Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-1 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HTQFP100
OT638-1
OT638-1
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-4 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD
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HTQFP100:
OT638-4
MS-026
sot638-4
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-3 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 wM θ A1 bp pin 1 index Lp L detail X 26 100 1 25 wM bp e
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HTQFP100:
OT638-3
MS-026
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp L pin 1 index detail X 26 100 1 25 w M bp
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HTQFP100:
OT638-1
MS-026
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PDF
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HTQFP100
Abstract: a7551
Text: PDF: 2003 Apr 07 Philips Semiconductors Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index
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HTQFP100:
OT638-1
HTQFP100
a7551
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PDF
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HTQFP100 package SOT638-3 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HTQFP100
OT638-3
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PDF
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philips l 6.1
Abstract: HTQFP100 MS-026 sot638
Text: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-1 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A A2 A3 A1 w M θ bp Lp pin 1 index L detail X
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HTQFP100:
OT638-1
MS-026
philips l 6.1
HTQFP100
MS-026
sot638
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed diepad SOT638-6 c y exposed die pad side X Dh A 75 51 76 50 ZE e Eh E HE A3 A A2 w θ A1 bp Lp L detail X pin 1 index 26 100 1 25 w bp e ZD
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HTQFP100:
OT638-6
sot638-6
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P-HTQFP100-14x14-0
Abstract: HTQFP100
Text: JEITA Package Code P-HTQFP100-14x14-0.50 RENESAS Code PTQP0100KE-A Previous Code 100PFW-A MASS[Typ.] 0.5g HD *1 D 75 51 51 50 76 75 50 76 D2 HE *2 E E1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET.
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P-HTQFP100-14x14-0
PTQP0100KE-A
100PFW-A
000-14x14-0
HTQFP100
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PDF
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HTQFP100
Abstract: MS-026 sot638
Text: Package outline Philips Semiconductors HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A3 A A2 w M θ bp pin 1 index A1 Lp L detail X
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HTQFP100:
OT638-2
MS-026
HTQFP100
MS-026
sot638
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PDF
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Untitled
Abstract: No abstract text available
Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HTQFP100 package SOT638-2 Hx Gx P2 0.125 P1 SPx nSPx Hy SLy Gy SPy tot SPy By Ay nSPy SPx tot SLx C D2 (8x) D1 Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout
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HTQFP100
OT638-2
OT638-2
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PDF
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Untitled
Abstract: No abstract text available
Text: Package outline HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads; body 14 x 14 x 1 mm; exposed die pad SOT638-2 c y exposed die pad side X Dh A 75 51 76 50 ZE e E HE Eh A3 A A2 w M θ bp pin 1 index A1 Lp L detail X 26 100 1 25 w M bp
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HTQFP100:
OT638-2
MS-026
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PDF
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Untitled
Abstract: No abstract text available
Text: HTQFP100V LSI Assembly • HTQFP100V 51 50 100 26 0.1 ± 0.05 0.8 ± 0.05 1.0Max. 1.0 1 25 1PIN MARK 0.5 ± 0.1 1.0 16.0 ±0.2 14.0 ±0.1 76 0.5 ± 0.15 1.0 ± 0.2 75 16.0 ±0.2 14.0 ±0.1 0.145 +0.05 −0.03 0.08 S 0.2 +0.05 −0.04 0.08 M Units : mm The contents described herein are subject to change without notice.
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HTQFP100V
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HTQFP100
Abstract: No abstract text available
Text: PDF: 2001 Mar 30 Philips Semiconductors Package outline HTQFP100: plastic, heatsink thin quad flat package; 100 leads; body 14 x 14 x 1.0 mm SOT638-1 c y heatsink side X Dh A 75 51 76 50 ZE e E HE Eh A2 A A3 A1 w M θ bp Lp pin 1 index L detail X 26 100
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HTQFP100:
OT638-1
HTQFP100
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PDF
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TRF3761-H
Abstract: No abstract text available
Text: User's Guide SLWU029D – October 2006 – Revised August 2007 TSW3003 Demonstration Kit 1 2 3 4 5 6 7 8 9 10 11 Contents Demonstration Kit Configuration Options . 3 Block Diagrams . 4
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SLWU029D
TSW3003
TRF3761-H
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automotive radar schematic diagram
Abstract: No abstract text available
Text: ADS5400 www.ti.com SLAS611 – OCTOBER 2009 12-Bit, 1-GSPS Analog-to-Digital Converter Check for Samples :ADS5400 FEATURES • • • • 1 • • 1-GSPS Sample Rate 12-Bit Resolution 2.1 GHz Input Bandwidth SFDR = 66 dBc at 1.2 GHz SNR = 57.6 dBFS at 1.2 GHz
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ADS5400
SLAS611
12-Bit,
12-Bit
10-VPP
100-Pin
16-mm
16-mm
automotive radar schematic diagram
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PDF
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MS-026
Abstract: DAC1205D650 HTQFP100
Text: DAC1405D650 Dual 14-bit DAC, up to 650 Msps; 2x, 4× and 8× interpolating Rev. 3 — 10 September 2010 Product data sheet 1. General description The DAC1405D650 is a high-speed 14-bit dual channel Digital-to-Analog Converter DAC with selectable 2×, 4× or 8× interpolating filters optimized for multi-carrier wireless
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DAC1405D650
14-bit
DAC1405D650
32-bit
16-bit
MS-026
DAC1205D650
HTQFP100
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PDF
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DAC1205D650
Abstract: HTQFP100 MS-026
Text: DAC1205D650 Dual 12-bit DAC, up to 650 Msps; 2x 4× and 8× interpolating Rev. 01 — 28 July 2009 Product data sheet 1. General description The DAC1205D650 is a high-speed 12-bit dual-channel Digital-to-Analog Converter DAC with selectable 2×, 4× or 8× interpolating filters optimized for multi-carrier wireless
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DAC1205D650
12-bit
DAC1205D650
32-bit
16-bit
HTQFP100
MS-026
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PDF
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ADS5400
Abstract: DA5P DB11P ADS5400IPZP ADS5400IPZPR TQFP-100 Interleaving DA7p
Text: ADS5400 www.ti.com SLAS611 – OCTOBER 2009 12-Bit, 1-GSPS Analog-to-Digital Converter Check for Samples :ADS5400 FEATURES • • • • 1 • • 1-GSPS Sample Rate 12-Bit Resolution 2.1 GHz Input Bandwidth SFDR = 66 dBc at 1.2 GHz SNR = 57.6 dBFS at 1.2 GHz
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ADS5400
SLAS611
12-Bit,
12-Bit
10-VPP
100-Pin
16-mm
16-mm
ADS5400
DA5P
DB11P
ADS5400IPZP
ADS5400IPZPR
TQFP-100
Interleaving
DA7p
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PDF
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Untitled
Abstract: No abstract text available
Text: ADS5400 www.ti.com SLAS611B – OCT 2009 – REVISED MARCH 2010 12-Bit, 1-GSPS Analog-to-Digital Converter Check for Samples: ADS5400 FEATURES • • 1 • • • • • • • 23 • • • 1-GSPS Sample Rate 12-Bit Resolution 2.1 GHz Input Bandwidth
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ADS5400
SLAS611B
12-Bit,
12-Bit
100-Pin
16-mm
16-mm
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PDF
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Untitled
Abstract: No abstract text available
Text: DAC1405D750 Dual 14-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 5 — 31 January 2012 Product data sheet 1. General description The DAC1405D750 is a high-speed 14-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1405D750
14-bit
DAC1405D750
32-bit
16-bit
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Untitled
Abstract: No abstract text available
Text: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 4 — 31 January 2012 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1005D750
10-bit
DAC1005D750
32-bit
16-bit
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dac1405d750
Abstract: No abstract text available
Text: DAC1405D750 Dual 14-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 5 — 31 January 2012 Product data sheet 1. General description The DAC1405D750 is a high-speed 14-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1405D750
14-bit
DAC1405D750
32-bit
16-bit
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Untitled
Abstract: No abstract text available
Text: DAC1005D750 Dual 10-bit DAC, up to 750 Msps; 4x and 8x interpolating Rev. 05 — 2 July 2012 Product data sheet 1. General description The DAC1005D750 is a high-speed 10-bit dual channel Digital-to-Analog Converter DAC with selectable 4 or 8 interpolating filters optimized for multi-carrier wireless
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DAC1005D750
10-bit
DAC1005D750
32-bit
16-bit
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PDF
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