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    Text: ANLPS203 MIC45205-1/MIC45205-2 52-Lead H4QFN 8mm x 8mm Package Soldering Guidelines Introduction This document provides a simplified guideline focused on the solderability process for the MIC45205 power module. It is intended to assist with the PCB layout design and should be used in conjunction with the MIC45205


    Original     		PDF ANLPS203 MIC45205-1/MIC45205-2 52-Lead MIC45205 MIC45205