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    744 065 330 Search Results

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    744 065 330 Price and Stock

    Wurth Elektronik 744065330

    FIXED IND 33UH 1.6A 180 MOHM SMD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey 744065330 Digi-Reel 739 1
    • 1 $1.68
    • 10 $1.634
    • 100 $1.3068
    • 1000 $1.2258
    • 10000 $1.2258
    		Buy Now
    744065330 Cut Tape 739 1
    • 1 $1.68
    • 10 $1.634
    • 100 $1.3068
    • 1000 $1.2258
    • 10000 $1.2258
    		Buy Now
    744065330 Reel 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 $1.1025
    • 10000 $1.1025
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    Mouser Electronics 744065330 592
    • 1 $1.11
    • 10 $1.1
    • 100 $1.06
    • 1000 $0.914
    • 10000 $0.914
    		Buy Now
    Newark 744065330 Cut Tape 552 1
    • 1 $1.32
    • 10 $1.31
    • 100 $1.27
    • 1000 $1.27
    • 10000 $1.27
    		Buy Now
    RS 744065330 Bulk 4 Weeks 1
    • 1 $0.785
    • 10 $0.785
    • 100 $0.785
    • 1000 $0.785
    • 10000 $0.785
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    744 065 330 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    744065330 Wurth Elektronik Fixed Inductors, Inductors, Coils, Chokes, INDUCTOR POWER 33UH 1.6A SMD Original PDF

    744 065 330 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    WURTH 744 065 100

    Abstract: 744 065 330 620 800 066 wurth 744 3300 XL ON 010 L0 620uH
    Text: more than you expect SIZE: a x b x c in mm 6.8 x 6.8 x 2.3 10.0 x 10.0 x 2.8 10.0 x 10.0 x 3.8 TECHNICAL DATA: L 0: 1.00 - 330.0 µH RDCmax: 0.0065 - 1.00 Ω Tiny SMD Power Inductors WE-TPC Large Size I N: 0.70 - 10.00 A Isat: 0.60 - 8.00 A more than you expect


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: CHIP ARRAYS Chip Resistor Array Chip Resistor Array Chip Resistor Array Chip Resistor Array Chip Resistor Array Chip Resistor Array 741 742 743 744 745 746 4 2 X 8(4) 16(8) C, X X 4(2) C 8(4) C, X 4(2) C 4(2) C 8(4) 4(2) C 8(4) 10(8) C or X 10(8) X .026(.65) .020(.50)


    Original     		200ppm/Â 742C043101JP PDF

    Untitled

    Abstract: No abstract text available
    Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		742C08310R0F 741X043 742C043 742C083 745C101 745X101 741C083 742C163 743C043 743C083 PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		742C08310R0F 741X043 742C043 742C083 745C101 745X101 741C083 742C163 743C043 743C083 PDF

    741C083

    Abstract: 742C083 Array chip resistors size 8 0402 resistor array 4.7k 741X043 741X083 742C163
    Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		7310R0F 741X043 742C043 742C083 745C101 745X101 741C083 742C163 743C043 743C083 741C083 742C083 Array chip resistors size 8 0402 resistor array 4.7k 741X043 741X083 PDF

    741C083

    Abstract: 741X043 741X083 741X163 742C043 470k RESISTORS 153 RESISTOR CHIP MARKING CODE
    Text: 8/05/02 Series 741, 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options


    Original     		470KOhm 100KOhm 742C083 742X083 742C163 743C043 743C083 744C043 744C083 745C101 741C083 741X043 741X083 741X163 742C043 470k RESISTORS 153 RESISTOR CHIP MARKING CODE PDF

    741C083

    Abstract: 741X043 741X083 741X163 CTS CORPORATION 744 745 510
    Text: 4/16/02 Series 741, 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options


    Original     		742C083 742X083 742C163 743C043 743C083 744C043 744C083 745C101 745C102 745X101 741C083 741X043 741X083 741X163 CTS CORPORATION 744 745 510 PDF

    resistor array 4.7k

    Abstract: 744C083 Array chip resistors size 8 0402 data sheet of resistor 33k jrc lm2903 x16 3 marking -ddr -sdram -rimm -sram -flash -m 741C083 741X043 741X083 741X163
    Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		741X043 741C083 741X083 742C043 741X163 742C083 742X083 742C163 743C043 743C083 resistor array 4.7k 744C083 Array chip resistors size 8 0402 data sheet of resistor 33k jrc lm2903 x16 3 marking -ddr -sdram -rimm -sram -flash -m 741C083 741X043 741X083 741X163 PDF

    A006 A008

    Abstract: No abstract text available
    Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		741X043 740X043 741C083 741X083 742C043 741X163 742C083 742X083 742C163 743C043 A006 A008 PDF

    Untitled

    Abstract: No abstract text available
    Text: Series 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options


    Original     		742X083101J 742C043 742C083 742X083 742C163 743C043 743C083 744C043 744C083 745C101 PDF

    153 RESISTOR CHIP MARKING CODE

    Abstract: No abstract text available
    Text: Series 742, 743, 744, 745, 746 Technical R THICK FILM CHIP RESISTOR ARRAYS * Low cost * High density packaging * Leadless surface mount construction * Tape & reel packaging * Solder coated nickel barrier pads * Isolated and bussed circuits * Convex or Concave Termination Options


    Original     		742X083101J 742C043 742C083 742X083 742C163 743C043 743C083 744C043 744C083 745C101 153 RESISTOR CHIP MARKING CODE PDF

    0555B

    Abstract: footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238
    Text: Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44-Lead, Thin (1.0 mm) Plastic Quad Flat Package (TQFP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-7


    Original     		44-Lead, 48-Lead, 64-Lead 100-Lead, 144-Lead, 24-Lead, 20-Lead, 0555B footprint jedec MS-026 TQFP AEB 20D3 48C1 footprint jedec MS-026 TQFP 128 jedec mo-142 footprint TSOP 1238 PDF

    73F12

    Abstract: No abstract text available
    Text: R F CHOKES 70F SERIES Test Fo R,dc Miller L±20% Q Freq. Min. Max. Number µH Min. MHz MHz Ohms 70F107AP .1 49 25 600 .013 70F157AP .15 52 25 490 .025 70F227AP .22 48 25 400 .038 70F337AP .33 47 25 330 .07 70F477AP .47 46 25 280 .125 70F687AP .68 48 25 240 .2


    Original     		70F107AP 70F157AP 70F227AP 70F337AP 70F477AP 70F687AP 70F757AP 70F827AP 70F106AI 70F126AI 73F12 PDF

    10K ohms 0805 package

    Abstract: No abstract text available
    Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		741X043 742C043 742C083 745C101 745X101 741C083 742C163 743C043 743C083 744C043 10K ohms 0805 package PDF

    Untitled

    Abstract: No abstract text available
    Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		2C083 741X043 742C043 742C083 745C101 745X101 741C083 742C163 743C043 743C083 PDF

    740X043

    Abstract: 741C083 741X043 741X083
    Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		741X043 740X043 741C083 741X083 742C043 741X163 742C083 742X083 742C163 743C043 741C083 741X043 741X083 PDF

    RESISTORS 3.3K

    Abstract: No abstract text available
    Text: Resistor Chip Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		741X043 742C043 742C083 745C101 745X101 741C083 742C163 743C043 743C083 744C043 RESISTORS 3.3K PDF

    footprint jedec MS-026 TQFP AEB

    Abstract: footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat Package (LQFP) . .5


    Original     		32-lead, 44-lead, 48-lead, 64-lead 100-lead, 144-lead, 24-lead, 20-lead, footprint jedec MS-026 TQFP AEB footprint jedec MS-026 LQFP jedec mo-142 footprint 13-2L footprint jedec MS-026 TQFP 48C1 28P6 JEDEC MS-026 footprint PDF

    742C083100JP

    Abstract: 742C083102J 100W high power resistor 8.2K Resistor Power Resistor 100w resistor 220 ohm Resistors 3.0k ohm 0805 150k 1K 220 Ohm resistor res 0603
    Text: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits


    Original     		741X043 740X043 741C083 741X083 742C043 741X163 742C083 745C101 742C163 743C043 742C083100JP 742C083102J 100W high power resistor 8.2K Resistor Power Resistor 100w resistor 220 ohm Resistors 3.0k ohm 0805 150k 1K 220 Ohm resistor res 0603 PDF

    footprint jedec MS-026 TQFP

    Abstract: atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545
    Text: Each Atmel datasheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		32-lead, 44-lead, 48-lead, 64-lead 100-lead, 0555D 11/99/xM footprint jedec MS-026 TQFP atmel 0328 PQFP chip size CERAMIC LEADLESS CHIP CARRIER 68 MS-026-AED ATMEL 740 64 CERAMIC LEADLESS CHIP CARRIER LCC 8 lead side brazed ATMEL 342 atmel 545 PDF

    atmel 0328

    Abstract: jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB
    Text: Each Atmel datasheet includes an Ordering Information section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 32A 32-lead, Low-profile (1.4 mm) Plastic Quad Flat


    Original     		120C1 32-lead, 44-lead, 48-lead, 0555H 08/00/xM atmel 0328 jedec mo-142 footprint footprint jedec MS-026 LQFP 100RQ footprint jedec MS-026 TQFP 144 47 16s 8p3 footprint jedec MS-026 LQFP 64 pin footprint jedec MS-026 TQFP AEB PDF

    Untitled

    Abstract: No abstract text available
    Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations


    Original     		742C083 PDF

    .024 ohm resistors

    Abstract: 222 thick film chip resistor 49R9 740X043 741X163 742C083 742C083100JP chip resistor 683
    Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations


    Original     		742C083 .024 ohm resistors 222 thick film chip resistor 49R9 740X043 741X163 742C083100JP chip resistor 683 PDF

    tmc 4.7k ohm

    Abstract: 0603x8 49R9 740X043 741X163 742C083 742C083100JP 742C083102JP 742C083102J
    Text: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations


    Original     		742C083 tmc 4.7k ohm 0603x8 49R9 740X043 741X163 742C083100JP 742C083102JP 742C083102J PDF