Untitled
Abstract: No abstract text available
Text: TYPE: 79L08nd CHIP APPEARANCE CHIP SIZE CHIP THICKNESS 3 INPUT 1 2 3 BONDING PAD DIMENSION 0,85 x 0,85 mm 460 ± 20 m or 280 ± 20μm 92 × 92 μm 92 × 92 μm 92 × 92 μm 80 μm Al – (or Ti-Ni-Ag) 100 mm OUTPUT GROUND SCRIBE LINE WIDTH TOP METAL BACK METAL
|
Original
|
79L08nd
|
PDF
|
Untitled
Abstract: No abstract text available
Text: TYPE: 79L08nd CHIP APPEARANCE CHIP SIZE CHIP THICKNESS 3 INPUT 1 2 3 BONDING PAD DIMENSION 0,85 x 0,85 mm 460 ± 20 m or 280 ± 20μm 92 × 92 μm 92 × 92 μm 92 × 92 μm 80 μm Al – (or Ti-Ni-Ag) 100 mm OUTPUT GROUND SCRIBE LINE WIDTH TOP METAL BACK METAL
|
Original
|
79L08nd
|
PDF
|