TFBGA256 Search Results

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Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9	Original	PDF	TFBGA256: OT999-1 MO-195
Untitled Abstract: No abstract text available Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V e U T R P N M K L F D B e2 J H 1/2 e G E C A ball A1	Original	PDF	TFBGA256: OT754-1 MO-216
Untitled Abstract: No abstract text available Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm SOT829-1 B D A ball A1 index area A E A2 A1 detail X C e1 1/2 e e Y V T P M K H F D B ball A1 index area y y1 C ∅v M C A B b ∅w M C W e U R N L	Original	PDF	TFBGA256: OT829-1 MO-195
Untitled Abstract: No abstract text available Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT999-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	TFBGA256 OT999-1 OT999-1
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of TFBGA256 package SOT754-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	TFBGA256 OT754-1 OT754-1
TFBGA256 Abstract: MO-195 sot829 TfBGA-256 Text: PDF: 2003 Oct 01 Philips Semiconductors Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 11 x 11 x 0.8 mm SOT829-1 B D A ball A1 index area A E A2 A1 detail X C e1 e Y V T P M K H F D B ball A1 index area 1/2 e ∅v M	Original	PDF	TFBGA256: OT829-1 MO-195 TFBGA256 MO-195 sot829 TfBGA-256
TFBGA256 Abstract: TfBGA-256 MO-216 sot754 Text: PDF: 2002 Jan 14 Philips Semiconductors Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls; body 15 x 15 x 0.8 mm B D SOT754-1 A ball A1 index area A E A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V e U T R P	Original	PDF	TFBGA256: OT754-1 MO-216 TFBGA256 TfBGA-256 MO-216 sot754
AL9V576 Abstract: AL9V576B-LF-PBF microcontroller 8051 application audio sampling c AL9V576B-LF BF256 al9v576b ISO13818-1 ycbcr 8bit AD Mux TfBGA-256 AL9V576B-BF-PBF Text: AL9V576 MPEG-4/2/1 A/V Encoder Datasheets Version 1.0 2004~2006 by AverLogic Technologies, Corp. INFORMATION FURNISHED BY AVERLOGIC IS BELIEVED TO BE ACCURATE AND RELIABLE. HOWEVER, NO RESPONSIBILITY IS ASSUMED BY AVERLOGIC FOR ITS USE, NOR FOR ANY INFRINGEMENTS OF PATENTS OR OTHER RIGHTS OF THIRD	Original	PDF	AL9V576 1-D-PMK176-0001 AL9V576 AL9V576B-LF-PBF microcontroller 8051 application audio sampling c AL9V576B-LF BF256 al9v576b ISO13818-1 ycbcr 8bit AD Mux TfBGA-256 AL9V576B-BF-PBF