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79257-240
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch. |
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972-401C-G0H
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Amphenol Communications Solutions
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XCede HD2, 4-Pair, 8 Column, Open Wall, Thick Sidewall, Backplane Module, Vertical Header |
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79257-240HLF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch. |
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95157-240LF
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Amphenol Communications Solutions
|
BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 40 Positions, 2.54 mm (0.100in) Pitch. |
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55724-091LF
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Amphenol Communications Solutions
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200 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free |
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