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    Untitled

    Abstract: No abstract text available
    Text: •PCB LAYOUT SPECIFICATION MATERIAL Insulator: PA9T, rated UL94V-0 Contacts: PhosPhor Bronze Boardlock: Copper alloy CONTACT PLATING Underplate: 50m Nickel Contact area: 15m” Selective Gold Solder tails area: 100m Tin/Lead ELECTRICAL Current rating: 1 Amps max.


    OCR Scan     		PDF UL94V-0 4077g 500VAC-250VAC 25TXC 85TXC SDC-W24Y-09

    Cmd 2026

    Abstract: No abstract text available
    Text: 10 I SPECIFICATION MATERIAL Insulator: PA9T,Rated U L 9 4 V -0 Contacts: Phosphor Bronze Shell: Copper Alloy CONTACT PLATING Underplate: 50rn Nickel Contact Area: 15m Selective Gold Solder Tails Area: 100m Tin/Lead ELECTRICAL Operation Voltage: 3.3 Current Rating: 0.5 Am ps Max.


    OCR Scan     		PDF 25TXC 85TXC 09A-AAA0 Cmd 2026

    Untitled

    Abstract: No abstract text available
    Text: I SPECIFICATION MATERIAL Insulator: Liquid Crystal Polymer, rated UL94V— 0 Contacts: PhosPhor Bronze Boardlock: Copper alloy CONTACT PLATING Underplate: 50m Nickel Contact area: 15m” Selective gold Solder tails area: 100m” Tin/Lead ELECTRICAL Current rating: 1 Amps max.


    OCR Scan     		PDF UL94Vâ 25TXC 85TXC 104C-T 104C-TAAO 104C-TAA0