|
68464-164HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch. |
|
|
|
131-6416-21H
|
|
Amphenol Communications Solutions
|
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP. |
|
|
|
68464-168HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch. |
|
|
|
87606-416LF
|
|
Amphenol Communications Solutions
|
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 32 Positions, 2.54mm (0.100in) Pitch |
|
|
|
68464-160HLF
|
|
Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch. |
|
|
