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    ALTERA TOP MARKING Search Results

    ALTERA TOP MARKING Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    5962-8950303GC Rochester Electronics LLC ICM7555M - Dual Marked (ICM7555MTV/883) Visit Rochester Electronics LLC Buy
    54HC221AJ/883C Rochester Electronics LLC 54HC221AJ/883C - Dual marked (5962-8780502EA) Visit Rochester Electronics LLC Buy
    MG8097/B Rochester Electronics LLC 8097 - Math Coprocessor - Dual marked (8506301ZA) Visit Rochester Electronics LLC Buy
    5490/BCA Rochester Electronics LLC 5490 - Decade Counter - Dual marked (M38510/01307BCA) Visit Rochester Electronics LLC Buy
    5405/BCA Rochester Electronics LLC 5405 - Gate - Dual marked (M38510/00108BCA) Visit Rochester Electronics LLC Buy

    ALTERA TOP MARKING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    ADV9707

    Abstract: altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier
    Text: CUSTOMER ADVISORY TOP MARK TRACEABILITY ENHANCEMENTS As Altera adds additional sources of supply and in order for customers to maintain product traceability via device top mark, Altera will enhance its top marking scheme. In order to facilitate die identification, Altera will expand its current six character top mark date code and


    Original     		ADV9707 ADV9707 altera Date Code Formats lot Code Formats altera ALTERA PART MARKING Date Code Formats Date Code Formats Altera altera top marking altera "date code format" Identification Traceability ALTERA die identifier PDF

    ADV0012

    Abstract: ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark
    Text: CUSTOMER ADVISORY BGA PACKAGE TOP MARK ENHANCEMENT Altera will begin marking a one-line internal traceability code on all BGA packages beginning January 2001. The Altera lot number, country of origin, and new internal marking code will be laser marked, or ink marked, on the top of all BGA packages for


    Original     		ADV0012 ADV0012 ALTERA PART MARKING altera top marking altera date code format BGA PACKAGE TOP MARK altera marking "lot Code" altera ALTERA BGA packages PART MARKING altera lot code format topmark PDF

    ADV0201

    Abstract: ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark
    Text: CUSTOMER ADVISORY ADV0201 NON-BGA PACKAGE TOP MARK ENHANCEMENT Change Description: Altera will begin marking the assembly lot number and a one-line internal traceability code on all non-BGA packages beginning March 2002. Reason For Change: The assembly lot number and new internal traceability marking code will be laser or ink


    Original     		ADV0201 ADV0201 ALTERA PART MARKING altera top marking "lot Code" altera altera lot code format altera date code format altera "date code format" trace code altera marking Altera pdip top mark PDF

    EPCS64N

    Abstract: EPCS64 EPCS64 phl programmer EPLD EPCS16
    Text: EPCS64 Configuration Device Errata Sheet March 2005, ver 1.1 Introduction This document provides updated information on 64-Mbit EPCS64 serial configuration devices. These configuration devices can be used to configure Stratix II, Cyclone II, and Cyclone FPGAs.


    Original     		EPCS64 64-Mbit EPCS64N EPCS64 phl programmer EPLD EPCS16 PDF

    PCN0904

    Abstract: EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N
    Text: Revision: 1.2.0 PROCESS CHANGE NOTIFICATION PCN0904 Cyclone III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change Change Description This is an update to PCN0904, please see revision history table for information specific to this


    Original     		PCN0904 65-nm 60-nm PCN0904, EU-REP3C16U484I7N EP3C10E144C7 EP3C10E144C7N EP3C10E144C8 PCN0904 EP3C16Q240C8N EP3C10E144C8N EP3C16F484C6 ep3C40F484C8N EP3C40F780I7N ep3c16 EP3C25F324C8N EP3C25E144I7N EP3C120F484I7N PDF

    PCN1002

    Abstract: EPF10K100ARI240-3 EPM9560ARI208-10 EPM7256SRI208-10N EPF10K30RI208-4N epm9560ri208-20 EPF10K20RI208-4 EPF10K30RI240-4N EPM7256SRI208-10 EPF10K20RC208-4
    Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION P CN1 0 0 2 Additional Assembly Source and Power Quad Flat Pack RQFP 208 and 240 Package Conversion Change Description Altera is introducing Amkor, Philippines (ATP) as an additional assembly source for the RQFP 208


    Original     		approximatelyEPM9560ARC208-10N EPM9560ARI208-10 EPM9560RC208-15 EPM9560RI208-20 EPF10K70RC240-2 EPF10K70RC240-2N EPF10K70RC240-3 EPF10K70RC240-3N EPF10K70RC240-4 EPF10K70RC240-4N PCN1002 EPF10K100ARI240-3 EPM9560ARI208-10 EPM7256SRI208-10N EPF10K30RI208-4N epm9560ri208-20 EPF10K20RI208-4 EPF10K30RI240-4N EPM7256SRI208-10 EPF10K20RC208-4 PDF

    ADV0812

    Abstract: ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F
    Text: Revision: 1.0.0 CUSTOMER ADVISORY ADV0812 ADDITIONAL PACKAGE OPTION FOR SELECTED STRATIX III FPGA DEVICES Description Altera will be introducing the Fine-Line BGA F1152 non-OPD on package decoupling 8-layer substrate design as an additional package option. The Stratix® III FBGA F1152 package is


    Original     		ADV0812 F1152 10-layer XZ0825T JESD46-C, ADV0812 ALTERA PART MARKING EP3SE110F1152C4N altera top marking DEVICE MARKING CODE table EP3SL110F1152C4N EP3SE260F1152C4N altera date code format XZ-082 EP3SE110F PDF

    eQFP 144 footprint

    Abstract: vhdl code for lcd display for DE2 altera
    Text: Adding New Design Components to the PROFINET IP AN-677 Application Note This application note shows how you can change the out-of-the-box PROFINET IP design so that it incorporates a UART interface that is implemented through the RS-232 port on the DE2-115 board from Terasic. The DE2-115 board is the main board


    Original     		AN-677 RS-232 DE2-115 eQFP 144 footprint vhdl code for lcd display for DE2 altera PDF

    PCN0414

    Abstract: EME-G700 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound
    Text: PROCESS CHANGE NOTIFICATION PCN0414 STANDARDIZED EME-G700 MOLD COMPOUND FOR TQFP PACKAGES Change Description: Altera will be standardizing on Sumikon EME-G700 series mold compound for the mold compound used in Altera’s Thin Quad Flat Pack TQFP packages. All


    Original     		PCN0414 EME-G700 PCN0414 SUMIKON EME-G700 G700 Sumikon EME-G700 datasheet mold compound EMEG700 Amkor mold compound Compound PDF

    PCN0903

    Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of


    Original     		PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type PDF

    PCN0415

    Abstract: HC100-XJ Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking
    Text: PROCESS CHANGE NOTIFICATION PCN0415 ADDITIONAL MOLD COMPOUND FOR FBGA PACKAGES FROM ASE MALAYSIA Change Description: The Nitto Denko HC100-XJ series mold compound is being added as an additional mold compound choice for Altera FineLine BGA® packages assembled at ASE Malaysia. This change does not affect form, fit or function.


    Original     		PCN0415 HC100-XJ HC100-XJAA PCN0415 Nitto Denko HC100-XJ Denko trace code altera HC100 HC100XJAA altera top marking nitto hc100 altera marking PDF

    PLCC 84 PINS

    Abstract: camtex trays MIL-I-8835A
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    PCN0901

    Abstract: ALTERA PART MARKING EP1C12F256C8EC EP1C6F256C8N EP1C12F256C8N altera top marking DEVICE MARKING CODE table EP1C12F324I7N EP1C12F256C8 EP1C12F324C8N
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0901 SUBSTRATE CHANGE FOR SELECTED FBGA PACKAGES Change Description This is an update to PCN0901; please see the revision history table for information specific to this update. Altera is implementing a substrate change on selected product lines assembled in the Fine-Line


    Original     		PCN0901 PCN0901; PCN0901 ALTERA PART MARKING EP1C12F256C8EC EP1C6F256C8N EP1C12F256C8N altera top marking DEVICE MARKING CODE table EP1C12F324I7N EP1C12F256C8 EP1C12F324C8N PDF

    MIL-I-8835A

    Abstract: camtex trays ND07071 camtex trays QFP nd r304 E20-02080-00 ITW Camtex ceramic QFP Package 100 lead exposed QFP 144 CAMTEX
    Text: January 1998, ver.3 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are now common on boards because of their density, size, and cost benefits. A few precautions, however, are necessary to protect these devices from


    Original     		PDF

    PCN0412

    Abstract: kyocera datecode IPC-9701 datasheet of BGAS DATE SHEET 9TH 10TH 0619 817A 9701 100C EP1S60 IPC 9701
    Text: PROCESS CHANGE NOTIFICATION PCN0412 Rev01 FINELINE BGA SUBSTRATE SECOND SOURCE KINSUS Change Description: Altera is adding the Kinsus substrate as an additional source for the FineLine BGA (FBGA) packages. The surface finish of the Kinsus substrate is electrolytic


    Original     		PCN0412 Rev01 kyocera datecode IPC-9701 datasheet of BGAS DATE SHEET 9TH 10TH 0619 817A 9701 100C EP1S60 IPC 9701 PDF

    camtex trays

    Abstract: MIL-I-8835A TQFP Shipping Trays exposed QFP 144 QFP Shipping Trays ND07071 MIL-B-81705C Drypacked Devices ND-1414-1 CAMTEX
    Text: Guidelines for Handling J-Lead & QFP Devices June 1996, ver. 2 Introduction Application Note 71 Surface-mount J-lead and quad flat pack QFP devices are currently in high demand. All device packages require protection during transportation and storage. To prevent damage to Altera J-lead and QFP


    Original     		PDF

    ADV0601

    Abstract: altera top marking EP1K100 altera marking Code epf10k30a altera EPM7032B PCL 27 EP1C12 EP1K10 EP20K30E EP20K60E
    Text: CUSTOMER ADVISORY ADV0601 Rev01 ADDITION OF ASSEMBLY PLANT FOR FBGA PACKAGES Change Description: Amkor, Philippines, will be added as an additional assembly source for Altera FineLine BGA® FBGA and Ultra FineLine BGA (UBGA) packages using BT-based substrates. This will not affect the current moisture rating for these packages. The current


    Original     		ADV0601 Rev01 EP20K60E EP1C12 EP1K10 EP1K100 EPF10K100E EPF10K10A EPF10K30A EP1K30 altera top marking EP1K100 altera marking Code epf10k30a altera EPM7032B PCL 27 EP1C12 EP1K10 EP20K30E EP20K60E PDF

    PCN0803

    Abstract: TI date code altera date code format marking ic 2008 EP1S60 stiffener ALTERA BGA packages PART MARKING date code marking stratix traceability FC1020
    Text: Revision: 1.0.0 PROCESS CHANGE NOTIFICATION PCN0803 PACKAGE-LID STIFFENER CHANGE FOR THE STRATIX FLIP-CHIP FAMILY Change Description Altera is introducing a dimension change to the package-lid stiffener for the Stratix FPGA flip-chip package. This effectively reduces the overall package height by approximately 0.2mm. This change


    Original     		PCN0803 J-STD-020C) JESD46-C, PCN0803 TI date code altera date code format marking ic 2008 EP1S60 stiffener ALTERA BGA packages PART MARKING date code marking stratix traceability FC1020 PDF

    PCN1205

    Abstract: EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3
    Text: Revision: 1.3.0 PROCESS CHANGE NOTIFICATION P C N1 2 0 5 ADDITIONAL ASSEMBLY SOURCE ASE AND TRANSITION TO CENTER PIN GATE MOLD FOR FBGA PACKAGES Change Description This is an update to PCN1205; please see the revision history table for information specific to this


    Original     		PCN1205; Reco0HF35I4 EP4SGX230HF35I4N EP4SGXHF35I3* EP4SGXKH40I3* EP4SGXKH40I3N* EP4SH40C2N* EP4SGF45I3* EP4SGX290NF45C2 PCN1205 EP3C120F780I7N EP4CE30F29I8LN EP4CGX50CF23C8 EP2SGX125GF1508C4 EP3C16F484C8N EP4SGF45I3 PDF

    PCN0715

    Abstract: ABF-SH9K ABF-GX3 altera date code altera SOP top marking kyocera date code marking ic 2008 EP1S60 ALTERA 484 BGA packages PART MARKING
    Text: Revision: 1.1.1 PROCESS CHANGE NOTIFICATION PCN0715 ALTERNATE KYOCERA SUBSTRATE FOR FLIP-CHIP PACKAGES Change Description This is an update to PCN0715, published Oct 2007. Altera is introducing an alternate Kyocera substrate as an additional source for the Stratix FPGA Flip-Chip packages. This change is being


    Original     		PCN0715 PCN0715, JESD46-C, PCN0715 ABF-SH9K ABF-GX3 altera date code altera SOP top marking kyocera date code marking ic 2008 EP1S60 ALTERA 484 BGA packages PART MARKING PDF

    PCN0515

    Abstract: sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC
    Text: PROCESS CHANGE NOTIFICATION PCN0515 MOLD COMPOUND CHANGE FOR FBGA PACKAGES Change Description: Altera is adopting the Sumitomo G770 series mold compound as the standard mold material on Altera FineLine BGA® FBGA device packages. Devices in FBGA packages currently


    Original     		PCN0515 HC-100 UL-94 1x1011 PCN0515 sumitomo G770 G770* sumitomo G770 mold compound G770 sumitomo Unbiased HAST 130, 85 RH, 100 Hrs G770 G770* G770 mold compound Sumitomo 1000 thermal conductivity of sumitomo g770 G770 HC PDF

    PCN0902

    Abstract: HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA
    Text: Revision: 1.1.0 PROCESS CHANGE NOTIFICATION PCN0902 ADDITIONAL ASSEMBLY SOURCE AND BILL OF MATERIAL CHANGE FOR ALTERA FLIP CHIP PRODUCTS Change Description This is an update to PCN0902; please see the revision history table for information specific to this


    Original     		PCN0902 PCN0902; PCN0902 HC220F780NAK HC220F672nan HC210F484NAC XZ-092 HC230F1020BN HC240F1020NBC HC230F1020AW EP2S60F1020C4N EP2SGXF1152AA PDF

    Untitled

    Abstract: No abstract text available
    Text: Errata Sheet for Arria V GX and GT Devices ES-01036-2.0 Errata Sheet This errata sheet provides information about known device issues affecting Arria V production devices. Device Errata for Arria V Production Devices Table 1 lists the specific device issues and the affected Arria V production devices.


    Original     		ES-01036-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Errata Sheet for Arria V GX and GT Devices ES-01036-2.3 Errata Sheet This errata sheet provides information about known device issues affecting Arria V production devices. Device Errata for Arria V Production Devices Table 1 lists the specific device issues and the affected Arria V production devices.


    Original     		ES-01036-2 PDF