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    8 PIN LEAD SOP Search Results

    8 PIN LEAD SOP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    8 PIN LEAD SOP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    transistor 8P

    Abstract: FPT-8P-M01 M01 8-pin
    Text: SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC FPT-8P-M01 EIAJ code : ∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50mil Nominal dimensions 300mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold FPT-8P-M01 8-pin plastic SOP


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    FPT-8P-M01 OP008-P-0300-1 50mil 300mil FPT-8P-M01) F08002S-4C-4 transistor 8P FPT-8P-M01 M01 8-pin PDF

    M01 8-pin

    Abstract: FPT-8P-M01
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 8-pin plastic SOP FPT-8P-M01 8-pin plastic SOP (FPT-8P-M01) Lead pitch 1.27 mm Package width x package length 5.3 × 6.35 mm Lead shape Gullwing Sealing method Plastic mold


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    FPT-8P-M01 FPT-8P-M01) F08002S-c-6-7 M01 8-pin FPT-8P-M01 PDF

    Untitled

    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN CERAMIC To Top / Package Lineup / Package Index FPT-8C-A01 8-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215)


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    FPT-8C-A01 FPT-8C-A01) F08003SC-2-2 FUJ-A01) PDF

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    Abstract: No abstract text available
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN CERAMIC FPT-8C-A01 8-pin ceramic SOP Lead pitch 50 mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215) TYP 3.81(.150) REF 0.05(.002)


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    FPT-8C-A01 FPT-8C-A01) F08003SC-2-2 orderin-A01) PDF

    FPT-8P-M08

    Abstract: 530010 5 pin lead sop
    Text: SMALL OUTLINE PACKAGE FUJITSU MICROELECTRONICS DATA SHEET 8 PIN PLASTIC FPT-8P-M08 8-pin plastic SOP Lead pitch 1.27 mm Package width x package length 5.30 mm × 5.24 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold Mounting height


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    FPT-8P-M08 FPT-8P-M08) F08016S-c-1-1 FPT-8P-M08 530010 5 pin lead sop PDF

    8 pin lead sop

    Abstract: FPT-8C-A01 272 8pin fpt-8c
    Text: SMALL OUTLINE L-LEADED PACKAGE 8 PIN CERAMIC FPT-8C-A01 8-pin ceramic SOP Lead pitch 50mil Lead shape Gullwing Sealing method Metal seal FPT-8C-A01 8-pin ceramic SOP (FPT-8C-A01) 5.45(.215) TYP 3.81(.150) REF 0.05(.002) TYP 5.40(.213) TYP 3.80(.150) TYP


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    FPT-8C-A01 50mil FPT-8C-A01) F08003SC-2-2 8 pin lead sop FPT-8C-A01 272 8pin fpt-8c PDF

    M01 8-pin

    Abstract: FPT-8P-M01
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II Lead shape Gullwing Sealing method Plastic mold


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    FPT-8P-M01 OP008-P-0300-1 FPT-8P-M01) F08002S-4C-4 M01 8-pin FPT-8P-M01 PDF

    FPT-8P-M02

    Abstract: weight of SOP package
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC FPT-8P-M02 8-pin plastic SOP Lead pitch 1.27 mm Package width x package length 3.9 × 5.05 mm Lead shape Gullwing Sealing method Plastic mold Mounting height 1.75 mm MAX Weight


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    FPT-8P-M02 FPT-8P-M02) F08004S-c-4-7 FPT-8P-M02 weight of SOP package PDF

    S14GM-50-225B

    Abstract: No abstract text available
    Text: : Available, : Under development Plastic SOP Nominal Dimensions mil Lead Pitch (mm) Pin Counts 8 14 16 20 24 28 32 40 44 225 300 375 1.27 450 525 600 Plastic SSOP Nominal Dimensions (mil) Lead Pitch (mm) 225 0.65 Pin Counts 8 0.50 300 0.65 0.8 0.65 375 0.8


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    S8GM-50-225B-4 S14GM-50-225B, 65-225B-2 P16GM-65-225B-2 P20GR-65-225C-2 P20GM-65-300B-3 P24GS-65-300B-1 P30GS-65-300B-2 P36GM-80-300B-3 P38GS-65-300B-2 S14GM-50-225B PDF

    TSSOP 8PIN MARK 21

    Abstract: land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P
    Text: CMOS IC PACKAGES Package Type DIP/TO Gull-wing Flat-lead WLP *1 Pin Count 3 8 4 5 3 5 6 3 5 8 14 8 10 8 16 24 8 5 6 8 8 10 6 4 6 8 4 5 6 8 Package Name TO-92 8-Pin DIP SC-82AB SC-88A SOT-23-3 SOT-23-5 SOT-23-6 SOT-89-3 SOT-89-5 8-Pin SOP JEDEC 14-Pin SOP


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    SC-82AB SC-88A OT-23-3 OT-23-5 OT-23-6 OT-89-3 OT-89-5 14-Pin 10-Pin 16-Pin TSSOP 8PIN MARK 21 land pattern for TSsOP 16 6pin land pattern for TSsOP 8 2952 8pin HA005-A-P PDF

    M01 8-pin

    Abstract: FPT-8P-M01
    Text: SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 8 PIN PLASTIC To Top / Package Lineup / Package Index FPT-8P-M01 EIAJ code :∗SOP008-P-0300-1 8-pin plastic SOP Lead pitch 50 mil Nominal dimensions 300 mil Standard Conforms with EIAJ:TYPE II


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    FPT-8P-M01 OP008-P-0300-1 FPT-8P-M01) F08002S-4C-4 M01 8-pin FPT-8P-M01 PDF

    PA-SOD-1603-D250-08/2

    Abstract: PA-SOD-1603-D250-14/2 PA-SOD-1603-D250-16/2 SOD1603-2
    Text: PA-SOD-1603-D250-xx/2 Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.


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    PA-SOD-1603-D250-xx/2 SD-03 16SD-03 OD1603-2 PA-SOD-1603-D250-08/2 PA-SOD-1603-D250-14/2 PA-SOD-1603-D250-16/2 SOD1603-2 PDF

    Enplas OTS

    Abstract: Enplas ots-16 Enplas ots-16-1.27-03 ots1612703 236 SOD enplas ots-16 Sd pcb 16SD-03 16/Enplas ots-16-1.27-03
    Text: PA-SOD-1603-D250-xx Data Sheet 8, 14 & 16 pin SO socket/8, 14 & 16 pin SO-Plugs Supported Device/Footprints Adapter Construction Using these adapters, 8, 14 and 16 pin SO packages with a body width of 3.9mm - 4.0mm and lead pitch 1.27mm can be socketed over their PCB footprints.


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    PA-SOD-1603-D250-xx SD-03 16SD-03 OD1603-2 Enplas OTS Enplas ots-16 Enplas ots-16-1.27-03 ots1612703 236 SOD enplas ots-16 Sd pcb 16/Enplas ots-16-1.27-03 PDF

    PA-SOD-2006-D310-08/2

    Abstract: PA-SOD-2006-D310-14/2 PA-SOD-2006-D310-16/2 PA-SOD-2006-D310-18/2 PA-SOD-2006-D310-20/2 SOD2006-2
    Text: PA-SOD-2006-D310-xx/2 Data Sheet 8-20 pin SO socket/8-20 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be socketed over their PCB footprints.


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    PA-SOD-2006-D310-xx/2 socket/8-20 OD2006-2 PA-SOD-2006-D310-08/2 PA-SOD-2006-D310-14/2 PA-SOD-2006-D310-16/2 PA-SOD-2006-D310-18/2 PA-SOD-2006-D310-20/2 SOD2006-2 PDF

    PA-SOD-2806-D470-14/2

    Abstract: PA-SOD-2806-D470-16/2 PA-SOD-2806-D470-18/2 PA-SOD-2806-D470-20/2 PA-SOD-2806-D470-24/2 PA-SOD-2806-D470-28/2 SOD2806-2
    Text: PA-SOD-2806-D470-xx/2 Data Sheet 8-28 pin SO socket/8-28 pin SO-Plugs Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 8.0mm - 8.5mm and lead pitch of 1.27mm can be socketed over their PCB footprints.


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    PA-SOD-2806-D470-xx/2 socket/8-28 OD2806-2 PA-SOD-2806-D470-14/2 PA-SOD-2806-D470-16/2 PA-SOD-2806-D470-18/2 PA-SOD-2806-D470-20/2 PA-SOD-2806-D470-24/2 PA-SOD-2806-D470-28/2 SOD2806-2 PDF

    MM225-1A

    Abstract: SC-527-8AA sc5278
    Text: Mounting Pad Packing Magazine Name MM225-1A 8 pin SOP 225 mil 8 5 P detail of lead end 4 1 A H J E K F G I B L N C D M M NOTE Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS


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    MM225-1A S8GM-50-225B-4 SC-527-8AA* MM225-1A SC-527-8AA sc5278 PDF

    Untitled

    Abstract: No abstract text available
    Text: 8 PIN PLASTIC SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition. ITEM


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    P8GM-50-300B-4 PDF

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    Abstract: No abstract text available
    Text: 8-PIN PLASTIC SOP 7.62 mm (300 8 5 detail of lead end P 1 4 A H F I G J S L B C D M N S K M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 6.44 +0.21 −0.1 B 1.42 MAX.


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    P8GM-50-300B-6 PDF

    S8GM-50-225B-6

    Abstract: No abstract text available
    Text: 8-PIN PLASTIC SOP 5.72 mm (225 8 5 detail of lead end P 4 1 A H F I G J S B C D M L N K S M E NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX.


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    S8GM-50-225B-6 S8GM-50-225B-6 PDF

    Untitled

    Abstract: No abstract text available
    Text: 8 PIN PLASTIC SOP 225 mil 8 5 detail of lead end P 4 1 A H F I G J S B C E D M L N K M NOTE Each lead centerline is located within 0.12 mm of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS A 5.2 +0.17 −0.20 B 0.78 MAX. C 1.27 (T.P.)


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    S8GM-50-225B-5 PDF

    P8GM-50-300B-4

    Abstract: No abstract text available
    Text: Mounting Pad Packing Name Magazine PB-98 MM300-04A 8 pin SOP 300 mil 8 5 detail of lead end P 1 4 A H F I G J S C D M N L B S K M E NOTE 1. Controlling dimention millimeter. 2. Each lead centerline is located within 0.12 mm (0.005 inch) of its true position (T.P.) at maximum material condition.


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    PB-98 MM300-04A P8GM-50-300B-4 P8GM-50-300B-4 PDF

    fp-20-1.27-06

    Abstract: 20 pin zif socket 20 pin zif connector PA-SOD-2006-16 enplas Sd pcb so package 2006-XX 20sd06 sd06
    Text: PA-SOD-2006-xx Data Sheet 8-20 pin SO socket/20 pin SO receptacle SO-Plugs NOT included Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 4.9mm - 5.4mm and lead pitch of 1.27mm can be


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    PA-SOD-2006-xx socket/20 PA-SOF-D250-xx PA-SOF-D310-xx OD2006 fp-20-1.27-06 20 pin zif socket 20 pin zif connector PA-SOD-2006-16 enplas Sd pcb so package 2006-XX 20sd06 sd06 PDF

    28 pin zif socket 1.27mm pitch

    Abstract: 2808 transistor transistor 2808 SOd28 D420 enplas Sd pcb FP-28-1 PA-SOD-2808-18 Enplas to
    Text: PA-SOD-2808-xx Data Sheet 8-28 pin SO socket/28 pin SO receptacle SO-Plugs NOT included Supported Device/Footprints Adapter Construction Using this adapter, various pin count SO packages with a body width of 7.4mm - 7.9mm and lead pitch of 1.27mm can be


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    PA-SOD-2808-xx socket/28 PA-SOF-D420-xx PA-SOF-D470-xx OD2808 28 pin zif socket 1.27mm pitch 2808 transistor transistor 2808 SOd28 D420 enplas Sd pcb FP-28-1 PA-SOD-2808-18 Enplas to PDF

    PIC1670

    Abstract: vending machine pic microcontroller PIN CONFIGURATION OF PIC1670 PIC1665
    Text: MICROCHIP TECHNOLOGY INC 22E D t.lG3501 OOQMTlfl 5 • -0 & M ic r o c h ip 8 Bit Microcontroller FEATURES PIN CONFIGURATION 40 Lead Dual In Line 1024 x 13-bit Program ROM 64 x 8-bit RAM 16 special purpose registers Arithmetic Logic Unit Sophisticated interrupt structure


    OCR Scan
    lG3501 PIC1670 13-bit DS30003B-11 PIC1670 DS30003B-12 vending machine pic microcontroller PIN CONFIGURATION OF PIC1670 PIC1665 PDF