CT3725ALNF
Abstract: 1010715 MIL-STD-454
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE, LEAD FREE ASSEMBLY DWG: 1102074 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3
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CT3725ALNF
MIL-STD-454,
824W154.
755W002.
09-E0887
CT3725ALNF
1010715
MIL-STD-454
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MIL-STD-454
Abstract: CT3725
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725 DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101214 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX. 1.1.4
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CT3725
MIL-STD-454,
824W154.
755W002.
08-E0341
MIL-STD-454
CT3725
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CT3725TALN
Abstract: 1010125
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725TALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 2900124 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.20:1 MAX.
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CT3725TALN
MIL-STD-454,
824W154.
755W002.
08-E0869
CT3725TALN
1010125
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Untitled
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725TALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 2900124 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.20:1 MAX.
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CT3725TALN
MIL-STD-454,
IP-1014.
MC0023.
04-E086
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Untitled
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725F DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA, LEAD FREE PLATING ASSEMBLY DWG: 1102084 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3
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CT3725F
MIL-STD-454,
IP-1014.
MC0023.
04-E285
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CT3725S
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725S DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101844 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX.
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CT3725S
MIL-STD-454,
IP-1014.
MC0023.
04-E158
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Untitled
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725 DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101214 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX. 1.1.4
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CT3725
MIL-STD-454,
IP-1014.
MC0023.
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Untitled
Abstract: No abstract text available
Text: CT3725AB5C-03 AlN Chip Termination 150 Watts CW Power: 50 W ± 5% Resistance: 1.25 :1 VSWR: Frequency Range: DC to 3.5 GHz RoHS Compliant Substrate: AlN a Typical Performance VSWR 1.6 1.5 VSWR 1.4 1.3 1.2 1.1 1 0.0 500 1000 1500 2000 2500 3000 3500 Frequency ( MHz)
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CT3725AB5C-03
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Untitled
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101514 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX.
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CT3725ALN
MIL-STD-454,
IP-1014.
MC0023.
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Untitled
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101514 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX.
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CT3725ALN
MIL-STD-454,
IP-1014.
MC0023.
05-E0146
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Untitled
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALNF DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE, LEAD FREE ASSEMBLY DWG: 1102074 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3
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CT3725ALNF
MIL-STD-454,
IP-1014.
MC0023.
05-E0498
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Untitled
Abstract: No abstract text available
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725F DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA, LEAD FREE PLATING. ASSEMBLY DWG: 1101854 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3
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CT3725F
MIL-STD-454,
IP-1014.
MC0023.
04-E158
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CT3725S
Abstract: 1010375
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725S DESCRIPTION: HIGH POWER CHIP TERMINATION, BERYLLIA ASSEMBLY DWG: 1101844 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX. 1.1.4
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CT3725S
MIL-STD-454,
824W154.
755W002.
08-E0534
1010375
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CT3725ALN
Abstract: 1008815 MIL-STD-454 755w002
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: CT3725ALN DESCRIPTION: HIGH POWER CHIP TERMINATION, ALUMINUM NITRIDE ASSEMBLY DWG: 1101514 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50Ω NOMINAL. 1.1.2 FREQUENCY: DC - 2 GHZ. 1.1.3 VSWR: 1.25:1 MAX.
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CT3725ALN
MIL-STD-454,
824W154.
755W002.
09-E0887
CT3725ALN
1008815
MIL-STD-454
755w002
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TF800BB14-061
Abstract: P1999 8051 microwave oven ec 9410 cf K 2676 9343-11R1 TF800BA14-061 2320-1SL 9816SL 9410-3SL-1
Text: < ] ^ _dZkijho$@e^Wdied^Wibed]X[[dh[Ye]d_p[ZWiW $ J^[jhWZ_j_edYedj_dk[i°
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JK-943L
9343-11R1
9343-12R1
9343-13R1
9343-14R1
9343-16R1
9343-18R1
JK-943H
TF800BB14-061
P1999
8051 microwave oven
ec 9410 cf
K 2676
9343-11R1
TF800BA14-061
2320-1SL
9816SL
9410-3SL-1
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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MTVA0300N07
Abstract: MTVA0300
Text: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-Flex Lab-Flex® S Lab-Flex® AF Semi-Rigid, Conformable & Flexible Semi-Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV
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trm a55
Abstract: No abstract text available
Text: EMC Technology RF & MICROWAVE CABLE ASSEMBLIES & COAXIAL COMPONENTS CATALOG ASR Lab-Flex Lab-Flex® S Lab-Flex® AF Semi-Rigid, Conformable & Flexible Semi-Rigid Low Loss RG Series Test Cable Assemblies DQG&RD[LDO3DVVLYH&RPSRQHQWV
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Untitled
Abstract: No abstract text available
Text: MI DRG. NO. NOTES: POWER DERATING 1 2) 3) 4) CT3725AB5C-33A CT3725AB5C—33 RoHS COMPLIANT EPOXY PROTECTIVE COAT Ag OVERCOAT PLATED THICK FILM RESISTIVE ELEMENT CHIP TERMINATION, HIGH POWER ALN SPECIFICATIONS 50 75 100 125 15 FLANGE TEMPERATURE \ .094 ±.020
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CT3725AB5C-33A
CT3725AB5C-33
DC-2000
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SC0066M
Abstract: SC0052M SC0051M
Text: fTTS Teclmohgif Chips - High R eliability Term inations EMC Technology also offers the SC series chip termination with BeO Beryllium Oxide substrates fo r applications with critical reliability requirements. G eneral S pecifications Resistance Values . . . . 50 and 100 Ohms Standard
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SC0066M*
SC0067M*
SC0065M*
SC0051M*
SC0054M*
SC0055M*
SC0057M*
SC0059M*
SC0056M*
SC0062M*
SC0066M
SC0052M
SC0051M
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CT3523
Abstract: No abstract text available
Text: H I G H P O W E R C H I P T E R M I N A T I O N S EMC's high power chip terminations are optimized for RF performance. Since most types are printed to value, the variability of capacitive reactance and localized hot spots associated with trimming are eliminated. Reduced lot variation
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SMT3737
SMT3725
SMT2525
SMT2010
CT3523
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Untitled
Abstract: No abstract text available
Text: TERMINATIONS AND RESISTORS The EMC Difference: ^ EMC'S high power chip terminations are optimized for RF performance. All EMC chips are designed to minimize the variability of capacitive reactance and localized hot spots associated with trimming are eliminated.
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CT3737
CT3725
CT2335
CT2525
CT2010
CT1005
T0505
CT1206
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Untitled
Abstract: No abstract text available
Text: ^ EMC'S high power chip terminations are optimized for RF performance. All EMC chips are designed to minimize the variability o f capacitive reactance and localized hot spots associated w ith trimming are eliminated. Reduced lot vanation means your circuit performs so consistently that in most cases no tuning is required.
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CT2010
CT1005
CT0505
CT1206
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ina 124
Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Text: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz
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42TVA
R0300
HR0500
TS0300
TS0300W
TS0400
TS0500
TS0500W1
TS0500W
TS0500WB1
ina 124
CT2525ALN
"beryllium oxide"
ct2335
SMT3725ALN
SC0066M
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