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    K177-353BQ2840

    Abstract: K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353
    Text: HEATSINKS & MOUNTINGS MOUNTING HARDWARE THERMAL INTERFACE MATERIALS KOOL-PADS KA150-2AC. Provides an efficient method of mounting heatsinks on to devices such as CPUs, DIL/SMT packages and other similar devices requiring effective transfer of generated heat. Highly conductive aluminium foil with adhesive applied to both sides negates the


    Original
    PDF KA150-2AC. 300mm KA150-2AC-30X30 5-100X100 2-100X100 0-100X100 5000Vrms K177-353BQ2840 K177-NA-353 K1778 TSC209-ZP k177 TSC506-NY K200-AC-403 TSC405-ZP K177-AC-353 K200-AC-353