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TLP2762B
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Toshiba Electronic Devices & Storage Corporation
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Photocoupler (photo-IC output), 10 Mbps, 5000 Vrms, SO6L |
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71276-210HLF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch. |
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91276-236HLF
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Amphenol Communications Solutions
|
BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch. |
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77313-127-62LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 62 Positions |
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86092327624765E1LF
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Amphenol Communications Solutions
|
DIN Straight Header Solder-to-Board Style R 32 ways, Class I |
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