Hitachi DSA00280
Abstract: hd64f2215te HD64F2215UTE HD64F2215
Text: Hitachi Single-Chip Microcomputer H8S/2215 Series Hardware Manual ADE-602-217B Rev. 3.0 10/04/02 Hitachi Ltd. Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in
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H8S/2215
ADE-602-217B
Connection/Disconnection485
Hitachi DSA00280
hd64f2215te
HD64F2215UTE
HD64F2215
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stc 8080 h
Abstract: marking code 1BL Diode H8/300 Series Hitachi Embedded Workshop HD64F2215 C005E induction heating oscillator circuit INV 50/1000 mitsubishi mds c1 CSTCW48M0X11 ac voltage regulator using SCR circuit diagram
Text: To all our customers Regarding the change of names mentioned in the document, such as Hitachi Electric and Hitachi XX, to Renesas Technology Corp. The semiconductor operations of Mitsubishi Electric and Hitachi were transferred to Renesas Technology Corporation on April 1st 2003. These operations include microcomputer, logic, analog
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Connection/Disconnection485
H8S/2215
stc 8080 h
marking code 1BL Diode
H8/300 Series Hitachi Embedded Workshop
HD64F2215
C005E
induction heating oscillator circuit
INV 50/1000
mitsubishi mds c1
CSTCW48M0X11
ac voltage regulator using SCR circuit diagram
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rs 348-627
Abstract: FP-221 H8S/2210 HD64F2212FP24 HD6432211 HD6432217 HD64F2212 HD64F2212U HD64F2218 HD64F2218U
Text: REJ09B0074-0300O The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. Details should always be checked by referring to the relevant text. 16 H8S/2218, H8S/2212 Group Hardware Manual
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REJ09B0074-0300O
H8S/2218,
H8S/2212
16-Bit
Family/H8S/2200
H8S/2218
H8S/2212
HD64F2218
HD64F2218U
HD6432217
rs 348-627
FP-221
H8S/2210
HD64F2212FP24
HD6432211
HD6432217
HD64F2212
HD64F2212U
HD64F2218
HD64F2218U
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A72P60F1
Abstract: A90P36F1 A36P16G A30P24SS6 A90P36F1G A73P68N A48P42G A14P12C A72P24F2 PNL30
Text: Accessories: Panels and Panel Accessories Panels for Enclosures Spec-00310 N PH 763 (763) 422-2600 422-2211 FX Accessories Panels and Panel Accessories Panels for Enclosures Perforated Panels Perforated panels are 16 gauge steel and accept self-tapping screws and eliminate the need to measure, mark and drill when mounting
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Spec-00310
A10N8PP
A10N10PP
A12N10PP
A12N12PP
A14N12PP
A16N12PP
A20N12PP
A16N12MPP
A16N16MPP
A72P60F1
A90P36F1
A36P16G
A30P24SS6
A90P36F1G
A73P68N
A48P42G
A14P12C
A72P24F2
PNL30
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MPF 39VF512
Abstract: sst mpf 39vf512 39SF512 39SF010 sst mpf 39vf040 28sf040a 39VF010 39VF512 f0114 39vf020
Text: Die Sales Specifications INTRODUCTION TO UNENCAPSULATED DIE This document provides the user with guidelines for processing, testing, and resolving applications issues associated with purchasing unencapsulated SST flash EEPROM die. Product electrical specifications, functional descriptions, and bonding diagrams are not included. This information is available in the appropriate
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Untitled
Abstract: No abstract text available
Text: Conduit Introduction Introduction to Conduit Interconnect Technologies and Packaging Determining Tubing Size How to use the tables on this page: It is possible for a wire bundle to contain wires of all the same size diameter, or a variety of mixed diameters.
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DAP11
Abstract: DAP7 DLPA014 micromirror dlp DMD .45 DLPZ004 DLPA200
Text: DLP5500 www.ti.com DLPS013A – APRIL 2010 – REVISED JUNE 2010 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, Micrometer-Sized Mirrors XGA Resolution
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DLP5500
DLPS013A
55-Inch
16-Bit,
DAP11
DAP7
DLPA014
micromirror
dlp DMD .45
DLPZ004
DLPA200
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Untitled
Abstract: No abstract text available
Text: DLP5500 www.ti.com DLPS013E – APRIL 2010 – REVISED SEPTEMBER 2013 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors
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DLP5500
DLPS013E
55-Inch
16-Bit,
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DAP11
Abstract: 45027
Text: DLP5500 www.ti.com DLPS013C – APRIL 2010 – REVISED JUNE 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution
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DLP5500
DLPS013C
55-Inch
16-Bit,
DAP11
45027
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Untitled
Abstract: No abstract text available
Text: DLP5500 www.ti.com DLPS013D – APRIL 2010 – REVISED OCTOBER 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution
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DLP5500
DLPS013D
55-Inch
16-Bit,
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Untitled
Abstract: No abstract text available
Text: DLP5500 www.ti.com DLPS013E – APRIL 2010 – REVISED SEPTEMBER 2013 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors
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DLP5500
DLPS013E
55-Inch
16-Bit,
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450-2.700-L-13.25-149
Abstract: micromirror digital micromirror
Text: DLP5500 www.ti.com DLPS013D – APRIL 2010 – REVISED OCTOBER 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution
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DLP5500
DLPS013D
55-Inch
16-Bit,
450-2.700-L-13.25-149
micromirror
digital micromirror
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DAP11
Abstract: 450-2.700-L-13.25-149 420nm DAp15 DAN7 DLPS014 DLPR200 amphenol usb connector E2G3 micromirror
Text: DLP5500 www.ti.com DLPS013C – APRIL 2010 – REVISED JUNE 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution
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DLP5500
DLPS013C
55-Inch
16-Bit,
DAP11
450-2.700-L-13.25-149
420nm
DAp15
DAN7
DLPS014
DLPR200
amphenol usb connector
E2G3
micromirror
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DLPS013D
Abstract: No abstract text available
Text: DLP5500 www.ti.com DLPS013D – APRIL 2010 – REVISED OCTOBER 2012 DLP 0.55 XGA Series 450 DMD Check for Samples: DLP5500 FEATURES 1 • 2 • • • • 0.55-Inch Micromirror Array Diagonal – 1024 x 768 Array of Aluminum, MicrometerSized Mirrors XGA Resolution
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DLP5500
DLPS013D
55-Inch
16-Bit,
DLPS013D
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Hysol
Abstract: MG40FS mdm-25PBS PH50S24-5 MDM-51SBR MDM-37PCBR MDM-37PBR MDM-9SBS MDM-15PBS M83513/5-07
Text: Micro-D PCB - .050" Contact Spacing MDM-PCB MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the standard MDM metal shell and provide high density and high reliability in board-to-board,
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744046
Abstract: AA-744046 A19177-001 BIOS 686 686 bios D820LP A14724-403 irq routing
Text: Product Change Notification # 101454-00 Information in this document is provided in connection with Intelâ â products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s
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A14723-402
A14723-403
A14724-402
A14724-403
744046
AA-744046
A19177-001
BIOS 686
686 bios
D820LP
A14724-403
irq routing
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service manual servo mbdht2510e
Abstract: MBDHT2510 MANUAL msm 8255 MDDHT5540E MBDHT2510 CODE ERROR MBDHT2510E MBDHT2510 MDDHT5540 MADHT1507 MEDHT7364
Text: AC Servo MINAS A5 series High performance, multi function and easy use, all advanced. Easy Safe k Quic rt Sma t Ligh 2009/10 Catalog Contents A small step for axis. Large step ahead for system motion. Features. 2
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e/25000/motor
ISO14001
ISO14001
ISO9001
ISO9001
service manual servo mbdht2510e
MBDHT2510 MANUAL
msm 8255
MDDHT5540E
MBDHT2510 CODE ERROR
MBDHT2510E
MBDHT2510
MDDHT5540
MADHT1507
MEDHT7364
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MDM-PCB
Abstract: No abstract text available
Text: ca_D1-D102:Layout 1 2/10/11 11:51 AM Page 1 ca_D1-D102:Layout 1 2/10/11 11:51 AM Page 18 Micro-D PCB - .050" Contact Spacing MDM-PCB MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi-layer boards. They use the
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24AWG
MDM-PCB
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FA-144GJ-UEN-A
Abstract: 70F3368 PD70F3745GJ-GAE-AX PMC540
Text: User’s Manual V850ES/JJ3 32-bit Single-Chip Microcontrollers Hardware PD70F3743 μPD70F3744 μPD70F3745 μPD70F3746 Document No. U18376EJ3V0UD00 3rd edition Date Published August 2008 N 2006 Printed in Japan [MEMO] 2 User’s Manual U18376EJ3V0UD NOTES FOR CMOS DEVICES
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V850ES/JJ3
32-bit
PD70F3743
PD70F3744
PD70F3745
PD70F3746
U18376EJ3V0UD00
U18376EJ3V0UD
FA-144GJ-UEN-A
70F3368
PD70F3745GJ-GAE-AX
PMC540
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ci 4521
Abstract: S13A speed probe MT5LC128K8D4S13A MT5LC64K16D4S13A
Text: MICRON • S 13A 1 MEG SRAM DIE SCM CONDUCTOR INC SRAM DIE 1 MEG SRAM 1 2 8 K X 8 , 6 4 K x 16 FEATURES • Single +3.3V or +5V power supply • 5V tolerant I/O • Individual byte controls for both READ and WRITE DIE OUTLINE Top View 3.3V none n /a -15*
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150mm
C19iM.
ci 4521
S13A
speed probe
MT5LC128K8D4S13A
MT5LC64K16D4S13A
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Untitled
Abstract: No abstract text available
Text: b llis in O0 10 l b 3 • n RN SEM CQ N O JCTO ftlM C 1 MEG SRAM p3|E | SRAM DIE 1 MEG SRAM 1 2 8 KX 8 , 6 4 K x 16 FEATURES DIE OUTLINE Top View • Single +3.3V or +5V power supply • 5V tolerant I/O • Individual byte controls for both READ and WRITE
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150mm
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686 6k 725
Abstract: S13AA
Text: MICRO N S E M I C O N D U C T O R INC b'îE D • h l l l S M T □ □ □ cm 3 M ^ ^ S L Ç iÎ fc.72 ■ MRN 1 M EG S R A M m E SRAM DIE 1 MEG SRAM 64K X 1 6 FEATURES DIE OUTLINE Top View 3 2 9 □ 3 1 □ OPTIONS □ □ • Wafer thickness = 18.5 mils ±0.5 mils
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150mm
842x12
686 6k 725
S13AA
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Untitled
Abstract: No abstract text available
Text: DS1613C SEMICONDUCTOR DALLAS DS1613C Partitioned SmartSocket 256K FEATURES PIN ASSIGNMENT • Accepts standard 32K x 8, CMOS static RAMs • Embedded lithium energy cell retains RAM data A14 1 A12 2 3 • Unconditionally write protects all of memory when V qc is out of tolerance
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DS1613C
28-PIN
2bl4130
28-PIN
010TNA
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Untitled
Abstract: No abstract text available
Text: Microminiature Connectors - The Micro Line MDM-PCB connectors are designed for use with flex circuitry, flat cable and printed circuit boards or multi layer boards. They use the standard M DM metal shell and provide high density and high reliability in board-to-board,
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