FBGA16
Abstract: 393 NEC
Text: TRAY CONTAINER UNIT : mm 6x16=96 135°C MAX. 19.20 16.30 7 NEC 107.0 21.40 FBGA16×16ESP A' 14.45 16.30 13.50 288.0 315.0 322.6 Section A – A' 16.30 (5.62) (6.09) 16.00 7.62 135.9 PPE A Applied Package Quantity (pcs) Tray FBGA16×16ESP 224-pin Plastic FBGA (16×16)
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FBGA16
16ESP
224-pin
240-pin
241-pin
303-pin
393-pin
697-pin
393 NEC
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FBGA16
Abstract: JEDEC TRAY DIMENSIONS
Text: UNIT : mm 6x15=90 JAPAN 97.5 135°C MAX. 19.50 FBGA16×16×1.26 19.20 16.5 21.00 19.50 273.0 315.0 322.6 SECTION A – A' 16.50 6.62 7.62 (6.35) 135.9 NEC 16.5 Applied Package 224-pin Plastic FBGA ( 16) Quantity (pcs) MAX. 90 Tray Material Heat Proof Temp.
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FBGA16
224-pin
JEDEC TRAY DIMENSIONS
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H26M* hynix
Abstract: Hynix eMMC 4.5 controller hynix emmc H26M3100 FBGA153 H26M4 FBGA169 H26M31001FPR Hynix eMMC 5.1 controller h26m5
Text: 26nm 32Gb based e-NAND product Family This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Apr. 2011 1 Document Title
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150ms)
512KB
220ms
247ms
262ms
H26M* hynix
Hynix eMMC 4.5 controller
hynix emmc
H26M3100
FBGA153
H26M4
FBGA169
H26M31001FPR
Hynix eMMC 5.1 controller
h26m5
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65A2
Abstract: No abstract text available
Text: P—FBGA160—1515—0.65A2 Uniti nn Nov.2006
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P-FBGA160-1515-0
65A2
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35RAPC
Abstract: Sandisk emmc FBGA169 ADSP-BF518
Text: ADSP-BF518F EZ-Board Evaluation System Manual TM Revision 1.1, June 2009 Part Number 82-000217-01 Analog Devices, Inc. One Technology Way Norwood, Mass. 02062-9106 Copyright Information 2009 Analog Devices, Inc., ALL RIGHTS RESERVED. This document may not be reproduced in any form without prior, express written
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ADSP-BF518F
35RAPC
Sandisk emmc
FBGA169
ADSP-BF518
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1f1-1717-a19
Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Text: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O
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60WMBG
60M/54WBGA-8
10X15
10-8X12-A
LA69-00635A
48TBGA
48-TBGA-10
0-8X16-O
LA69-00267A
ADS11981
1f1-1717-a19
153FBGA
BGA 6x6 tray
FBGA tray kostat
tray bga 6x6
169fbga-12.0x16.0-8x16-0
78BOC-11
78BOC
ePAK BGA 5x5 tray
153FBGA-9
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1 gb micro sd card
Abstract: THNS512GG8BB FBGA153 SDXC THNS128GG4BB sata ssd controller msata THNSNB062GMSJ FBGA169 THNSNB062GMCJ
Text: 製品カタログ 2010-3 東芝半導体 製品カタログ メモリ・ストレージデバイス h t t p : / / w w w. s e m i c o n . t o s h i b a . c o . j p / メモリ・ストレージデバイス メモリ・ストレージデバイス 東芝は1984年にフラッシュメモリを世界で初めて開発しその後開発したNAND型フラッシュメモリでは最先端の技術、
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512Mbit4Gbit
BCJ0092A
1 gb micro sd card
THNS512GG8BB
FBGA153
SDXC
THNS128GG4BB
sata ssd controller
msata
THNSNB062GMSJ
FBGA169
THNSNB062GMCJ
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P-FBGA169
Abstract: FBGA169
Text: P—FBGA169—1515—0.80B3 Uniti m Apr.2001
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P-FBGA169-1515-0
P-FBGA169
FBGA169
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eMMC
Abstract: 8GB eMMC SLC emmc controller emmc 4.41 32GB emmc FBGA153 emmc4.41 KE4BT4B6A FBGA169 16GB emmc
Text: KINGSTON.COM e•MMC — the perfect storage solution for mobile applications Overview Kingston’s current e•MMC product follows the JEDEC e•MMC4.41 standard. It is an ideal universal storage solution for many electronic devices, including smartphones, tablet PCs, PDAs, eBook readers, MIDs, digital cameras and recorders, MP3, MP4
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MKF-428
eMMC
8GB eMMC SLC
emmc controller
emmc 4.41
32GB emmc
FBGA153
emmc4.41
KE4BT4B6A
FBGA169
16GB emmc
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hynix emmc
Abstract: h26m31001 Hynix eMMC 4.5 controller JESD84-A441 H26M31001EFR H26M* hynix eMMC 4.51 H26M3100 Manufacturer ID eMMC hynix H26M31
Text: H26M31001EFR This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.3 / Feb. 2011 1 Document Title e-NAND Revision History
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H26M31001EFR
fig13
25Mhz,
52MHz,
64Kbyte
hynix emmc
h26m31001
Hynix eMMC 4.5 controller
JESD84-A441
H26M31001EFR
H26M* hynix
eMMC 4.51
H26M3100
Manufacturer ID eMMC hynix
H26M31
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fbga 12 x 12 thermal resistance
Abstract: FBGA160-P-1212
Text: 1C PACKAGES Pin-inserting Type i Surface-mount Type 1C Pack. TCP Tape Carrier Package CSP (Chip Size Package) Stacked Package COB (Chip On Board) Nowadays, the prominence of higher performance, smaller and lighter electronic equipment is increasing. Accordingly, the role played by the
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developme5x24
fbga 12 x 12 thermal resistance
FBGA160-P-1212
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LGA 1156 PIN OUT diagram
Abstract: QFP11T144-002 LGA 1156 Socket diagram 216-LQFP Wells-CTI 36 lead Flat Pack smd AAAS Wells-CTI LCC socket Wells-CTI 880 020 BGA136 Enplas drawings
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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LGA 1155 Socket PIN diagram
Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Text: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and
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65A2
Abstract: No abstract text available
Text: raSS3SQSÑüiSSFüCS'OGo>ia>ai*u ooooooooooolooooooooo ooooooooooopoooooooq -oo -oo 'S . o o GO bd oo oo oo oo oo o oo p— m Nov.2006 P—FBGA160—1515—0.65A2 a <s¡ EEMH O, 42±0, 04, 1. 3nax. Uniti m
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FBGA160â
7575I
65A2
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HN58C1001FPI-15
Abstract: HN58C1001FPI-15 hitachi M5M5V216ATP-55HI M5M51008DFP-55HI BGA-165 M5M5W817 TSOP 28 SPI memory Package flash BGA165 SRAM 512K*8 BIT SOP32 M5M5256DFP-70LL
Text: Memory Products Reliable specialty, advanced and mainstream commodity memory devices for digital storage applications Renesas, the #3 semiconductor supplier worldwide, offers an extensive range of memory ICs for temporary and permanent digital storage in all kinds
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0603/5K/JPG/BCD/SP
01-1889A
HN58C1001FPI-15
HN58C1001FPI-15 hitachi
M5M5V216ATP-55HI
M5M51008DFP-55HI
BGA-165
M5M5W817
TSOP 28 SPI memory Package flash
BGA165
SRAM 512K*8 BIT SOP32
M5M5256DFP-70LL
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