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    GTO MODULE

    Abstract: ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8
    Text: PRELIMINARY RMPA1766 i-Lo tm WCDMA Band IV Power Amplifier Module Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA1766 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA


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    PDF RMPA1766 28dBm 16dBm) 16dBm GTO MODULE ECJ-1VB1H102K SN63 SN96 Solder Paste, Indium 5.8