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    GSI Technology GS881E18AD-166

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    881E18A Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    881E18A GIGA Synchronous Burst SRAMs, 8Meg, 512K x 18,2.5 V and 3.3 V Original PDF
    881E18AD GIGA Synchronous Burst SRAMs, 8Meg, 512K x 18,2.5 V and 3.3 V Original PDF

    881E18A Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: Preliminary GS881E18/36AT-250/225/200/166/150/133 512K x 18, 256K x 36 8Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • On-chip read parity checking; even or odd selectable • 2.5 V or 3.3 V +10%/–5% core power supply


    Original
    PDF GS881E18/36AT-250/225/200/166/150/133 100-Pin GS881E18/36AT-250/225/200/166/150/133 881E18A

    GS881E18AD-133

    Abstract: GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
    Text: Revision: 9/26/02 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only


    Original
    PDF GS881E18/32/36AD GS881E18/36AT 165-bump BGA--x18 881E18A GS881E18AD-133 GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250

    GS881E18A

    Abstract: GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
    Text: Revision: 4/26/02 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only


    Original
    PDF GS881E18/32/36AD GS881E18/36AT 165-bump 165-BGA BGA--x18 GS881E18/36AT-250/225/200/166/150/133 881E18A GS881E18A GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250

    GS881E18A

    Abstract: GS881E18AT-250 GS881E36A A1792
    Text: Preliminary GS881E18/36AT-250/225/200/166/150/133 512K x 18, 256K x 36 9Mb Sync Burst SRAMs 100-Pin TQFP Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan


    Original
    PDF GS881E18/36AT-250/225/200/166/150/133 100-Pin 100-lead 881E18A GS881E18A GS881E18AT-250 GS881E36A A1792

    GS881E18AD-133

    Abstract: GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250
    Text: Revision: 2/3/05 GS881E18/32/36AD Supplemental Datasheet Information This supplemental information applies to the GS881E18/36AT datasheet, which you will find attached to this document. This supplement includes a new package offering the 165-bump BGA—Package D , as well as an additional organization (x32, which is only


    Original
    PDF GS881E18/32/36AD GS881E18/36AT 165-bump BGA--x18 881E18A GS881E18AD-133 GS881E18AD-150 GS881E18AD-166 GS881E18AD-200 GS881E18AD-225 GS881E18AD-250

    Untitled

    Abstract: No abstract text available
    Text: GS881E18 T/D /GS881E32A(D)/GS881E36A(T/D) 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • Dual Dycle Deselect (DCD) operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply


    Original
    PDF GS881E18 /GS881E32A /GS881E36A 100-Pin 165-Bump 881E18A

    Untitled

    Abstract: No abstract text available
    Text: GS881E18/36AT-250/225/200/166/150/133 100-Pin TQFP Commercial Temp Industrial Temp 512K x 18, 256K x 36 9Mb Synchronous Burst SRAMs Features • Dual Dycle Deselect DCD operation • IEEE 1149.1 JTAG-compatible Boundary Scan • 2.5 V or 3.3 V +10%/–10% core power supply


    Original
    PDF GS881E18/36AT-250/225/200/166/150/133 100-Pin 881E18A