Untitled
Abstract: No abstract text available
Text: •PCB LAYOUT SPECIFICATION MATERIAL Insulator: PA9T, rated UL94V-0 Contacts: PhosPhor Bronze Boardlock: Copper alloy CONTACT PLATING Underplate: 50m Nickel Contact area: 15m” Selective Gold Solder tails area: 100m Tin/Lead ELECTRICAL Current rating: 1 Amps max.
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UL94V-0
4077g
500VAC-250VAC
25TXC
85TXC
SDC-W24Y-09
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Cmd 2026
Abstract: No abstract text available
Text: 10 I SPECIFICATION MATERIAL Insulator: PA9T,Rated U L 9 4 V -0 Contacts: Phosphor Bronze Shell: Copper Alloy CONTACT PLATING Underplate: 50rn Nickel Contact Area: 15m Selective Gold Solder Tails Area: 100m Tin/Lead ELECTRICAL Operation Voltage: 3.3 Current Rating: 0.5 Am ps Max.
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25TXC
85TXC
09A-AAA0
Cmd 2026
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Untitled
Abstract: No abstract text available
Text: I SPECIFICATION MATERIAL Insulator: Liquid Crystal Polymer, rated UL94V— 0 Contacts: PhosPhor Bronze Boardlock: Copper alloy CONTACT PLATING Underplate: 50m Nickel Contact area: 15m” Selective gold Solder tails area: 100m” Tin/Lead ELECTRICAL Current rating: 1 Amps max.
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OCR Scan
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PDF
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UL94Vâ
25TXC
85TXC
104C-T
104C-TAAO
104C-TAA0
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