W3H32M72E-XSBX
W3H32M72E-XSBX
667Mbs
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H32M64E-XSBX ADVANCED* 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M64E-XSBX
W3H32M64E-XSBX
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges Organized as 32M x 64, user configurable as 2 x
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W3H32M64E-XSBX
667Mbs
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W3H32M72E
Abstract: BA0BA12
Text: White Electronic Designs W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm
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W3H32M72E-XSBX
667Mbs
533Mbs)
650ps,
-550ps,
500ps.
W3H32M72E
BA0BA12
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H64M72E-XSBX PRELIMINARY* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm
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W3H64M72E-XSBX
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W3H128M72
Abstract: W3H128M72E-XSBX W3H128M72E
Text: White Electronic Designs W3H128M72E-XSBX Advanced* 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm
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W3H128M72E-XSBX
W3H128M72
W3H128M72E-XSBX
W3H128M72E
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W3H32M72E
Abstract: No abstract text available
Text: White Electronic Designs W3H32M72E-XSB2X Preliminary 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M72E-XSB2X
W3H32M72E
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H32M72E-XSBX * 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Programmable CAS latency: 3, 4, 5, or 6 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 18 x 20mm
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W3H32M72E-XSBX
667Mbs
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PDF
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W3H64M64E
Abstract: No abstract text available
Text: White Electronic Designs W3H64M64E-XSBX 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Write latency = Read latency - 1* tCK Package: Commercial, Industrial and Military Temperature Ranges • 1.0mm pitch
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W3H64M64E-XSBX
667Mbs
W3H64M64E
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AS4DDR264M72PBG
Abstract: H11M1
Text: iPEM 4.8 Gb SDRAM-DDR2 AS4DDR264M72PBG1 64Mx72 DDR2 SDRAM w/ SHARED CONTROL BUS iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: • Proprietary Enchanced Die Stacked iPEM
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AS4DDR264M72PBG1
64Mx72
dat008
AS4DDR264M72PBG
H11M1
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Untitled
Abstract: No abstract text available
Text: W3H64M72E-XSBX W3H64M72E-XSBXF 512MB – 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 Mb/s 30% Space saving vs. FBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 22mm
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W3H64M72E-XSBX
W3H64M72E-XSBXF
512MB
667Mbs
533Mbs
400Mbs
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84 FBGA
Abstract: W3H64M72E-XSBX fbga84 ccd400
Text: White Electronic Designs W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 72 • 1.0mm pitch Weight: W3H64M72E-XSBX - 2.5 grams typical
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W3H64M72E-XSBX
W3H64M72E-XSBX
84 FBGA
fbga84
ccd400
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Untitled
Abstract: No abstract text available
Text: Product Nomenclature Guide: ZEÊÃĽãçÙ Logic Devices Incorporated Product Type 9D = DDR 2 = DDR2 3 = DDR3 Words 32M = 32 MB 64M = 64 MB 128M = 128 MB 256M = 256 MB 512M = 512 MB 1G = 1024 MB Wordwidth 32 = x32 64 = x64 72 = x72 80 = x80 S = Single Channel
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200MHz
400Mbs
533Mbs
333MHz
667Mbs
400MHz
800Mbs
533MHz
1066Mbs
667MHz
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H11M1
Abstract: No abstract text available
Text: i PEM 4.8 G b SDRAM-DDR2 Gb Austin Semiconductor, Inc. AS4DDR264M72PBG1 64Mx72 DDR2 SDRAM w/ SHARED CONTROL BUS iNTEGRATED Plastic Encapsulated Microcircuit FEATURES BENEFITS DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Extended Temp
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AS4DDR264M72PBG1
64Mx72
daDDR264M72PBG1
H11M1
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PDF
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W3H128M72E-XSBX
Abstract: 84 FBGA
Text: White Electronic Designs W3H128M72E-XSBX 128M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667, 533, 400 Package: CK/CK# Termination options available • 0 ohm, 20 ohm • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Posted CAS additive latency: 0, 1, 2, 3 or 4
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W3H128M72E-XSBX
775mA
975mA
-100ps
250ps
350ps
400ps
W3H128M72E-XSBX
84 FBGA
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PDF
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18CO
Abstract: No abstract text available
Text: White Electronic Designs W3H64M64E-XSBX ADVANCED* 64M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Commercial, Industrial and Military Temperature Ranges • 208 Plastic Ball Grid Array PBGA , 16 x 22mm Organized as 64M x 64 • 1.0mm pitch
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W3H64M64E-XSBX
18CO
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PDF
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W3H128M72ER-XSBX
Abstract: LDM-1 W3H128M72
Text: White Electronic Designs W3H128M72ER-XNBX PRELIMINARY* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES Data rate = 667, 533, 400 Mb/s Posted CAS additive latency: 0, 1, 2, 3 or 4 Package: Write latency = Read latency - 1* tCK Commercial, Industrial and Military Temperature
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W3H128M72ER-XNBX
W3H128M72ER-XSBX
LDM-1
W3H128M72
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs W3H64M72E-XSBX ADVANCED* 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES Data rate = 667*, 533, 400 Programmable CAS latency: 3, 4 or 5 Package: Posted CAS additive latency: 0, 1, 2, 3 or 4 • 208 Plastic Ball Grid Array PBGA , 16 x 22mm
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W3H64M72E-XSBX
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Untitled
Abstract: No abstract text available
Text: W3H32M72E-XSB2X W3H32M72E-XSB2XF 256MB – 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 69% space savings vs. FPBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm
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W3H32M72E-XSB2X
W3H32M72E-XSB2XF
256MB
W3H64M72E-XSBXF
SN63Pb37
SAC305
256MB"
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PDF
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Untitled
Abstract: No abstract text available
Text: W3H128M72ER-XNBX ADVANCED* 128M x 72 REGISTERED DDR2 SDRAM 255 PBGA FEATURES BENEFITS Data rate = 667, 533, 400 Mb/s 45% Space savings vs. FBGA Package: Reduced part count • 255 Plastic Ball Grid Array PBGA , 23 x 21mm 51% I/O reduction vs FBGA
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W3H128M72ER-XNBX
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Untitled
Abstract: No abstract text available
Text: W3H264M16E-XSBX 256MB – 2 x 64M x 16 DDR2 SDRAM 79 PBGA FEATURES BENEFITS Data rate = 400 Mb/s, 533 Mb/s, 667 Mb/s Larger ball pitch for higher reliability Package: Footprint compatible with W3H64M16E • 79 Plastic Ball Grid Array PBGA , 11 x 14mm
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W3H264M16E-XSBX
256MB
W3H64M16E
128MB"
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Untitled
Abstract: No abstract text available
Text: W3H32M64E-XSBX 256MB – 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package FEATURES BENEFITS Data rate = 667, 533, 400 Mb/s 62% Space savings vs. FBGA Package: Reduced part count • 208 Plastic Ball Grid Array PBGA , 16 x 20mm 42% I/O reduction vs FBGA
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W3H32M64E-XSBX
256MB
256MB"
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