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    Infineon Technologies AG

    Infineon Technologies AG IGC03R60DEX1SA2

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: IGC03R60DEX1SA2)
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    IGC03R60D Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: IGC03R60D TRENCHSTOPTM RC-Series for hard switching applications IGBT chip with monolithically integrated diode in packages offering space saving advantage Features: TRENCHSTOPTM Reverse Conducting RC technology for 600V applications offering: • Optimised VCEsat and VF for low conduction losses


    Original     		IGC03R60D 20kHz PDF

    Untitled

    Abstract: No abstract text available
    Text: IGC03R60D TRENCHSTOPTM RC-Series for hard switching applications IGBT chip with monolithically integrated diode in packages offering space saving advantage Features: TRENCHSTOPTM Reverse Conducting RC technology for 600V applications offering: • Optimised VCEsat and VF for low conduction losses


    Original     		IGC03R60D 20kHz PDF

    IGC03R60DE

    Abstract: No abstract text available
    Text: IGC03R60DE TRENCHSTOPTM RC-Series for hard switching applications IGBT chip with monolithically integrated diode in packages offering space saving advantage Features: TM TRENCHSTOP Reverse Conducting RC technology for 600V applications offering: • Optimised VCEsat and VF for low conduction losses


    Original     		IGC03R60DE 20kHz L7381B, IGC03R60DE PDF