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    AMKOR TECHNOLOGY 1999 Search Results

    AMKOR TECHNOLOGY 1999 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CS-SATDRIVEX2-001 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-001 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 1m Datasheet
    CS-SATDRIVEX2-002 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-002 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 2m Datasheet
    CS-SATDRIVEX2-000.5 Amphenol Cables on Demand Amphenol CS-SATDRIVEX2-000.5 Serial ATA Extension Cable - SATA II Drive Extension Cable with Power (6.0 Gbps) 0.5m Datasheet
    CS-SASDDP8282-000.5 Amphenol Cables on Demand Amphenol CS-SASDDP8282-000.5 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 0.5m Datasheet
    CS-SASDDP8282-001 Amphenol Cables on Demand Amphenol CS-SASDDP8282-001 29 position SAS to SATA Drive Connector Dual Data Lanes Cable 1m Datasheet

    AMKOR TECHNOLOGY 1999 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    microleadframe amkor

    Abstract: TM0011
    Text: ᆅগॐࠓႊೌप‫ހ‬ጎ LFCSP ยऺᇑ዆ሰኸళ ፕኁǖGary Griffin ణ୤ ०঻ ०঻ . 1 ӱยऺ੊୯ . 2


    Original     		MO220 MO229 EM-2000-011) 737mm TM-00-11) AN05425-0-2/06 microleadframe amkor TM0011 PDF

    MTBF calculation

    Abstract: AT89C5131 T89C51CC02 JESD22-A110 TSS463 JESD22-A101 JESD22-A118 Q100 TS16949 AT89C5114
    Text: T89C51CC02 QualPack Qualification Package T89C51CC02 CAN Networking with FLASH 8-bit C51 T89C51CC02 OCTOBER 2003 Rev. 1 – 2003 October 1 T89C51CC02 QualPack 1 Table of contents 1 TABLE OF CONTENTS .2


    Original     		T89C51CC02 T89C51CC02 MTBF calculation AT89C5131 JESD22-A110 TSS463 JESD22-A101 JESD22-A118 Q100 TS16949 AT89C5114 PDF

    T89C51RD2 Marking

    Abstract: AT89C5114 AT89C5131 JESD22-A101 JESD22-A110 JESD22-A118 Q100 T89C5115 TS16949 flash "high temperature data retention" mechanism
    Text: T89C5115 QualPack Qualification Package T89C5115 Low Pin Count FLASH 8-bit C51 with ADC T89C5115 OCTOBER 2003 Rev. 1 – 2003 October 1 T89C5115 QualPack 1 Table of contents 1 TABLE OF CONTENTS .2


    Original     		T89C5115 T89C5115 T89C51RD2 Marking AT89C5114 AT89C5131 JESD22-A101 JESD22-A110 JESD22-A118 Q100 TS16949 flash "high temperature data retention" mechanism PDF

    maxim CODE TOP MARKING

    Abstract: Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code
    Text: Maxim > App Notes > 1-Wire Devices General Engineering Topics Keywords: flip, chip, scale, wafer, level, package, packages, packaging, wlp, ucsp, fchip, wlcsp, pb free, rohs, topmark, bump, die Apr 18, 2007 APPLICATION NOTE 4002 Understanding Flip-Chip and Chip-Scale Package Technologies and


    Original     		DS2482-101: DS2502: DS2762: com/an4002 AN4002, APP4002, Appnote4002, maxim CODE TOP MARKING Pb95Sn5 maxim TOP MARKING garrou wafer-level packaging has arrived Maxim ic date code ANALOG DEVICES ASSEMBLY DATE CODE philip IC marking Maxim date code DS2431 dALLAS MARKING CODE maxim assembly of code PDF

    AN-772

    Abstract: EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp
    Text: AN-772 Application Note One Technology Way • P.O. Box 9106 • Norwood, MA 02062-9106 • Tel: 781/329-4700 • Fax: 781/461-3113 • www.analog.com A Design and Manufacturing Guide for the Lead Frame Chip Scale Package LFCSP by Gary Griffin Table of Contents


    Original     		AN-772 EM-2000-011) TM-00-11) AN05425 AN-772 EM-99 C7025 IPC-SM-782 JESD51-5 MO220 MO-220 MO229 tssop 16 exposed pad stencil 20-lead lfcsp PDF

    Amkor Technology 1999

    Abstract: JESD51-1 QFN PACKAGE Junction to PCB thermal resistance JESD51-4 HFAN-08-1 AN569 JESD51-2 JESD51-3 SLMA002 thermal analysis on pcb
    Text: Application Note: HFAN-08.1 Rev.1; 04/08 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested


    Original     		HFAN-08 JESD51-7: JESD51-8: JESD51-9: JESD51-10: SZZA017A, Amkor Technology 1999 JESD51-1 QFN PACKAGE Junction to PCB thermal resistance JESD51-4 HFAN-08-1 AN569 JESD51-2 JESD51-3 SLMA002 thermal analysis on pcb PDF

    JESD51-1

    Abstract: "thermal via" QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance JESD51-3 SLMA002 AN569 JESD51-2
    Text: Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested


    Original     		HFAN-08 4hfan081 JESD51-7: JESD51-8: JESD51-9: JESD51-10: SZZA017A, JESD51-1 "thermal via" QFN "100 pin" PACKAGE thermal resistance QFN PACKAGE thermal resistance JESD51-3 SLMA002 AN569 JESD51-2 PDF

    QFN PACKAGE Junction to PCB thermal resistance

    Abstract: AN569 Motorola
    Text: Application Note: HFAN-08.1 Rev 0; 11/01 Thermal Considerations of QFN and Other Exposed-Paddle Packages Note: This application note is a summary and compilation of information based on the references mentioned at the end of this document. This information is neither tested


    Original     		HFAN-08 4hfan081 JESD51-5: JESD51-6: JESD51-7: JESD51-8: JESD51-9: JESD51-10: QFN PACKAGE Junction to PCB thermal resistance AN569 Motorola PDF

    LFCSP

    Abstract: TM0011 21502 5mm AN-772 IPC-SM-782 ipc-SM-782* LFCSP Ansys SN63 PB37 JESD51-5 MO220
    Text: AN-772 アプリケーション・ノート リード・フレーム・チップ・スケール・パッケージ（LFCSP）の設計および製造ガイド 著者：Gary Griffin 目次 はじめに このアプリケーション・ノートはリード・フレーム・チッ


    Original     		AN-772 MO220MO229 AN-617 EM-99-19 EM-99-03 EM-98-57 85mm8MLF3D EM-2000-011 7mm244 LFCSP TM0011 21502 5mm AN-772 IPC-SM-782 ipc-SM-782* LFCSP Ansys SN63 PB37 JESD51-5 MO220 PDF

    Motorola transistor smd marking codes

    Abstract: 7900801CA lm6482a 5962-8993001MIA replacement for 11c90 TRANSISTOR SMD MARKING CODE QA LM311 SMD JM38510/10305BEA LM714h Motorola semiconductor smd marking codes
    Text: N MILITARY / AEROSPACE DESIGN/PROCESS CHANGE NOTIFICATION PCN Nr: 1998 Listing GIDEP Nr: GIDEP Category: Issued: 01/06/98 TRB Nr: This is to advise you that a Design and/or Process Change will be made to the following MIL/AERO product s : Product ID (Description):


    Original     		PDF

    J-STD-013

    Abstract: AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based
    Text: 82559 Printed Circuit Board PCB Design Application Note (AP-399) Revision 1.0 January 1999 Order Number: 739073-001 Revision History Revision Date Revision Description Jan. 1999 1.0 First Release Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		AP-399) J-STD-013 AP-399 pad DIAGRAM for RJ45 on pc board Pulse bob smith termination electrical fast transient testing 82559 printed circuit board AD30 H1012 A5829-01 82559based PDF

    AN642

    Abstract: APP642 MAX104 MAX105 MAX106 MAX107 MAX108 circuitry interleaving introduction of demux
    Text: Maxim > App Notes > A/D and D/A Conversion/Sampling Circuits High-Speed Signal Processing Keywords: ultra fast, 8-bit, high-speed, data converters, analogue to digital, analog to digital, converter, ADCs, high dynamic, AC performance, GHz input bandwidth, interleaving, synchronizing, synchronized, demultiplexer, demux, reset,


    Original     		MAX104/6/8 MAX105: MAX106: MAX107: MAX108: com/an642 AN642, APP642, Appnote642, AN642 APP642 MAX104 MAX105 MAX106 MAX107 MAX108 circuitry interleaving introduction of demux PDF

    MAX104

    Abstract: MAX105 MAX106 MAX107 MAX108 introduction of demux AN-642
    Text: A/D and D/A CONVERSION/SAMPLING CIRCUITS HIGH-SPEED SIGNAL PROCESSING Application Note 642: Jan 22, 2001 Analog-to-Digital Converter Captures 1Gsps One of the industry's first ultra high-speed, 8-bit data converters with highest AC performance and a GHz input bandwidth, the MAX104/6/8 family of data converters offers both sampling speed and signal


    Original     		MAX104/6/8 MAX104 25LSB MAX104 com/an642 MAX104: MAX105: MAX106: MAX107: MAX105 MAX106 MAX107 MAX108 introduction of demux AN-642 PDF

    General Micro-electronics

    Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip
    Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director


    Original     		PDF

    JEDEC J-STD-020C

    Abstract: JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A
    Text: IPC/JEDEC J-STD-020C July 2004 Supersedes IPC/JEDEC J-STD-020B July 2002 JOINT INDUSTRY STANDARD Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices Notice IPC and JEDEC Standards and Publications are designed to serve the public


    Original     		J-STD-020C J-STD-020B 1-580987-46-X JEDEC J-STD-020C JESD47 Reliability Test Methods for Packaged Devices Infineon moisture sensitive package JESD-47 JESD22-A120 AMD reflow soldering profile BGA J-STD-035 semiconductors cross reference ipc-sm-786A PDF

    KLT20

    Abstract: k1648 klt22 KEL32 MC100 HEP64 KLT21 LP17 KEP32 HEP139
    Text: AND8002/D ECLinPS, ECLinPS Lite, ECLinPS Plus, ECLinPS MAX, and GigaComm Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and


    Original     		AND8002/D KLT20 k1648 klt22 KEL32 MC100 HEP64 KLT21 LP17 KEP32 HEP139 PDF

    HEL16

    Abstract: DEVICE MARKING CODE table onsemi marking marking code onsemi marking code onsemi Diode kel33 on semiconductor traceability marking soic HEL32 HEL12 HEL31 HEL05
    Text: AND8002/D ECLinPS, ECLinPS Lite, ECLinPS Plus, ECLinPS MAX, and GigaComm Marking and Ordering Information Guide http://onsemi.com APPLICATION NOTE Prepared by: Paul Shockman ON Semiconductor HFPD Applications Engineer Introduction This application note describes the device markings and


    Original     		AND8002/D HEL16 DEVICE MARKING CODE table onsemi marking marking code onsemi marking code onsemi Diode kel33 on semiconductor traceability marking soic HEL32 HEL12 HEL31 HEL05 PDF

    DC04 display

    Abstract: how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt
    Text: Quality And Reliability Report 2005 DC04-0001 Page 1 of 79


    Original     		DC04-0001 DC04 display how to test POWER MOSFET with digital multimeter tektronix 576 curve tracer VISHAY VT 300 WEIGHT INDICATOR TSMC 0.35Um FLUKE 79 manual THERMAL ELECTRIC COOLER hp 4274A 532 nm laser diode PHOTO TRANSISTOR ppt PDF

    EJTAG Tiny Tools CPLD

    Abstract: TSMC eDRAM ATML U 932 compaq presario ATML 932 Trident plus broadcom Siemens lg Ni1000 temperature sensor Photobit PB-100 irf 3502 SUN HOLD MD-5
    Text: SEMICONDUCTOR TIMES FEBRUARY 1999 FEBRUARY 1999 / 1 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES Radar Scope LTX announced that Accelerix has purchased and taken delivery of a Delta STE, configurable to 512 digital channels, mixed signal instruments and the memory test option. Accelerix, a fabless


    Original     		PDF

    74act3301

    Abstract: scl4412 75307 equivalent CD4015 jm38510/05101 DISCO DFG840 JM38510/33903BEA 74lvc3245 JM38510/05101BCA JM38510/34001BCA
    Text: N ENHANCED SOLUTIONS DESIGN/PROCESS CHANGE NOTIFICATION formerly Military & Aerospace Division PCN Nr: 1999 Listing GIDEP Nr: GIDEP Category: Issued: 01/05/99 TRB Nr: This is to advise you that a Design and/or Process Change will be made to the following High Reliability product(s):


    Original     		88961501HA 5962-8961501QXA DS26F31ME/883 DS26F31MJ/883 DS26F31MW/883 5962-7802302M2A 5962-7802302MEA 5962-7802302MFA DS26F32ME/883 DS26F32MJ/883 74act3301 scl4412 75307 equivalent CD4015 jm38510/05101 DISCO DFG840 JM38510/33903BEA 74lvc3245 JM38510/05101BCA JM38510/34001BCA PDF

    power amplifier ic ta2040

    Abstract: Nokia 6100 LCD TA2040 Transceiver Broadcom 3G RF interfacing 8051 with bluetooth modem Tripath TA2040 AMPLIFIER pixelworks L7205 tft interface with 8051 trw radar ac
    Text: SEMICONDUCTOR TIMES JULY 2000 / 1 JULY 2000 FOCUSED ON EMERGING SEMICONDUCTOR COMPANIES Radar Scope Bay Microsystems Bay Microsystems was recently founded to develop chips. What kind? The company wouldn’t disclose any details to us. One rumor is “high-speed interfaces” whatever


    Original     		PDF

    EPM7128SLC84-15

    Abstract: EPF10K10LC84-4 EPM7064SLC44-10 ALTERA MAX 5000 programming vhdl code for booth encoder PLMQ7192/256-160NC bga 208 PACKAGE EPM7160 Transition EPF10K70RC240-4 teradyne flex
    Text: Newsletter for Altera Customers ◆ Third Quarter ◆ August 1997 Altera Ships the New, Low-Cost FLEX 6000 Family Altera recently began shipping the new, low-cost FLEX 6000 programmable logic device family, which offers die size and cost that are directly comparable to


    Original     		PDF

    tsmc 0.35um 2p4m cmos

    Abstract: K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC
    Text: Quality And Reliability Report 2004 Period Covered: 2003


    Original     		DC04-0001 tsmc 0.35um 2p4m cmos K2411 specification of scr 2p4m teradyne j750 tester manual 2p4m equivalent Z0853006PSC SCR 2P4M Z84C1510FEC DC04 display Z0853006VSC PDF

    Z0840004PSC

    Abstract: Z0853006PSC sumitomo crm1033b Sumitomo CRM 1033B Z84C008 z0840004 Z0847004PSC Z0843006PSC Z0843004PSC Z84C3006PEC
    Text: ZiLOG, Inc. 2H - Year 2002 Quality And Reliability Report ZAC03-0004 ZiLOG 2002Quality and Reliability Report Chapter Title and Subsection TABLE OF CONTENTS Chapter Title and Subsection Chapter 1 - ZiLOG’s Quality Culture Reliability And Quality Assurance Policy Statement………………………………. 1 - 1


    Original     		ZAC03-0004 2002Quality Z0840004PSC Z0853006PSC sumitomo crm1033b Sumitomo CRM 1033B Z84C008 z0840004 Z0847004PSC Z0843006PSC Z0843004PSC Z84C3006PEC PDF