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    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 DT BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF

    bga solder ball shear

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos 754Pos. 29X29 bga solder ball shear foxconn PDF

    BGA754

    Abstract: foxconn
    Text: SPECIFICATIONS BGA 754 LP BG A CPU Socket BG A SM T Type 1.27X1.27mm [.05X. 05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 17 mΩ max.


    Original     		13kgf 1000gf 1000m 754Pic, 754Pos. BGA754 foxconn PDF

    foxconn

    Abstract: BGA754
    Text: SPECIFICATIONS BGA 754 DT BG A CPU Socket BG A SM T Type 1.27X1.27mm[.05X. 05”]Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 foxconn BGA754 PDF

    BGA754

    Abstract: Solder ball shear bga solder ball shear foxconn
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754PoV-0 754Pos. 29X29 BGA754 Solder ball shear bga solder ball shear foxconn PDF

    BGA754

    Abstract: Solder ball shear
    Text: SPECIFICATIONS BGA 754 MB BGA CPU Socket BGA SMT Type 1.27X1.27mm [.05 X.05”] Pitch 754 Pos. Mechanical Contact Rentention Force: 0.13kgf min. Durability: 50 Cycles min. Solder Ball Shear Force: 1000gf min. Electrical Contact Resistance : 20 mΩ max. Insulation Resistance: 1000mΩ min.


    Original     		13kgf 1000gf 1000m 754Pos. 29X29 BGA754 Solder ball shear PDF