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    PowerVR stencil

    Abstract: PowerVR PowerVR MBX ARM graphics AN4132 PowerVR tile MBX R-S per-pixel shading 3d graphics
    Text: Freescale Semiconductor Application Note Document Number: AN4132 Rev. 0, 05/2010 3D Math Overview and 3D Graphics Foundations by Multimedia Applications Division Freescale Semiconductor, Inc. Austin, TX This application note describes the basics of 3D graphics


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    AN4132 PowerVR stencil PowerVR PowerVR MBX ARM graphics AN4132 PowerVR tile MBX R-S per-pixel shading 3d graphics PDF

    sumitomo g770

    Abstract: G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo
    Text: Maxim > App Notes > 1-Wire devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electromechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment methods for the electro-mechanical SFN package


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    DS2431 1024-Bit DS2432 DS28E01-100 com/an4132 AN4132, APP4132, Appnote4132, sumitomo g770 G770* G770 mold compound Sumitomo 1000 JESD47E G770 mold compound G770* sumitomo G770 APP4132 Maxim date code DS2431 SUYIN 4 pin battery contact connector G770 sumitomo PDF

    sumitomo g770

    Abstract: SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING
    Text: Maxim > App Notes > 1-Wire Devices Keywords: SFN, attachment, IC package, 1-Wire, 1Wire, calibration, authentication, monitoring, accessory, consumable, electro-mechanical contact Nov 26, 2007 APPLICATION NOTE 4132 Attachment Methods for the Electro-Mechanical SFN Package


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    com/an4132 DS2431: DS2432: DS28E01-100: AN4132, APP4132, Appnote4132, sumitomo g770 SUYIN 4 pin battery contact connector G770 mold compound G600 mold compound G770* G770 mold compound Sumitomo 1000 G770* sumitomo SUYIN battery connector smt DS2431 SUYIN BATTERY CONNECTOR maxim CODE TOP MARKING PDF

    HC210

    Abstract: EP2S30 HC220 HC230 HC240 SSTL-18 PCI-x I/O
    Text: Using Legacy Integrated Static Data Path and Controller Megafunction with HardCopy II Structured ASICs Application Note 413 July 2007, ver 2.1 Introduction HardCopy II devices are low-cost, high-performance, 1.2-V, 90 nm structured ASICs with pinouts, densities, and architecture that


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