ABLEBOND 8361 Search Results
ABLEBOND 8361 Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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10091836-10J-20DLF |
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XCede® High Speed Backplane Connectors, 4 wall header. | |||
68683-619LF |
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Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Through Mount, Top Entry, Double Row, 38Position ,2.54mm (0.100in) Pitch.. | |||
54121-408361750LF |
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. | |||
54121-808361300LF |
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BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. | |||
10130787-083618BLF |
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HPCE STD VT Receptacle 44P18S |
ABLEBOND 8361 Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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Ablebond
Abstract: ABLEBONd 84-1 Ablebond 8361J DS83520 8361J 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130
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B70302 8361J DS1212 DS2012 DS1284 DS2130 DS1285 DS2141 DS2009 DS2143 Ablebond ABLEBONd 84-1 Ablebond 8361J DS83520 84-1 LMIs DS1684 DS80320 Dallas DS1212 DS2130 | |
Untitled
Abstract: No abstract text available
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DS80C310, JESD78, | |
sumitomo G700
Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
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C18045
Abstract: CDA151 9918 9936
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DS80C390, Reliab918 30C/60% C18045 CDA151 9918 9936 | |
capacitor vehicle mttf
Abstract: J-STD-020 S9730 ablebond 293 Nitto
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DS2153, MIL-STD-883-2004 capacitor vehicle mttf J-STD-020 S9730 ablebond 293 Nitto | |
SUMITOMO g700l
Abstract: C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L
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14x14x1 SUMITOMO g700l C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L | |
sumitomo 6600
Abstract: on semiconductor traceability marking soic dALLAS MARKING CODE ablestik ablebond On semiconductor SOIC Traceability DS12885 DS1585 ablebond ablestik dallas date code DALLAS SOIC PRODUCT CHANGE
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A82301 DS12885, DS1585, DS12885 DS1585 8361J DS1585 9814A2" sumitomo 6600 on semiconductor traceability marking soic dALLAS MARKING CODE ablestik ablebond On semiconductor SOIC Traceability ablebond ablestik dallas date code DALLAS SOIC PRODUCT CHANGE | |
9910
Abstract: No abstract text available
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DS1384 9910 | |
s9851
Abstract: No abstract text available
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Original |
DS87C550, s9851 | |
tsmc design rule
Abstract: 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model
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CY2077 133MHz CY2077SC/CY2077ZC CY2280-OC 85C/85 tsmc design rule 1120008 tsmc tsmc cmos MIL-STD-883C method 2011 tsmc Activation Energy tsmc cmos model | |
CY2304
Abstract: CY2308
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CY2305/CY2309 10-MHz 100/133-MHZ CY2304/CY2308 133-MHZ CY2304 /CY2305 /CY2308 /CY2309* CY2308 | |
CEL9200
Abstract: CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy
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CY7C1021V CY7C1019V CY7C1021V/CY7C1019V 7C1321D/7C1319D) 44-pin CY7C1021) 32-pin CY7C1019) CEL9200 CY7C1019 CY7C1021 CY7C1021V sumitomo silver epoxy | |
IDT82V1671AJ
Abstract: EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b
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21-Mar-2006 19-Jun-2006 IDTCV169NLG IDTCV170PAG IDTCV171NLG IDTCV174PAG IDTCV175PAG IDTNW1506AL IDTQS3VH16210PA IDTQS3VH16210PAG IDT82V1671AJ EME-G700 G700LX EME-G770 Ablebond 8361 JESD22-B116 IDT7025S35JI ablestik 8390 CRM1076 JESD22-B100-b |