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    IGP-28111-* Search Results

    IGP-28111-* Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54112-811102500LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    54122-811102000LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch Visit Amphenol Communications Solutions
    10114828-11111LF Amphenol Communications Solutions 1.25mm Wire to Board Wafer,Vertical, Surface Mount, 11 Positions Visit Amphenol Communications Solutions
    54122-811162000LF Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch Visit Amphenol Communications Solutions
    CED014281111001 Amphenol Communications Solutions Double Density Cool Edge,storage and server connectors,SMT,428 signal pins, 0.8 mm,Vertical,1.6mm AIC Visit Amphenol Communications Solutions

    IGP-28111-* Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    IGP-28111J Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF
    IGP-28111J-07 Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF
    IGP-28111J-08 Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF
    IGP-28111J-09 Bookham Technology SFP Optical Transceivers for 2.7Gb/s 180km DWDM Applications Original PDF