PAM2401
Abstract: No abstract text available
Text: PAM2401 Application Note CONFIDENTIAL INFORMATION PAM2401 Application Note AE Department 1. Revision Information Date Revision Description 2014/04 V1.0 Initial release Comment DO NOT DISTRIBUTE OR REPRODUCE WITHOUT PERMISSION FROM P.A.M Pow er Analog Microelectronics, Inc.
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PAM2401
PAM2401
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mtg226pa
Abstract: A213SYZQ TT11 TTE41NGWW2T 94v0 c29 MTF206N TT11EGRA7T1/4 A203SYCQ a107m Tyco Electronics toggle
Text: Toggle Switches C Toggle Switches TST Series - Page C5 TT Series - Page C8 ATE Series - Page C19 A Series - Page C22 AE Series - Page C35 MT Series - Page C43 C1 Catalog 1308390 Issued 9-04 www.tycoelectronics.com Dimensions are in inches and millimeters unless otherwise
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A101K1V30B
mtg226pa
A213SYZQ
TT11
TTE41NGWW2T
94v0 c29
MTF206N
TT11EGRA7T1/4
A203SYCQ
a107m
Tyco Electronics toggle
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HV7131gp
Abstract: HV7131 HV7131R HV7131RP 110G 131B 131R IMT-2000 high frequency linear cmos IMAGE SENSOR MagnaChip Semiconductor
Text: HV7131RP CMOS Image Sensor with Image Signal Processing HV7131RP MagnaChip Semiconductor Ltd. Version 1.5 2005/ 02 / 04 V1.5 -12005 MagnaChip Semiconductor Ltd. PDF created with FinePrint pdfFactory Pro trial version www.pdffactory.com HV7131RP Revision History
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HV7131RP
2003/10/15/Wed
HV7131RP
2004/01/20/Tue
2004/03/22/Mon
2004/08/16/Mon
2004/10/04/Mon
2005/02/04/Fri
HV7131gp
HV7131
HV7131R
110G
131B
131R
IMT-2000
high frequency linear cmos IMAGE SENSOR
MagnaChip Semiconductor
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PDF
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Untitled
Abstract: No abstract text available
Text: HV7131RP CMOS Image Sensor with Image Signal Processing HV7131RP MagnaChip Semiconductor Ltd. Version 1.4 2004/ 10 / 04 V1.4 -12004 MagnaChip Semiconductor Ltd. HV7131RP Revision History Revision Script Date Comments V1.0 2003/10/15/Wed - HV7131RP Preliminary is released
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HV7131RP
2003/10/15/Wed
HV7131RP
2004/01/20/Tue
2004/03/22/Mon
2004/08/16/Mon
2004/10/04/Mon
10sec
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ADUV
Abstract: gfp 840
Text: Technische Information / technical information FF1400R12IP4 IGBT-Module IGBT-modules IGBT-Wechselrichter / IGBT-inverter Vorläufige Daten / preliminary data Höchstzulässige Werte / maximum rated values ! "# # ! 1 1 9 2 > # , > % "# # $ % % % 2 # ! $ : #
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FF1400R12IP4
ADUV
gfp 840
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3D7428
Abstract: 3D7428-1 3D7428-10 3D7428-15 3D7428-2 3D7428-4 3D7428-5
Text: 3D7428 data 3 delay devices, inc. MONOLITHIC 8-BIT PROGRAMMABLE DELAY LINE SERIES 3D7428 – LOW NOISE FEATURES • • • • • • • • • • • PACKAGES All-silicon, low-power CMOS technology TTL/CMOS compatible inputs and outputs Vapor phase, IR and wave solderable
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3D7428
3D7428
3D7428-1
3D7428-10
3D7428-15
3D7428-2
3D7428-4
3D7428-5
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PDF
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Untitled
Abstract: No abstract text available
Text: A88 5FD8( /.3-+60!9A/<0$?:6C -D6C0@?7:8FC23=60C-0D:K6 BF F ! &010! *0! (# 8/B>01/8/<+>3980:9A/<0=96?>398 %&#$010 !% $0 M0 &BBC8C0EC5065:E:@?02AAC@G65 M0$6DD0E92?0EBBR0=62<28604FCC6?E M0CBO0@AE:@?02G2:=23=6 M0FBBB.0:D@=2E:@? M0-=EC209:890677:4:6?4J70FA0E@01
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8FC23
60C-0D
BC8C0EC5065
02AAC
6DD0E92
28604FCC6
EC209
4J70FA0E
IEC20=
0C-096
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Data Delay Devices
Abstract: programmable delay line pulse width measure counter delay clock 3D3428 3D3428-1 3D3428-10 3D3428-15 3D3428-2 3D3428-4 3D3428-5
Text: 3D3428 data 3 delay devices, inc. MONOLITHIC 8-BIT PROGRAMMABLE DELAY LINE SERIES 3D3428 – LOW NOISE FEATURES • • • • • • • • • • • PACKAGES All-silicon, low-power CMOS technology 3.3V CMOS compatible inputs and outputs Vapor phase, IR and wave solderable
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3D3428
Data Delay Devices
programmable delay line
pulse width measure counter delay clock
3D3428
3D3428-1
3D3428-10
3D3428-15
3D3428-2
3D3428-4
3D3428-5
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SG-BGA-6122
Abstract: 2-56 socket head cap screw
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer
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225mm
dia19/04
SG-BGA-6122
863mm
025mm
725mm
2-56 socket head cap screw
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SG-BGA-6110
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer
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225mm
SG-BGA-6110
863mm
025mm
725mm
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SG-BGA-6106
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 36.225mm Ball guide prevents over compression of elastomer
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225mm
SG-BGA-6106
863mm
025mm
725mm
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SG-BGA-6131
Abstract: No abstract text available
Text: GHz BGA Socket - Direct mount, solderless Features Top View Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 40.225mm Ball guide prevents over compression of elastomer
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225mm
SG-BGA-6131
863mm
025mm
725mm
125mm.
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SG-BGA-6121
Abstract: BGA 31X31 PCB DRAWING
Text: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. Top View High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 45.225mm Ball guide prevents over compression of elastomer
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225mm
3625mm
025mm
725mm
SG-BGA-6121
125mm.
BGA 31X31 PCB DRAWING
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PDF
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SG-BGA-6102
Abstract: AE 04 equivalent
Text: Top View GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 34.325mm Ball guide prevents over compression of elastomer
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325mm
825mm
825mm
025mm
SG-BGA-6102
125mm.
AE 04 equivalent
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MB88347
Abstract: MCX18N00A MCX18N00B MA159A-TX si 1125 hd IC104
Text: MCX18N00A/MCX18N00B Micro Unit CCD For the availability of this product, please contact the sales office. Description The micro unit CCD is a CCD color camera unit with built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens
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MCX18N00A/MCX18N00B
MCX18N00A
MCX18N00B
000-pixel
MB88347
AK6420
50max
MB88347
MCX18N00A
MCX18N00B
MA159A-TX
si 1125 hd
IC104
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SG-BGA-6130
Abstract: socket head cap screw socket dwg
Text: GHz BGA Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 47.725mm Ball guide prevents over compression of elastomer
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725mm
SG-BGA-6130
125mm.
socket head cap screw
socket dwg
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033D14
Abstract: MB88347 MCX18N00A MCX18N00B 2sa812 3C132 matrix CCD sony FUJITSU L101 FL-101 73D18
Text: MCX18N00A/MCX18N00B Micro Unit CCD Description The micro unit CCD is a CCD color camera unit with built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens system. 64 pin QFN Ceramic Features • Ultra-compact size: MCX18N00A
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MCX18N00A/MCX18N00B
MCX18N00A
MCX18N00B
000-pixel
MB88347
AK6420
AVDD64-R
50max
033D14
MB88347
MCX18N00A
MCX18N00B
2sa812
3C132
matrix CCD sony
FUJITSU L101
FL-101
73D18
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si 1225 hd
Abstract: CCD matrix 64DCK 4h ccd MB88347 MCX18LG0A MCX18LG0B si 1125 hd microcontroller ccd image sensor 030MIN
Text: MCX18LG0A/MCX18LG0B Micro Unit CCD Description The micro unit CCD is a CCD color camera unit with a built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens system. Features • Ultra-small size: MCX18LG0A: 18.3mm x 18.3mm × 8.4mm
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MCX18LG0A/MCX18LG0B
MCX18LG0A:
MCX18LG0B:
16-bit
000-pixel
MB88347
AK6420
50max
si 1225 hd
CCD matrix
64DCK
4h ccd
MB88347
MCX18LG0A
MCX18LG0B
si 1125 hd
microcontroller ccd image sensor
030MIN
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PDF
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microcontroller ccd image sensor
Abstract: MB88347 MCX18LG0A MCX18LG0B 033D14 ic co6
Text: MCX18LG0A/MCX18LG0B Micro Unit CCD For the availability of this product, please contact the sales office. Description The micro unit CCD is a CCD color camera unit with a built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens
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MCX18LG0A/MCX18LG0B
MCX18LG0A:
MCX18LG0B:
16-bit
000-pixel
MB88347
AK6420
50max
microcontroller ccd image sensor
MB88347
MCX18LG0A
MCX18LG0B
033D14
ic co6
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AN-347
Abstract: HC55185 IDT821068 IM30 06B7 AN347 FD6505 55 ECF
Text: HC55185 and the IDT821068 Programmable Octal PCM CODEC Application Note AN-347 Author: Don LaFontaine Intersil 5HIHUH HUHQ QF H 'HVL 'HVLJ JQ XVL XVLQ QJ WK WKH H +& +& DQ DQG G WK WKH H ,'7 ,'7 3 3U U RJU JUDP DPPDE PDEOOH 2F WDO 3&0 &2'(&
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HC55185
IDT821068
AN-347
IDT821068
IDT82
AN-347
IM30
06B7
AN347
FD6505
55 ECF
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9947
Abstract: HC55185 IDT821068 IM30 74 act 07 55 ECF
Text: HC55185 and the IDT821068 Programmable Octal PCM CODEC TM Application Note December 2001 AN9947.1 Author: Don LaFontaine Reference Design using the HC55185 and the IDT821068 Programmable Octal PCM CODEC any AC impedance. The formula to program the HC55185 to
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HC55185
IDT821068
AN9947
IDT821068
9947
IM30
74 act 07
55 ECF
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rtc ic 8563
Abstract: 8563 RTC-8563 Ultrasonic cleaner circuit diagram marking JE 6 SOP R8563 finding MQ292-04 RTC-8563SA RTC R8563
Text: MQ292-04 Application Manual Real Time Clock Module RTC-8563 SA/JE In pursuit of "Saving" Technology ,Epson electronic device. Our Lineup of semiconductors, Liquid crystal displays and quartz devices assists in creating the products of our customers' dreams.
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MQ292-04
RTC-8563
that52
rtc ic 8563
8563
Ultrasonic cleaner circuit diagram
marking JE 6 SOP
R8563
finding
MQ292-04
RTC-8563SA
RTC R8563
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PDF
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r8564
Abstract: RTC R8564
Text: MQ322-04 Application Manual Real Time Clock Module RTC-8564JE/NB Model Product Number RTC-8564JE Q41856470000100 RTC-8564NB Q41856490000200 In pursuit of "Saving" Technology ,Epson electronic device. Our Lineup of semiconductors, Liquid crystal displays and quartz devices
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MQ322-04
RTC-8564JE/NB
RTC-8564JE
RTC-8564NB
Q41856470000100
Q41856490000200
r8564
RTC R8564
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sony image sensor
Abstract: No abstract text available
Text: SONY MCX18N00A/MCX18N00B Micro Unit CCD Description The micro unit CCD is a CCD color camera unit with built-in CCD image sensor, drive system IC, sample-and-hold IC, signal processor IC and lens system. Features • Ultra-compact size: MCX18N00A 18.3mm x 18.3mm x 8.4mm
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OCR Scan
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MCX18N00A/MCX18N00B
MCX18N00A
MCX18N00B
000-pixel
CX18N00A/M
CX18N00B
MCX18N00A
64pin
sony image sensor
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